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公开(公告)号：KR1020030049964A
公开(公告)日：2003-06-25
申请号：KR1020010080317
申请日：2001-12-17
Applicant: 조수제
Inventor： 조수제
IPC: H05B33/10
CPC classification number: H01L51/0011 , C23C14/042 , G03F7/09 , H01L51/001
Abstract: PURPOSE: A method is provided to be capable of improving a mask life by preventing a variation due to a thermal variation of a deposition mask when fabricating a plurality of devices on a large-scale substrate. CONSTITUTION: A metal seed layer is formed on a glass substrate(4-1), and a photosensitive resin pattern(4-4) corresponding to a mask part of each device is formed on the metal seed layer by a photolithography process. The mask of each device is grown by performing an electroplating process in a resultant resin pattern(4-5) and simultaneously the photosensitive resin pattern is removed by a solvent(4-6). A frame is formed by etching a lower glass substrate of a pattern part so that an outer part of the mask of each device is fixed. An opening part of each device is formed after removing an exposed metal seed layer(4-8,4-8*). The metal seed layer consists of a two-layer structure which is made of chromium(4-2) and copper(4-3).
Abstract translation: 目的：提供一种能够通过在大型基板上制造多个器件时防止由于沉积掩模的热变化引起的变化而提高掩模寿命的方法。 构成：在玻璃基板（4-1）上形成金属种子层，通过光刻工序在金属种子层上形成与各装置的掩模部对应的感光性树脂图案（4-4）。 通过在所得到的树脂图案（4-5）中进行电镀处理，同时通过溶剂（4-6）除去感光性树脂图案，来生长每个器件的掩模。 通过蚀刻图案部分的下玻璃基板形成框架，使得每个装置的掩模的外部部分被固定。 在去除暴露的金属种子层（4-8,4-8 *）之后，形成每个器件的开口部分。 金属种子层由铬（4-2）和铜（4-3）制成的双层结构组成。
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公开(公告)号：KR100387100B1
公开(公告)日：2003-06-12
申请号：KR1020000069383
申请日：2000-11-21
Applicant: 조수제
Inventor： 조수제
IPC: B81C1/00
Abstract: PURPOSE: A photosensitive glass processing method is provided to obtain a high precision fine structure by crystallizing the portion which is not exposed to an ultraviolet light and selectively etching the crystallized portion. CONSTITUTION: A photosensitive glass processing method comprises a first step of selectively radiating an ultraviolet light(9) generated from a light source to a photosensitive glass(8); a second step of crystallizing a portion(11) which is not exposed to the ultraviolet light by performing a heat treatment to the portion; and a third step of obtaining a fine structure(14) by selectively removing the crystallized portion through an etching process(13) by dipping the resultant structure into a hydrogen fluoride(HF) solution.
Abstract translation: 目的：提供一种光敏玻璃处理方法，通过使未暴露于紫外光的部分结晶并选择性地蚀刻结晶部分来获得高精度的精细结构。 构成：一种光敏玻璃处理方法包括：第一步骤，将从光源产生的紫外光（9）选择性地辐射到光敏玻璃（8）上; 第二步骤，通过对所述部分进行热处理使未暴露于紫外光的部分（11）结晶; 以及第三步骤，通过将所得结构浸入氟化氢（HF）溶液中，通过蚀刻工艺（13）选择性地去除结晶部分来获得精细结构（14）。
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公开(公告)号：KR1020140133022A
公开(公告)日：2014-11-19
申请号：KR1020130052517
申请日：2013-05-09
IPC: H01L23/48
CPC classification number: H01L23/49827 , H01L21/486 , H01L23/15 , H01L23/5384 , H01L2924/0002 , H01L2924/00
Abstract: 본 발명의 실시예에 따른 인터포저 기판의 관통전극 형성 방법은 홀이 형성된 감광성 유리 기판을 마련하는 단계, 및 상기 홀에 용융금속을 충진하여 관통전극을 형성하는 단계를 포함한다.
Abstract translation: 本发明涉及一种用于制造插入器基板的通孔的方法和包括该插入器基板的半导体封装。 更具体地说，本发明涉及一种用于制造中介层基板的易于形成贯通孔的贯通孔的方法，以及包括该内插基板的半导体封装。 根据本发明实施例的用于制造内插衬底的通孔的方法包括制备具有孔的感光玻璃衬底的步骤; 以及通过用熔融金属填充孔而形成通孔的步骤。 根据本发明的实施例，感光性玻璃基板包括结晶感光性玻璃。
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Patent Agency Ranking
公开(公告)号：KR1020020060541A
公开(公告)日：2002-07-18
申请号：KR1020010001973
申请日：2001-01-11
Applicant: 조수제
Inventor： 조수제
IPC: H01L21/60
Abstract: PURPOSE: A micro ball array substrate and a manufacturing method thereof are provided to easily and simply transfer the ball to a semiconductor chip or a PCB by providing the ball array substrate capable of facing the micro ball of several tens micrometers while having a more precise shape. CONSTITUTION: A partially crystallized part(5-2) is formed within a glass by exposing and heat-treating a photosensitive glass(5-1). A metal thin film layer(5-3) is formed on the partially crystallized part. After coating a photosensitive resin, the entire thin film layer excepting a part(5-4) in which a hole is formed a hole is removed and the metal film(5-5) is grown. After growing the metal film to a desired thickness, the crystallized part, the photosensitive resin and the metal film are successively removed.
Abstract translation: 目的：提供一种微球阵列基板及其制造方法，通过提供能够面对几十微米的微球的球阵列基板，容易且简单地将球传递到半导体芯片或PCB，同时具有更精确的形状 。 构成：通过曝光和热处理感光玻璃（5-1）在玻璃内形成部分结晶的部分（5-2）。 在部分结晶的部分上形成金属薄膜层（5-3）。 在涂布感光性树脂之后，除去形成有孔的部分（5-4）之外的整个薄膜层，并且生长金属膜（5-5）。 在将金属膜生长到期望的厚度之后，连续地除去结晶部分，感光性树脂和金属膜。
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公开(公告)号：KR1020020039523A
公开(公告)日：2002-05-27
申请号：KR1020000069383
申请日：2000-11-21
Applicant: 조수제
Inventor： 조수제
IPC: B81C1/00
CPC classification number: B81C1/00198 , B81C1/00349 , B81C1/00436 , B81C1/00841 , B81C2201/0101
Abstract: PURPOSE: A photosensitive glass processing method is provided to obtain a high precision fine structure by crystallizing the portion which is not exposed to an ultraviolet light and selectively etching the crystallized portion. CONSTITUTION: A photosensitive glass processing method comprises a first step of selectively radiating an ultraviolet light(9) generated from a light source to a photosensitive glass(8); a second step of crystallizing a portion(11) which is not exposed to the ultraviolet light by performing a heat treatment to the portion; and a third step of obtaining a fine structure(14) by selectively removing the crystallized portion through an etching process(13) by dipping the resultant structure into a hydrogen fluoride(HF) solution.
Abstract translation: 目的：提供一种感光玻璃加工方法，通过使不暴露于紫外光的部分结晶并选择性地蚀刻结晶部分来获得高精度的精细结构。 构成：感光玻璃处理方法包括：将从光源产生的紫外光（9）选择性地辐射到感光玻璃（8）的第一步骤; 第二步骤，通过对所述部分进行热处理来结晶未暴露于紫外光的部分（11）; 以及通过将所得结构浸入氟化氢（HF）溶液中，通过蚀刻工艺（13）选择性地除去结晶部分来获得精细结构（14）的第三步骤。
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