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公开(公告)号:US20200278429A1
公开(公告)日:2020-09-03
申请号:US16877121
申请日:2020-05-18
Applicant: Apple Inc.
Inventor: Shingo Mandai , Cristiano L. Niclass
IPC: G01S7/4863 , G01J1/44 , G01S7/4865 , G01S17/10
Abstract: A single-photon avalanche diode (SPAD) detector includes a pixel array comprising multiple pixels and a memory operably connected to the pixel array. Each pixel includes a SPAD. Various techniques for accumulating signals received from the same SPAD over multiple scans and storing the accumulated signals in the memory are disclosed.
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公开(公告)号:US20200158837A1
公开(公告)日:2020-05-21
申请号:US16752653
申请日:2020-01-26
Applicant: Apple Inc.
Inventor: Anup K. Sharma , Arnaud Laflaquière , Gennadiy A. Agranov , Gershon Rosenblum , Shingo Mandai
IPC: G01S7/4865 , G01S7/4863 , G01S17/10 , G04F10/00 , G01S7/483 , H01L31/02 , G01S17/89 , G01S17/18
Abstract: A sensing device includes a first array of sensing elements, which output a signal indicative of a time of incidence of a single photon on the sensing element. A second array of processing circuits are coupled respectively to the sensing elements and comprise a gating generator, which variably sets a start time of the gating interval for each sensing element within each acquisition period, and a memory, which records the time of incidence of the single photon on each sensing element in each acquisition period. A controller sets, in each of at least some of the acquisition periods, different, respective gating intervals for different ones of the sensing elements.
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公开(公告)号:US20190018119A1
公开(公告)日:2019-01-17
申请号:US16034250
申请日:2018-07-12
Applicant: Apple Inc.
Inventor: Moshe Laifenfeld , Cristiano L. Niclass , Shingo Mandai , Tal Kaitz
Abstract: Disclosed herein are methods and devices for light emitting depth sensors such as scanning depth sensors and LIDARS. Methods, devices and systems disclose tracking a beam of reflected light pulses on an array of light sensing pixels. The tracking can dynamically update a location of the beam or an expected on-center time of the reflected light pulses at a pixel of the array. Counts of detected reflected pulses in time periods before and after the expected on-center time at a pixel are used to detect offsets in initial estimates of the beam location or timing.
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公开(公告)号:US20180090526A1
公开(公告)日:2018-03-29
申请号:US15713520
申请日:2017-09-22
Applicant: Apple Inc.
Inventor: Shingo Mandai , Cristiano L. Niclass , Nobuhiro Karasawa , Xiaofeng Fan , Arnaud Laflaquiere , Gennadiy A. Agranov
IPC: H01L27/146 , H04N5/378 , H04N5/369
CPC classification number: H01L27/14665 , G01S7/4861 , G01S7/4863 , H01L27/14603 , H01L27/14609 , H01L27/1461 , H01L27/14616 , H01L27/14623 , H01L27/14627 , H01L27/14629 , H01L27/1463 , H01L27/14632 , H01L27/14634 , H01L27/1464 , H01L27/14643 , H01L31/02027 , H01L31/03529 , H01L31/107 , H04N5/35572 , H04N5/3577 , H04N5/3698 , H04N5/37452 , H04N5/3765 , H04N5/378
Abstract: A back-illuminated single-photon avalanche diode (SPAD) image sensor includes a sensor wafer stacked vertically over a circuit wafer. The sensor wafer includes one or more SPAD regions, with each SPAD region including an anode gradient layer, a cathode region positioned adjacent to a front surface of the SPAD region, and an anode avalanche layer positioned over the cathode region. Each SPAD region is connected to a voltage supply and an output circuit in the circuit wafer through inter-wafer connectors. Deep trench isolation elements are used to provide electrical and optical isolation between SPAD regions.
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公开(公告)号:US20250054930A1
公开(公告)日:2025-02-13
申请号:US18778986
申请日:2024-07-21
Applicant: Apple Inc.
Inventor: Shingo Mandai , Cristiano L. Niclass , Pengfei Sun , Vyshakh Sanjeev
IPC: H01L25/16 , G01S17/34 , G02B6/12 , G02B6/42 , G02B6/43 , H01L23/00 , H01L27/144 , H01L31/02 , H01L31/0232 , H01L31/107 , H01S5/026 , H01S5/183
Abstract: An optoelectronic device includes a first semiconductor die, having first and second surfaces and including a first array of transceiver elements. Each transceiver element includes an optical transducer, which directs outgoing coherent optical radiation through the first surface toward a target and to receive incoming optical radiation that has been reflected from the target. A single-photon optical detector outputs electrical pulses in response to photons of the incoming optical radiation. A waveguide conveys the incoming optical radiation from the optical transducer to the single-photon optical detector. A second semiconductor die is bonded to the second surface of the first semiconductor die and includes a second array of logic circuits, which are coupled to receive and process the electrical pulses output by the single-photon optical detectors in corresponding ones of the transceiver elements.
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公开(公告)号:US12199197B2
公开(公告)日:2025-01-14
申请号:US17944738
申请日:2022-09-14
Applicant: Apple Inc.
Inventor: Shingo Mandai , Cristiano L. Niclass , Moshe Laifenfeld , Or Nahir , Vyshakh Sanjeev
IPC: H01L31/02 , H01L27/146 , H01L31/107 , H04N25/705 , H04N25/75 , H04N25/772
Abstract: A method of building a moving average histogram of photon times of arrival includes, for each time interval in first and second subsets of time intervals, latching a time reference corresponding to a time of receipt of an avalanche timing output signal of a single-photon avalanche diode (SPAD), and advancing a count stored at a memory address corresponding to the latched time reference. The memory address corresponds to a range of time references. The method further includes reading and clearing a first set of counts after the first subset of time intervals; phase-shifting the sequence of time references with respect to a set of memory addresses after the first subset of time intervals; reading and clearing a second set of counts after the second subset of time intervals; and building the moving average histogram using at least the first and second sets of counts.
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27.
公开(公告)号:US20230258785A1
公开(公告)日:2023-08-17
申请号:US18163063
申请日:2023-02-01
Applicant: Apple Inc.
Inventor: Shingo Mandai , Dong Zheng , Tong Chen , Cristiano L Niclass
IPC: G01S7/487 , G01S7/4863 , G01S17/88
CPC classification number: G01S7/4876 , G01S7/4863 , G01S7/4873 , G01S17/88
Abstract: An electronic device may include a proximity sensor under a cover layer. The proximity sensor may include a light-emitter, such as an infrared light source, and a light-detector, such as an array of single-photon avalanche diodes (SPADs). The SPADs may measure light that has reflected from an external object. However, some of the light may be reflected by the cover layer, creating cross-talk. To distinguish between the cross-talk and signals from the external object, processing circuitry may histogram measurements from the SPADs. In particular, the processing circuitry may histogram near-field and/or far-field measurements into different histograms. The measurements may be weighted and/or gated prior to histogramming. In this way, cross-talk may be distinguished from the near-field and far-field signals.
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公开(公告)号:US10438987B2
公开(公告)日:2019-10-08
申请号:US15713477
申请日:2017-09-22
Applicant: Apple Inc.
Inventor: Shingo Mandai , Cristiano L. Niclass , Nobuhiro Karasawa , Xiaofeng Fan , Arnaud Laflaquiere , Gennadiy A. Agranov
IPC: H01L27/146 , H04N5/355 , H04N5/3745 , G01S7/486 , H04N5/357 , H04N5/376 , H04N5/378 , H01L31/107 , H04N5/369 , H01L31/02 , H01L31/0352
Abstract: A back-illuminated single-photon avalanche diode (SPAD) image sensor includes a sensor wafer stacked vertically over a circuit wafer. The sensor wafer includes one or more SPAD regions, with each SPAD region including an anode gradient layer, a cathode region positioned adjacent to a front surface of the SPAD region, and an anode avalanche layer positioned over the cathode region. Each SPAD region is connected to a voltage supply and an output circuit in the circuit wafer through inter-wafer connectors. Deep trench isolation elements are used to provide electrical and optical isolation between SPAD regions.
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公开(公告)号:US09997551B2
公开(公告)日:2018-06-12
申请号:US14975790
申请日:2015-12-20
Applicant: Apple Inc.
Inventor: Shingo Mandai , Gennadiy A. Agranov , Matthew C. Waldon
IPC: H01L27/14 , H01L27/146 , H01L31/107 , G01S17/89 , G01S7/486 , G01S7/497
CPC classification number: H01L27/14609 , G01S7/4863 , G01S7/497 , G01S17/89 , H01L27/14641 , H01L27/14643 , H01L31/107
Abstract: A sensing device includes an array of sensing elements. Each sensing element includes a photodiode, including a p-n junction, and a local biasing circuit, coupled to reverse-bias the p-n junction at a bias voltage greater than a breakdown voltage of the p-n junction by a margin sufficient so that a single photon incident on the p-n junction triggers an avalanche pulse output from the sensing element. A bias control circuit is coupled to set the bias voltage in different ones of the sensing elements to different, respective values that are greater than the breakdown voltage.
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公开(公告)号:US20170179173A1
公开(公告)日:2017-06-22
申请号:US14975790
申请日:2015-12-20
Applicant: Apple Inc.
Inventor: Shingo Mandai , Gennadiy A. Agranov , Matthew C. Waldon
IPC: H01L27/146 , H01L31/107
CPC classification number: H01L27/14609 , G01S7/4863 , G01S7/497 , G01S17/89 , H01L27/14641 , H01L27/14643 , H01L31/107
Abstract: A sensing device includes an array of sensing elements. Each sensing element includes a photodiode, including a p-n junction, and a local biasing circuit, coupled to reverse-bias the p-n junction at a bias voltage greater than a breakdown voltage of the p-n junction by a margin sufficient so that a single photon incident on the p-n junction triggers an avalanche pulse output from the sensing element. A bias control circuit is coupled to set the bias voltage in different ones of the sensing elements to different, respective values that are greater than the breakdown voltage.
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