公开(公告)号：EP2057672A1

公开(公告)日：2009-05-13

申请号：EP07841549.4

申请日：2007-08-29

Applicant: ATI Technologies ULC

Inventor： MCLELLAN, Neil ,  CHAN, Vincent ,  TOPACIO, Roden

IPC: H01L21/56 ,  H01L21/68

Abstract: A method of packaging a plurality of semiconductor chips comprises: providing a substrate panel having a first coefficient of thermal expansion (CTE); providing a carrier having a second CTE that is less than the first CTE; heating the substrate panel and the carrier to first and second elevated temperatures respectively; mounting the substrate panel at about the first elevated temperature to the carrier, the carrier being at said second elevated temperature, to provide a connection between the carrier and the substrate panel; and cooling the carrier and the substrate panel from the first and second elevated temperatures thereby putting the substrate panel into tension in at least one direction. A stiffener panel may be affixed to the substrate panel and heated to an elevated temperature and while the substrate panel is heated to an elevated temperature. A plurality of dies may be mounted and electrically connected to the substrate panel. Under-filling of the plurality of dies may occur with the stiffener panel affixed to the substrate panel.

Abstract translation: 包装多个半导体芯片的方法包括：提供具有第一热膨胀系数（CTE）的基板; 提供具有小于第一CTE的第二CTE的载体; 将基板和载体分别加热到第一和第二升高温度; 将所述基板面板在所述第一升高温度下安装到所述载体，所述载体处于所述第二升高温度，以在所述载体和所述基板面板之间提供连接; 以及从所述第一和第二升高的温度冷却所述载体和所述基板，从而使所述基板在至少一个方向上处于张力状态。 加强板可以固定到基板面板上并被加热到升高的温度，同时将基板面板加热到升高的温度。 多个管芯可以被安装并电连接到衬底面板。 多个模具的欠填充可以在加强板固定到基板上的情况下发生。