公开(公告)号：US10244659B2

公开(公告)日：2019-03-26

申请号：US15712069

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： Daniel W. Jarvis ,  David A. Pakula ,  David J. Dunsmoor ,  Ian A. Spraggs ,  Lee E. Hooton ,  Marwan Rammah ,  Matthew D. Hill ,  Robert F. Meyer ,  James A. Bertin ,  Eric M. Bennett ,  Simon C. Helmore ,  Melissa A. Wah ,  Jon F. Housour ,  Douglas G. Fournier ,  Christopher S. Tomasetta

IPC: H05K7/20 ,  H05K1/02 ,  G06F3/041 ,  H01M2/10 ,  H05K1/14 ,  G06F1/16 ,  H01M2/08 ,  H02J7/00 ,  G06F3/044

Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.