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    LITHOGRAPHIC APPARATUS, DEVICE MANUFACTURING METHOD AND ASSOCIATED DATA PROCESSING APPARATUS AND COMPUTER PROGRAM PRODUCT
    1.
    发明申请
    LITHOGRAPHIC APPARATUS, DEVICE MANUFACTURING METHOD AND ASSOCIATED DATA PROCESSING APPARATUS AND COMPUTER PROGRAM PRODUCT 审中-公开
    光刻设备，设备制造方法和相关的数据处理设备和计算机程序产品

    公开(公告)号：WO2017140532A1

    公开(公告)日：2017-08-24

    申请号：PCT/EP2017/052639

    申请日：2017-02-07

    Applicant: ASML NETHERLANDS B.V.

    Inventor： CEKLI, Hakki, Ergun ,  ISHIBASHI, Masashi ,  VAN DIJK, Leon, Paul ,  VAN HAREN, Richard, Johannes, Franciscus ,  LIU, Xing, Lan ,  JUNGBLUT, Reiner, Maria ,  AFFENTAUSCHEGG, Cedric, Marc ,  OTTEN, Ronald, Henricus, Johannes

    IPC: G03F9/00 ,  G03F7/20

    CPC classification number: G03F9/7034 ,  G03F7/70258 ,  G03F7/70633 ,  G03F7/70783 ,  G03F9/7011

    Abstract: A lithographic process includes clamping (CL) a substrate (W) onto a substrate support (WT), measuring (AS) positions of marks across the clamped substrate, and applying a pattern to the clamped using the positions measured. A correction (WCOR) is applied to the positioning of the applied pattern in localized regions of the substrate, based on recognition of a warp-induced characteristic (402, 404, 406) in the positions measured across the substrate. In one embodiment the correction is generated by firstly inferring one or more shape characteristics of the warped substrate (FFW) using the measured positions and other information (CDAT). Then, based on the inferred shape characteristics, a clamping model is applied (WCM) to simulate deformation of the warped substrate in response to clamping. Thirdly said correction (LCOR) is calculated based on the simulated deformation. Some or all of these steps may be integrated and/or implemented by a look-up table.

    Abstract translation: 光刻工艺包括将衬底（W）夹持（CL）到衬底支撑件（WT）上，测量横跨夹持衬底的标记位置（AS），以及使用图案将图案施加到被夹持的衬底 测量的位置。 基于识别穿过衬底测量的位置中的翘曲感应特性（402,404,406），将校正（WCOR）应用于在衬底的局部区域中定位施加的图案。 在一个实施例中，通过首先使用所测量的位置和其他信息（CDAT）推断扭曲基板（FFW）的一个或多个形状特征来生成校正。 然后，基于推断的形状特征，应用夹紧模型（WCM）来模拟响应于夹紧的翘曲基底的变形。 第三，所述校正（LCOR）是基于模拟变形计算的。 这些步骤中的一部分或全部可以通过查找表来集成和/或实现。

    METHOD OF OBTAINING MEASUREMENTS, APPARATUS FOR PERFORMING A PROCESS STEP AND METROLOGY APPARATUS
    4.
    发明申请
    METHOD OF OBTAINING MEASUREMENTS, APPARATUS FOR PERFORMING A PROCESS STEP AND METROLOGY APPARATUS 审中-公开
    获得测量值的方法，用于执行处理步骤和计量器具的装置

    公开(公告)号：WO2017194289A1

    公开(公告)日：2017-11-16

    申请号：PCT/EP2017/059474

    申请日：2017-04-21

    Applicant: ASML NETHERLANDS B.V.

    Inventor： CEKLI, Hakki, Ergun ,  ISHIBASHI, Masashi ,  VAN DE VEN, Wendy, Johanna, Martina ,  ROELOFS, Willem, Seine, Christian ,  MC NAMARA, Elliott, Gerard ,  RAHMAN, Rizvi ,  KUPERS, Michiel ,  SCHMITT-WEAVER, Emil, Peter ,  DELVIGNE, Erik, Henri, Adriaan

    IPC: G03F7/20 ,  G01N21/956 ,  G03F9/00 ,  H01L21/66

    Abstract: Measurements are obtained from locations across a substrate (W') before or after performing a lithographic process step. Examples of such measurements include alignment measurements made prior to applying a pattern to the substrate, and measurements of performance parameters such as overlay, after a pattern has been applied. A set of measurement locations (606, 606' or 606") is selected from among all possible measurement locations (302). At least a subset of the selected measurement locations are selected dynamically (202c), in response to measurements obtained using a preliminary selection (610) of measurement locations. Preliminary measurements of height can be used to select measurement locations for alignment. In another aspect of the disclosure, outlier measurements are detected based on supplementary data such as height measurements or historic data.

    Abstract translation: 在执行光刻工艺步骤之前或之后，从衬底上的位置（W'）获得测量结果。 这种测量的例子包括在将图案施加到基底之前进行对准测量，以及在施加图案之后测量性能参数，例如覆盖。 从所有可能的测量位置（302）中选择一组测量位置（606,606'或606“）。 响应于使用测量位置的初步选择（610）获得的测量，动态地选择所选测量位置的至少一个子集（202c）。 可以使用高度的初步测量来选择用于对准的测量位置。 在本公开的另一方面中，基于诸如高度测量或历史数据的补充数据来检测异常值测量。

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