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公开(公告)号：US09423840B2
公开(公告)日：2016-08-23
申请号：US14945064
申请日：2015-11-18
Applicant: Apple Inc.
Inventor： Eugene A. Whang , Christopher J. Stringer , Brett W. Degner , David H. Narajowski , Patrick Kessler , Eric R. Prather , Caitlin Elizabeth Kalinowski , Adam T. Stagnaro , Daniel L McBroom , Matthew P. Casebolt , Michael D. McBroom
IPC: A47B77/08 , G06F1/20 , H05K7/20 , F21V8/00 , G06F1/18 , G08B5/36 , G08B21/18 , H05K5/03 , G06F3/00 , H05K1/02
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.
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公开(公告)号：US09285846B2
公开(公告)日：2016-03-15
申请号：US14297582
申请日：2014-06-05
Applicant: Apple Inc.
Inventor： Brett W. Degner , Eric R. Prather , David H. Narajowski , Frank F. Liang , Jay S. Nigen , Jesse T. Dybenko , Connor R. Duke , Eugene A. Whang , Christopher J. Stringer , Joshua D. Banko , Caitlin Elizabeth Kalinowski , Jonathan L. Berk , Matthew P. Casebolt , Kevin S. Fetterman , Eric J. Weirshauser
IPC: G06F1/20 , H05K7/20 , G06F1/18 , G08B5/36 , G08B21/18 , H05K5/03 , F21V8/00 , G06F3/00 , H05K1/02
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.
Abstract translation: 本申请描述了关于用于为具有小外形尺寸的轻便且耐用的小型计算系统提供有效散热的系统和方法的各种实施例。 紧凑型计算系统可以采用台式计算机的形式。 台式计算机可以包括具有形成在其中的集成支撑系统的整体式顶壳，该集成支撑系统提供结构支撑，其通过顶壳分布施加的载荷，从而防止翘曲和弯曲。 利用混流风扇有效地将冷却空气拉过小型计算系统。
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公开(公告)号：US20140362519A1
公开(公告)日：2014-12-11
申请号：US14297572
申请日：2014-06-05
Applicant: Apple Inc.
Inventor： Brett W. Degner , David H. Narajowski , Eric R. Prather , Mark K. Sin , Paul A. Baker , Eugene A. Whang , Christopher J. Stringer , Frank F. Liang
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.
Abstract translation: 描述了至少具有由外壳包围的中心芯片的桌面计算系统，所述外壳具有限定其中心芯所在的卷的形状。 壳体包括从第一开口轴向移位的第一开口和第二开口。 第一开口具有根据用作冷却内部部件的传热介质的气流量的尺寸和形状，第二开口由唇缘限定，该唇缘以一定的方式接合气流的一部分，使得至少一些 传递到来自内部部件的空气流的热量被传递到壳体。
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公开(公告)号：US20140361672A1
公开(公告)日：2014-12-11
申请号：US14297578
申请日：2014-06-05
Applicant: Apple Inc.
Inventor： Eugene A. Whang , Christopher J. Stringer , Brett W. Degner , David H. Narajowski , Patrick Kessler , Eric R. Prather , Caitlin Elizabeth Kalinowski , Adam T. Stagnaro , Daniel L. McBroom , Matthew P. Casebolt , Michael D. McBroom
IPC: G06F1/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.
Abstract translation: 描述了至少具有由外壳包围的中心芯片的桌面计算系统，所述外壳具有限定其中心芯所在的卷的形状。 壳体包括从第一开口轴向移位的第一开口和第二开口。 第一开口具有根据用作冷却内部部件的传热介质的气流量的尺寸和形状，第二开口由唇缘限定，该唇缘以一定的方式接合气流的一部分，使得至少一些 传递到来自内部部件的空气流的热量被传递到壳体。
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公开(公告)号：US11899509B2
公开(公告)日：2024-02-13
申请号：US17648653
申请日：2022-01-21
Applicant: Apple Inc.
Inventor： Eugene A Whang , Christopher J. Stringer , Brett W. Degner , David H. Narajowski , Patrick Kessler , Eric R. Prather , Caitlin Elizabeth Kalinowski , Adam T. Stagnaro , Daniel L. McBroom , Matthew P. Casebolt , Michael D. McBroom
IPC: H05K5/00 , G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18 , H04R1/02
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/001 , G02B6/0008 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H04R1/02 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/2039 , H05K7/2049 , H05K7/20136 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209
Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.
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Patent Agency Ranking
公开(公告)号：US11343931B2
公开(公告)日：2022-05-24
申请号：US16586745
申请日：2019-09-27
Applicant: Apple Inc.
Inventor： Brett W. Degner , Eric R. Prather , Michael E. Leclerc
Abstract: An electronic device can include a housing that defines an internal volume. The electronic device can also include a component within the internal volume that divides the internal volume into a first volume and a second volume. The first volume and second volume can be fluidically isolated except at an aperture defined by the component. An air-moving system can produce a positive air pressure in the first volume and a negative air pressure in the second volume.
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公开(公告)号：US20200379526A1
公开(公告)日：2020-12-03
申请号：US16586851
申请日：2019-09-27
Applicant: Apple Inc.
Inventor： Bart K. Andre , Edward J. Cooper , Brett W. Degner , Houtan R. Farahani , Steven A. Gerasimoff , William H. Greenbaum , James T. Handy , Daniel D. Hershey , PengYuan Huang , Eric A. Knopf , Richard D. Kosoglow , Mariel L. Lanas , Michael E. Leclerc , Michael D. McBroom , Rodrigo Dutervil Mubarak , David C. Parell , Sabrina K. Paseman , Eric R. Prather , Jacob W. Rutheiser , Christopher G. Siegel , Cheng-Han Yang , James M. Cuseo , Francesco Ferretti
Abstract: An electronic device can include a frame configured to receive and support an electronic component, a shell defining an internal volume sized to encompass the frame and the electronic component, the shell being slidably removable from the frame, the electronic component positioned within the internal volume and including an aperture, and a sealing member including a seal body and a compressible lip extending from the seal body, the sealing member at least partially surrounding the electronic component. The compressible lip is oriented such that the shell compresses the lip in a direction against the seal body at a first position adjacent to the electronic component and in the direction against the seal body at a second position adjacent to the electronic component opposite the first position.
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公开(公告)号：US10653034B2
公开(公告)日：2020-05-12
申请号：US16040083
申请日：2018-07-19
Applicant: Apple Inc.
Inventor： Eric R. Prather , Clark E. Waterfall , Reuben J. Williams , Vinh H. Diep
IPC: H05K7/20 , H01L23/427 , F28D15/02 , F28F1/12 , H01L23/467
Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.
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公开(公告)号：US10539984B2
公开(公告)日：2020-01-21
申请号：US15234629
申请日：2016-08-11
Applicant: Apple Inc.
Inventor： Eugene A. Whang , Christopher J. Stringer , Brett W. Degner , David H. Narajowski , Patrick Kessler , Eric R. Prather , Caitlin Elizabeth Kalinowski , Adam T. Stagnaro , Daniel L. McBroom , Matthew P. Casebolt , Michael D. McBroom
IPC: H05K5/00 , G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18 , H05K7/00 , H05K1/18
Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.
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公开(公告)号：US09913400B2
公开(公告)日：2018-03-06
申请号：US14721857
申请日：2015-05-26
Applicant: Apple Inc.
Inventor： Brett W. Degner , Eric R. Prather , David H. Narajowski , Frank F. Liang , Jay S. Nigen , Jesse T. Dybenko , Connor R. Duke , Eugene A. Whang , Christopher J. Stringer , Joshua D. Banko , Caitlin Elizabeth Kalinowski , Jonathan L. Berk , Matthew P. Casebolt , Kevin S. Fetterman , Eric J. Weirshauser
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.
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