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    SEAMLESS EARBUD STRUCTURES AND METHODS FOR MAKING THE SAME
    21.
    发明申请
    SEAMLESS EARBUD STRUCTURES AND METHODS FOR MAKING THE SAME 审中-公开

    公开(公告)号：US20160142807A1

    公开(公告)日：2016-05-19

    申请号：US15006046

    申请日：2016-01-25

    Applicant: Apple Inc.

    Inventor： Jonathan S. Aase

    IPC: H04R1/10

    CPC classification number: H04R1/1016 ,  H04R1/1058 ,  H04R1/1066 ,  H04R1/1075 ,  H04R2201/105 ,  H04R2460/09 ,  H04R2460/11 ,  Y10T29/49176

    Abstract: Seamless earbud structures and methods for making the same are disclosed. Seamless earbud structures can be constructed using an insert molding construction method, which overmolds a cosmetic material over two sub-enclosures that are mated together. The two sub-enclosures form a housing that can encompass a driver assembly (e.g., woofer and tweeter), a conductor bundle, and provide one or more acoustic volumes. The housing has a non-occluding member and a neck member, and has a seamless or nearly seamless construction. The cosmetic material is insert molded around the housing to provide a smooth and seamless surface disposed around the periphery of the housing.

    CABLES WITH INTERTWINED JACKETS
    22.
    发明申请
    CABLES WITH INTERTWINED JACKETS 审中-公开
    带有夹克的电缆

    公开(公告)号：US20130292029A1

    公开(公告)日：2013-11-07

    申请号：US13893060

    申请日：2013-05-13

    Applicant: Apple Inc.

    Inventor： Jonathan S. Aase ,  Douglas Weber

    IPC: H01B13/00

    CPC classification number: H01B13/0013 ,  H01B13/16 ,  H04R1/1033

    Abstract: Fibers may be intertwined to form cables for headsets and other structures. The cables may include wires, The wires may be surrounded by a jacket formed. from intertwined fibers, The intertwined fibers may include fibers with different melting temperatures. The jacket may be heated to a temperature that is sufficient to melt some of the fibers in the jacket without melting other fibers in the jacket. The melted fibers may flow into spaces between the unmelted fibers and may serve as a binder that holds together the unmelted fibers. The intertwining process may be used to form a bifurcation for a headset. A dipping process may be used to cover the jacket with a coating. The coating may be formed over the entire length of the cable or may be formed in a particular portion of the cable such as the portion of the cable that includes the bifurcation.

    Abstract translation: 纤维可能交织在一起，以形成耳机和其他结构的电缆。 电缆可以包括电线。电线可以被形成的护套包围。 来自缠结的纤维，缠结的纤维可以包括具有不同熔融温度的纤维。 夹套可以被加热到足以熔化夹套中的一些纤维而不熔化夹套中的其它纤维的温度。 熔融的纤维可能流入未熔化的纤维之间的空间，并且可以用作将未熔化纤维保持在一起的粘合剂。 交织过程可用于形成耳机的分岔。 可以使用浸渍方法用涂层覆盖护套。 涂层可以形成在电缆的整个长度上，或者可以形成在电缆的特定部分中，例如包括分叉的电缆部分。

    EARPHONE HAVING A CONTROLLED ACOUSTIC LEAK PORT
    28.
    发明申请
    EARPHONE HAVING A CONTROLLED ACOUSTIC LEAK PORT 审中-公开

    公开(公告)号：US20200267470A1

    公开(公告)日：2020-08-20

    申请号：US16868372

    申请日：2020-05-06

    Applicant: Apple Inc.

    Inventor： Michael B. Howes ,  Yacine Azmi ,  Scott P. Porter ,  Jonathan S. Aase ,  Andrew P. Bright ,  Christopher R. Wilk

    IPC: H04R1/28 ,  H04R1/10 ,  H04R1/02

    Abstract: An earphone comprising an earphone housing having a wall comprising (1) a front side that joins (2) an end portion in which a primary sound output opening is formed, which joins (3) a face portion in which a secondary output opening is formed, which joins (4) a back side which joins the front side and encloses a driver, wherein the primary output opening is dimensioned to output sound generated by a diaphragm of the driver contained within the earphone housing into the ear and the secondary output opening is dimensioned to vent the ear to a surrounding environment, and wherein the primary output opening and the secondary output opening face different directions.

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