Abstract:
The present invention relates to a polyamide resin that is obtained by copolymerizing: (A) a dicarboxylic acid component including (a1) an aromatic dicarboxylic acid component; and (B) a diamine component including (b1) 75 to 85 mol% of an aliphatic diamine component and (b2) 15 to 25 mol% of toluene diamine. The polyamide resin according to the present invention has a repeating structure of a dicarboxylic acid part derived from the dicarboxylic acid component (A) and a diamine part derived from the diamine component (B). The polyamide resin has excellent processability, heat-resistance, and dimensional stability.
Abstract:
PURPOSE: A polyamide resin is provided to have excellent refractivity, excellent moldability, and melt processability. CONSTITUTION: A polyamide resin is formed by polymerization of an aromatic dicarboxylic acid, aliphatic linear diamine, and alicyclic diamine. The amount of the alicyclic diamine is 15-35 mol% with regard to 100 mol% of the sum of the aromatic dicarboxylic acid and aliphatic linear diamine. The glass transition temperature of the polyamide resin is 140 °C or more. The polyamide resin is a semi-crystalline-shaped resin. The glass transition temperature of the polyamide resin is 150 °C or more. The ratio of the melting temperature of the polyamide resin with regard to the glass transition temperature is 1.9-2.3.
Abstract:
PURPOSE: A modified polyamide-based resin is provided to have excellent heat resistance, moldability, and whiteness, and to have low moisture absorption rate. CONSTITUTION: A modified polyamide-based resin includes a repeating unit derived from a dicarboxylic acid represented by chemical formula 1; and a repeating unit derived from an aliphatic saturated diamine represented by chemical formula 2. The repeating unit derived from the aliphatic saturated diamine has a carbon number different from a repeating unit derived from C2-6 aliphatic saturated diamine and a repeating unit derived from the C2-6 aliphatic saturated diamine, and includes C6-12 aliphatic saturated diamine.
Abstract:
본 발명에 따른 저광 특성이 우수한 내후성 열가소성 수지는 (메타)아크릴산 알킬 에스테르계 중합체(A), 폴리우레탄 예비중합체(B) 및 방향족 비닐-시안화 비닐계 공중합체(C)를 포함하며, 상기 (메타)아크릴산 알킬 에스테르계 중합체(A)와 폴리우레탄 예비중합체(B)는 우레탄 결합에 의해 연결되어 분산상을 이루고, 상기 방향족 비닐-시안화 비닐계 공중합체(C)는 연속상을 이룸으로서, 상기 열가소성 수지는 내후성, 내충격성, 내열성, 박리특성 등이 우수할 뿐만 아니라 뛰어난 저광 특성을 갖는다. 저광 특성, 내후성, 열가소성 수지, 네트워크 형상, 분산상
Abstract:
PURPOSE: A polyamide resin is provided to enhance physical properties including heat resistance, mechanical strength, and brightness, thereby being suitable for a plastic joint among auto parts. CONSTITUTION: A polyamide resin is a polymer of dicarboxylic acid and an aliphatic diamine. The aliphatic diamine comprises one or more of aliphatic diamine monomers which is selected from an aliphatic diamine having 4,6,8, and 10 carbon numbers and one or more of aliphatic diamine monomers selected from aliphatic diamine having 12, 14, 16 and 18 carbon numbers. The aliphatic diamine monomers are included 0.1-70 mol% among whole aliphatic diamine components. A ratio of total moles of aliphatic diamine monomer(a1) and aliphatic diamine monomer(a2) to total moles of diamine monomers is 0.90-1.30.
Abstract:
본 발명의 예비중합체 입자의 제조방법은 용액상의 예비중합체를 아래에서 위로 분사하여, 상기 용액상의 예비중합체로부터 용매를 제거하고 예비중합체 입자를 형성하는 단계를 포함하는 것을 특징으로 한다. 상기 예비중합체 입자의 제조방법은 상향식(bottom-up type) 플래시(flash) 방법을 적용하여 고상중합에 사용 가능한 예비중합체 입자를 제조할 수 있다.
Abstract:
본 발명의 폴리아미드에스테르 수지는 디카르복실산; 디아민; 및 선형 지방족 디올;의 중합체이며, 상기 선형 지방족 디올의 함량은 상기 디아민 100 몰부에 대하여, 1 내지 25 몰부이고, 용융 온도(Tm)가 280 내지 320℃이고, 결정화 온도(Tc)가 260 내지 290℃인 것을 특징으로 한다. 상기 폴리아미드에스테르 수지는 내열성, 내변색성 및 성형성이 우수하다.
Abstract:
A polyamide ester resin of the present invention has a structure whereby a dicarboxylic acid part induced from a dicarboxylic acid ingredient (A), a diamine ingredient part induced from a diamine ingredient (B), and a cycloaliphatic diol part induced from a cycloaliphatic diol ingredient (C) are repeated by copolymerizing the dicarboxylic acid ingredient (A), the diamine ingredient (B) and the cycloaliphatic diol ingredient (C). A mole ratio ((B):(C)) of the diamine ingredient (B) and the cycloaliphatic diol ingredient (C) is 80-99:1-20. A melting temperature (Tm) is 280-320°C, and a crystallization temperature (Tc) is 260-290°C. The crystalline polyamide ester resin has excellent heat resistance, discoloration resistance, and formability.