Abstract:
본 발명은 액정배향막용 폴리이미드-폴리아믹산 공중합체에 관한 것으로, 보다 상세하게는 지환족 산이무수물을 적정비율 이상 포함하는 산이무수물과 이미드 고리 함유 측쇄기를 갖는 방향족 디아민을 적정비율 이상 포함하는 방향족 디아민류를 용액중합하여 제조된 하기 화학식 1로 표시되는 폴리이미드-폴리아믹산 공중합체에 관한 것이다. 본 발명에 의하면, 이미드 고리를 측쇄기로 갖게 되어 내열성과 표면강도 특성 등의 기계적특성, 전압보전율 및 잔류 DC등의 전기특성, 투명성, 공정성 및 액정의 수직 배향성이 우수한 폴리이미드 막을 제조할 수 있다. [화학식 1]
상기 식에서, m 및 n은 각각 1 내지 300의 정수이고, m:n이 9/1 내지 1/9이며, R 1 은 4가의 지환족 유기기로서, 테트라카르복실산 및 그 유도체를 구성하고, R 3 은 4가의 방향족 또는 지환족 유기기로서, 테트라카르복실산 및 그 유도체를 구성하며, R 2 및 R 4 는 각각 2가의 방향족 또는 지방족 유기기로서, 적어도 하나는 하기 화학식 2로 표시되는 2가의 유기기를 반드시 포함한다. [화학식 2]
상기 식에서, A는 수소 또는 탄소수 1~ 30개, 수소 또는 불소수 1~ 61개를 갖는다. 이미드 고리, 폴리이미드-폴리아믹산, 액정, 배향성, 인쇄성, 잔상
Abstract:
본 발명은 트리아진기를 포함한 디아민 화합물, 그로부터 제조된 폴리아믹산 및 액정 배향막에 관한 것으로, 보다 상세하게는 특정 구조의 트리아진기를 포함한 디아민 화합물, 상기 디아민화합물을 포함한 디아민 및 산이무수물을 반응시켜 수득한 폴리아믹산, 및 상기 폴리아믹산을 이미드화시켜 수득한 액정 배향막에 관한 것이다. 본 발명에 따라 제조된 액정 배향막은 고내열성, 가시광선 영역에서의 고투과성, 우수한 배향특성 및 높은 전압보전율을 가지며, 넓은 범위에서의 선경사각조절이 용이하다.
Abstract:
본 발명은 신규한 기능성 디아민 및 이를 사용하여 제조된 액정 배향막에 관한 것으로, 보다 상세하게는 상기 기능성 디아민, 방향족 고리형 디아민, 지방족 고리형 산이무수물 및 방향족 고리형 산이무수물을 이용하여 폴리아믹산을 제조하여 고내열성, 가시광선 영역에서의 고투과성, 우수한 배향특성 및 높은 전압보전율을 가지며, 선경사각의 조절이 용이한 액정 배향막을 제공한다.
Abstract:
PURPOSE: Diamine containing triazine group, polyamic acid synthesized therefrom, and a liquid crystal alignment layer prepared by the same polyamic acid are provided, which liquid crystal alignment layer has high thermostability, high penetration within a region of visible light, improved alignment property and high voltage preserving rate, and easily controls pretilt angle in the wide range. CONSTITUTION: The diamine containing triazine group represented by formula (1) is provided, wherein A is direct binding, or -O- or -COO-; B is direct binding, or -O-, -COO-, -CONH- or -OCO-; C is C1-C30 linear, branched, cyclic or a mixture thereof organic group. The polyamic acid is prepared by reacting diamine with acid dianhydride, and has the repeat unit of formula (2), wherein x is four-valent aromatic or aliphatic cyclic organic group; z is divalent organic group derived from diamine of formula (1), or divalent organic group derived from a compound of formula (3) of H2N-Y-NH2 or formula (4); R1, R2, R3 and R4 are independently C1-C10 alkyl, alkoxy or aryl; and R5 and R6 are independently C1 to C10 alkylene. The liquid crystal alignment layer is prepared by coating a substrate with a liquid crystal alignment treating agent containing the polyamic acid solution, and total or partial amidation of the substrate.
Abstract:
PURPOSE: An acid liable polyamide polymer and a photosensitive heat resisting insulator composition containing the polymer are provided, which are improved in the photosensitivity, the resolution, the mechanical properties and the flatness of coating. CONSTITUTION: The acid liable polyamide polymer has a repeating unit represented by the formula 1, and contains an acetal or carbonate side group as an acid liable group and a terminal group containing an acetylene group, wherein Ar1 is a tetravalent aromatic group; Ar2 is a divalent aromatic group; R1 and R2 are the same or different each other and are an acid liable group comprising carbonate or acetal; T1 and T2 are the same or different each other and are a terminal group comprising acetylene group; and m and n are an integer of 5-100, respectively. The acid liable polyamide polymer can be a homopolymer or a copolymer according to the combination of Ar1 and Ar2. The photosensitive heat resisting insulator composition comprises the polyamide polymer; and 0.3-15 wt% of a photoacid generator.
Abstract:
PURPOSE: Provided is a polyimide resin produced by using new functional diamine monomers, which is used as a liquid crystal alignment film and excellent in photo-permeability and liquid crystal alignment. CONSTITUTION: The polyimide resin is produced by reacting dioxy tetrahydro furan-3-methyl cyclo hexane-1,2-dicarboxylic dianhydride, at least one diamine selected from the diamine group represented by the formula 1, and at least one diamine selected from the diamine group represented by the formula 2 to produce polyamic acid and then imidating the polyamic acid. The polyimide resin has an intrinsic viscosity of 0.5-1.5dL/g(measured at the concentration of 0.5g/dL in NMP solution and 30deg.C), a glass transition temperature of 230-350deg.C, and a stand inclination angle of 1-15 degree. In the formula, X is hydrogen atom or -O2CR, -CO2R, -NRR', -CONRR', -NCOR, -OCO2R, -OR, or -R, n and m are each an integer of 1-16, wherein R and R' are each hydrogen atom, C1-C18 aliphatic or aromatic hydrocarbon.
Abstract:
PURPOSE: Provided is a polyimide resin excellent in printability, light penetration and liquid crystal orientation by using novel functional diamine monomer capable of improving a property of polyimide resin. CONSTITUTION: The polyimide resin is produced by the steps of (i) reacting dioxytetrahydrofuran-3-methylcyclohexane-1,2-dicarboxylic acid dihydride, at least one of diamine selected from the diamine group represented by formula 1, and at least one of diamine selected the diamine group represented by formula 2 to form a polyamic acid, and (ii) amidating the polyamic acid to form a polyimide resin. In the formulae, X represents hydrogen atom, each of R and R' is hydrogen atom, -O2CR, -CO2R, -NRR', -CONRR', -NCOR, -OCO2R, -OR, or -R which are aliphatic or aromatic hydrocarbon of C1-C18, R1 represents hydrocarbon of C6-C18, and each of n and m is an integer of 1-16.
Abstract:
PURPOSE: Provided is a process for producing a polyimide composition used for an insulation-protecting membrane for a semiconductor, which reduces facilities, shortens reaction time and controls viscosity easily, and thus the produced polyimide composition is excellent in heat resistance and mechanical properties and electrical properties. CONSTITUTION: The process comprises the steps of: adding tetracarboxylic dianhydride to an organic solvent; dissolving 60-99.99mol% of aromatic diamine and 40-0.01mol% of diamine siloxane in an organic solvent to prepare a diamine solution; adding the diamine solution to the tetracarboxylic dianhydride solution at a temperature of 0-40deg.C and a dropping speed of 5-150 minutes.
Abstract:
PURPOSE: Provided is a polyamic acid resin composition which has improved smoothness, printability, and liquid crystal orientation and is cured at low temperature. CONSTITUTION: The polyamic acid resin composition comprises 2-40 wt% of polyamic acid prepared by solution polymerizing diamine and tetracarboxylic acid dihydride; and 60-98 wt% of solvent represented by formula 1, wherein R1 is an alkyl group of C1-C10 comprising at least one hydroxyl group. and R2 is an alkyl group of C1-C10, which may be substituted with at least one of hydroxyl group and ketone group. The solvent of formula 1 is 3-acetyl-1-propanol, 4-hydroxy-4-methyl-2-pentanone, 3-hydroxy-3-methyl-2-butanone, or 1-hydroxy-2-butanone.