公开(公告)号：EP3913435A1

公开(公告)日：2021-11-24

申请号：EP20175361.3

申请日：2020-05-19

Applicant: ASML Netherlands B.V.

Inventor： SAHRAEIAN, Reza ,  BASTANI, Vahid ,  GKOROU, Dimitra ,  DOS SANTOS GUZELLA, Thiago

IPC: G03F7/20 ,  G06N5/04

Abstract: Apparatus and methods of configuring an imputer model for imputing a second parameter. The method comprises inputting a first data set comprising values of a first parameter to the imputer model, and evaluating the imputer model to obtain a second data set comprising imputed values of the second parameter. The method further comprises obtaining a third data set comprising measured values of a third parameter, wherein the third parameter is correlated to the second parameter; obtaining a prediction model configured to infer values of the third parameter based on inputting values of the second parameter; inputting the second data set to the prediction model, and evaluating the prediction model to obtain inferred values of the third parameter; and configuring the imputer model based on a comparison of the inferred values and the measured values of the third parameter.

公开(公告)号：EP3392711A1

公开(公告)日：2018-10-24

申请号：EP17167117.5

申请日：2017-04-19

Applicant: ASML Netherlands B.V.

Inventor： YPMA, Alexander ,  BASTANI, Vahid ,  SONNTAG, DAG ,  NIJE, Jelle ,  CEKLI, Hakki, Ergun ,  TSIROGIANNIS, Georgios ,  VAN WIJK, Robert Jan

IPC: G03F7/20

CPC classification number: G03F7/70616 ,  G03F7/70491

Abstract: A method of maintaining a set of fingerprints (316) representing variation of one or more process parameters across wafers, has the steps: (a) receiving measurement data (324) of one or more parameters measured on wafers; (b) updating (320) the set of fingerprints based on an expected evolution (322) of the one or more process parameters; and (c) evaluation of the updated set of fingerprints based on decomposition of the received measurement data in terms of the updated set of fingerprints. Each fingerprint may have a stored likelihood of occurrence (316), and the decomposition may involve: estimating, based the received measurement data (324), likelihoods of occurrence of the set of fingerprints in the received measurement data; and updating the stored likelihoods of occurrence based on the estimated likelihoods.

公开(公告)号：EP4427097A1

公开(公告)日：2024-09-11

申请号：EP22790548.6

申请日：2022-09-30

Applicant: ASML Netherlands B.V.

Inventor： BASTANI, Vahid ,  KNOPS, Raoul, Maarten, Simon ,  THEEUWES, Thomas ,  URBANCZYK, Adam, Jan ,  WILDENBERG, Jochem, Sebastiaan ,  VAN WIJK, Robert Jan

IPC: G03F7/20

CPC classification number: G03F7/705 ,  G03F7/70625

公开(公告)号：EP4399572A1

公开(公告)日：2024-07-17

申请号：EP22761995.4

申请日：2022-08-04

Applicant: ASML Netherlands B.V.

Inventor： BASTANI, Vahid ,  ZHANG, Yichen ,  DE ATHAYDE COSTA E SILVA, Marsil ,  DILLEN, Hermanus, Adrianus ,  VAN WIJK, Robert Jan

IPC: G03F7/20

CPC classification number: G03F7/70616 ,  G03F7/70525 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/705

公开(公告)号：EP4191337A1

公开(公告)日：2023-06-07

申请号：EP21211785.7

申请日：2021-12-01

Applicant: ASML Netherlands B.V.

Inventor： BASTANI, Vahid ,  ZHANG, Yichen ,  DE ATHAYDE COSTA E SILVA, Marsil ,  DILLEN, Hermanus Adrianus ,  VAN WIJK, Robert Jan

IPC: G03F7/20

Abstract: Disclosed is a method of determining a placement metric relating to placement of one or more features on a substrate in a lithographic process. The method comprises obtaining setup data comprising placement error contributor data relating to a plurality of placement error contributor parameters and yield data representative of yield and defining a statistical model for predicting a yield metric, the statistical model being based on a placement metric, the placement metric being a function of said placement error contributor parameters, and associated model coefficients. The model coefficients are fitted based on said setup data; and the placement metric determined from said fitted model coefficients.

公开(公告)号：EP4182967A1

公开(公告)日：2023-05-24

申请号：EP21734332.6

申请日：2021-06-21

Applicant: ASML Netherlands B.V.

Inventor： GKOROU, Dimitra ,  BASTANI, Vahid ,  SAHRAEIAN, Reza ,  TABERY, Cyrus, Emil

IPC: H01L21/66 ,  G03F7/20 ,  G05B19/418 ,  G05B23/02

公开(公告)号：EP4050328A1

公开(公告)日：2022-08-31

申请号：EP21159169.8

申请日：2021-02-25

Applicant: ASML Netherlands B.V.

Inventor： DOS SANTOS GUZELLA, Thiago ,  ISHIBASHI, Masashi ,  SANNO, Noriaki ,  BASTANI, Vahid ,  SAHRAEIAN, Reza ,  SAPUTRA, Putra

IPC: G01N21/956 ,  G03F7/20 ,  G05B19/418 ,  G06N20/00 ,  H01L21/66

Abstract: Described is a method for determining a spatially varying process offset for a lithographic process, the spatially varying process offset varying over a substrate subject to the lithographic process to form one or more structures thereon. The method comprises obtaining a trained model, having been trained to predict first metrology data based on second metrology data, wherein the first metrology data is spatially varying metrology data which relates to a first type of measurement of said structures being a measure of yield and said second metrology data is spatially varying metrology data which relates to a second type of measurement of said structures and correlates with said first metrology data; and using said model to obtain said spatially varying process offset.

公开(公告)号：EP3767392A1

公开(公告)日：2021-01-20

申请号：EP19186833.0

申请日：2019-07-17

Applicant: ASML Netherlands B.V.

Inventor： BASTANI, Vahid ,  SONNTAG, DAG ,  SAHRAEIAN, Reza ,  GKOROU, Dimitra

IPC: G03F7/20 ,  G05B19/418 ,  H01L21/66

Abstract: A method of determining the contribution of a process feature to the performance of a process of patterning substrates. The method may comprise obtaining (402) a first model trained on first process data and first performance data. One or more substrates may be identified (404) based on a quality of prediction of the first model when applied to process data associated with the one or more substrates. A second model may be trained (406) on second process data and second performance data associated with the identified one or more substrates. The second model may be used (408) to determine the contribution of a process feature of the second process data to the second performance data associated with the one or more substrates.