公开(公告)号：KR1020110118899A

公开(公告)日：2011-11-02

申请号：KR1020100038289

申请日：2010-04-26

Applicant: 삼성전자주식회사

Inventor： 김수영 ,  이창호 ,  박수민

IPC: C09D179/08 ,  C09D177/00 ,  H01L21/56 ,  C08L79/08

CPC classification number: H01L21/02118 ,  C08G73/10 ,  C08G73/1085 ,  C08G73/22 ,  C09D179/08 ,  G03F7/0233 ,  G03F7/40 ,  H01L21/02282 ,  C08L79/08 ,  C09D177/00 ,  H01L21/56

Abstract: PURPOSE: A composition for forming a passivation layer is provided to ensure excellent thermal, chemical, and electrical properties and to effectively prevent the defects of a semiconductor device by forming a passivation layer. CONSTITUTION: A composition for forming a passivation layer comprises: 30-60 weight% of a mixed polymer resin formed by mixing polyamic acids with polyhydroxy amides; 3-10 weight% of a photoactive compound; 2-10 weight% of a cross-linking agent; and the remaining organic solvent. A method for preparing a passivation layer comprises the steps of: forming a coating layer(110) by applying the composition for forming a passivation layer to an object(100); forming a coating layer pattern by removing a part of the coating layer; and baking the coating layer pattern.

Abstract translation: 目的：提供用于形成钝化层的组合物，以确保优异的热，化学和电学性能，并通过形成钝化层有效地防止半导体器件的缺陷。 构成：用于形成钝化层的组合物包括：通过将聚酰胺酸与多羟基酰胺混合而形成的混合聚合物树脂的30-60重量％ 3-10重量％的光活性化合物; 2-10重量％的交联剂; 和剩余的有机溶剂。 制备钝化层的方法包括以下步骤：通过将用于形成钝化层的组合物施加到物体（100）上来形成涂层（110）; 通过去除一部分涂层形成涂层图案; 并烘烤涂层图案。