High-temperature superconductor arrangement

    公开(公告)号:AU7181500A

    公开(公告)日:2001-06-07

    申请号:AU7181500

    申请日:2000-11-24

    Abstract: A high temperature superconductor arrangement comprises a high temperature superconductor (1) and an electrical bypass (2). The current flows in the main current direction (3) through the arrangement. A contact layer (4) is provided between the superconductor and the bypass, the layer having a low anisotropic electrical conductivity. An Independent claim is also included for the production of the high temperature superconductor arrangement comprising applying the contact layer to the superconductor in a co-sintering or post-sintering process, and then applying the bypass. Preferred Features: The contact layer does not completely cover the superconductor.

    HIGH-TEMPERATURE SUPERCONDUCTOR ARRANGEMENT

    公开(公告)号:CA2326058A1

    公开(公告)日:2001-06-02

    申请号:CA2326058

    申请日:2000-11-15

    Abstract: During the cooling of high-temperature superconductor arrangements in which a polymer- composite-based electrically conducting transitional layer 3 is provided between a superconductor 1 and an electrical bypass 2, thermomechanical stresses occur in said transitional layer. To reduce these and to prevent the formation of cracks, the coefficient of thermal expansion of the transitional layer 3 is reduced. This takes place by adding a suitable filling material 32, for example particles of Si02, Al2O3 or AIN, to the polymer composite material.

    29.
    发明专利
    未知

    公开(公告)号:DE19634424C2

    公开(公告)日:1998-07-02

    申请号:DE19634424

    申请日:1996-08-26

    Abstract: In a current limiter production process involving application of a high temperature superconductor (HTSC) starting material powder onto a silver layer (1) surface and then temperature and oxygen treatment to form the HTSC (3), the novelty is that (a), prior to applying the HTSC starting material powder, the opposite surface of the silver layer is placed on a powder layer which is chemically inert wrt. the hot HTSC; and (b) a mechanical stabilisation layer (4) is applied onto at least one main surface of the composite conductor (1, 3), after forming the HTSC (3). Also claimed is a current limiter having a composite conductor (1, 3) comprising a HTSC (3) in surface contact with a non-superconductive shunt resistor of a silver layer (1) parallel to the HTSC, the novelty being that (i) the HTSC (3) has a layer thickness (d3) of less than 500 (preferably less than 300) microns, the silver layer (1) has a layer thickness (d1) of less than 25 (preferably less than 10) microns and d1/d3 = less than 1/5, preferably less than 1/10; and (ii) at least one main face of the composite conductor (1, 3) is in surface contact with a mechanical stabilisation layer (4).

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