公开(公告)号：KR100634238B1

公开(公告)日：2006-10-16

申请号：KR1020050074256

申请日：2005-08-12

Applicant: 삼성전자주식회사

Inventor： 신나래 ,  김동한

IPC: H01L21/60

Abstract: A TAB(Tape Automated Bonding) tape for a TCP(Tape Carrier Package) is provided to prevent the generation of short between adjacent metal lines by distributing the stress converged to a connection portion between first and second leads using a predetermined hole structure. A base film has a chip mounting region for loading a semiconductor chip. A metal line pattern is formed on the base film. The metal line pattern is composed of a plurality of first leads(130), a plurality of second leads(140) and a plurality of connection portions(150) for connecting the first and second leads with each other. A first hole(160) for exposing the base film to the outside is formed on the shortest connection portion and the second lead connected with the shortest connection portion. A second hole is formed at a predetermined portion adjacent to a boundary between the shortest connection portion and the first lead connected with the shortest connection portion.

Abstract translation: 提供用于TCP（带载封装）的TAB（带式自动接合）带，以通过使用预定的孔结构分布会聚到第一和第二引线之间的连接部分的应力来防止在相邻金属线之间产生短路。 基膜具有用于装载半导体芯片的芯片安装区域。 在基膜上形成金属线图案。 金属线图案由多个第一引线（130），多个第二引线（140）以及用于将第一引线和第二引线彼此连接的多个连接部（150）组成。 在最短连接部分和与最短连接部分连接的第二引线上形成用于将基膜暴露到外部的第一孔（160）。 第二孔形成在与最短连接部分和与最短连接部分连接的第一引线之间的边界相邻的预定部分处。