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    Load Cell Array for Detection of Force Input to an Electronic Device Enclosure
    21.
    发明申请
    Load Cell Array for Detection of Force Input to an Electronic Device Enclosure 有权

    公开(公告)号：US20210004115A1

    公开(公告)日：2021-01-07

    申请号：US17027296

    申请日：2020-09-21

    Applicant: Apple Inc.

    Inventor： Andrew Deng ,  Travis N. Owens ,  Shubhaditya Majumdar ,  Wei Lin ,  Ying-da Wang ,  Timothy D. Koch ,  Nathan K. Gupta

    IPC: G06F3/041 ,  G06F1/16

    Abstract: A force input sensor includes a load cell to adapt a compressive force applied to the force input sensor into a strain experienced by a strain sensor in the load cell. In particular, the load cell includes two compression plates separated from one another by a gap so as to define a volume between them. A flexible substrate (a “diaphragm”)—includes a strain sensor and is disposed and supported within the volume. One of the two compression plates includes a feature (a “loading feature”) that extends toward a central region of the flexible substrate. As a result of this construction, when the compression plates receive a compressive force, the loading feature induces a bending moment in the flexible substrate, thereby straining the strain sensor.

    Load Cell Array for Detection of Force Input to an Electronic Device Enclosure
    22.
    发明申请
    Load Cell Array for Detection of Force Input to an Electronic Device Enclosure 审中-公开

    公开(公告)号：US20200073504A1

    公开(公告)日：2020-03-05

    申请号：US16116785

    申请日：2018-08-29

    Applicant: Apple Inc.

    Inventor： Andrew Deng ,  Travis N. Owens ,  Shubhaditya Majumdar ,  Wei Lin ,  Ying-da Wang ,  Timothy D. Koch ,  Nathan K. Gupta

    IPC: G06F3/041 ,  G06F1/16

    Abstract: A force input sensor includes a load cell to adapt a compressive force applied to the force input sensor into a strain experienced by a strain sensor in the load cell. In particular, the load cell includes two compression plates separated from one another by a gap so as to define a volume between them. A flexible substrate (a “diaphragm”)—includes a strain sensor and is disposed and supported within the volume. One of the two compression plates includes a feature (a “loading feature”) that extends toward a central region of the flexible substrate. As a result of this construction, when the compression plates receive a compressive force, the loading feature induces a bending moment in the flexible substrate, thereby straining the strain sensor.

    SHIELD STRUCTURES WITH REDUCED SPACING BETWEEN ADJACENT INSULATION COMPONENTS AND SYSTEMS AND METHODS FOR MAKING THE SAME
    23.
    发明申请
    SHIELD STRUCTURES WITH REDUCED SPACING BETWEEN ADJACENT INSULATION COMPONENTS AND SYSTEMS AND METHODS FOR MAKING THE SAME 审中-公开

    公开(公告)号：US20190082565A1

    公开(公告)日：2019-03-14

    申请号：US15836424

    申请日：2017-12-08

    Applicant: Apple Inc.

    Inventor： Wei Lin ,  Nathan K. Gupta ,  John Z. Zhong

    IPC: H05K9/00 ,  H05K7/04 ,  H04M1/02

    Abstract: Shield structures with reduced spacing between adjacent insulation components and systems and methods for making the same are provided. In some embodiments, different insulation components of different layers of a stack may be attached to the same surface of a shield component during a single attachment (e.g., lamination) operation to attenuate the spacing between the different insulation components attached to the shield component. Limiting the size of a spacing between adjacent insulation components along a shield component of a shield structure may limit the size of an exposed portion of the shield component, which may limit the opportunity for that exposed shield component portion to be shorted to another structure (e.g., a support structure of an electronic device that includes the shield structure).

    Seals for Optical Components
    25.
    发明申请
    Seals for Optical Components 有权

    公开(公告)号：US20250028085A1

    公开(公告)日：2025-01-23

    申请号：US18906658

    申请日：2024-10-04

    Applicant: Apple Inc.

    Inventor： Wei Lin ,  Boyi Fu ,  Nathan K Gupta

    IPC: G02B1/18 ,  G02B1/04

    Abstract: An electronic device may have optical components that each have first and second transparent layers such as first and second glass layers. The glass layers may have outer surfaces that face away from each other and inner surfaces that face towards each other. A polymer layer is formed between the inner surfaces of the glass layers. Along the periphery of each optical component, a hermetic seal is formed to protect the polymer material of the polymer layer. The seal may include one or more electroplated metal layers that are coupled to the first and second glass layers. For example, glass prism rings may be coupled to the first and second glass layers and metal may be coupled to the prism rings. The one or more metal layers may then be bonded to the metal on the prism rings, such as through soldering.

    Seals for Optical Components
    26.
    发明公开
    Seals for Optical Components 审中-公开

    公开(公告)号：US20240092065A1

    公开(公告)日：2024-03-21

    申请号：US18457522

    申请日：2023-08-29

    Applicant: Apple Inc.

    Inventor： Wei Lin ,  Boyi Fu ,  Nathan K Gupta

    IPC: B32B17/10

    CPC classification number: B32B17/10302 ,  B32B17/10036 ,  B32B17/1022 ,  B32B17/1077 ,  B32B2457/00 ,  B32B2551/00

    Abstract: An electronic device may have optical components that each have first and second transparent layers such as first and second glass layers. The glass layers may have outer surfaces that face away from each other and inner surfaces that face towards each other. A polymer layer is formed between the inner surfaces of the glass layers. Along the periphery of each optical component, a hermetic seal is formed to protect the polymer material of the polymer layer. The seal may include one or more metal layers that are coupled to the first and second glass layers. For example, glass prism rings may be coupled to the first and second glass layers and metal may be coupled to the prism rings. The one or more metal layers may then be bonded to the metal on the prism rings, such as through soldering.

    Systems having fibers with antireflection coatings
    27.
    发明授权
    Systems having fibers with antireflection coatings 有权

    公开(公告)号：US11644617B1

    公开(公告)日：2023-05-09

    申请号：US17408300

    申请日：2021-08-20

    Applicant: Apple Inc.

    Inventor： Shenglin Ye ,  Wei Lin ,  Prabhakar Gulgunje ,  Shubhaditya Majumdar ,  Boyi Fu ,  Sudirukkuge T. Jinasundera ,  Nathan K. Gupta

    IPC: G02B6/04 ,  G02B6/10

    CPC classification number: G02B6/04 ,  G02B6/102

    Abstract: A system may include one or more electronic devices. Fiber bundles may be provided to convey light. A fiber bundle may have a bend along its length. Fibers for the fiber bundle may be formed from polymer cores coated with polymer claddings. The fibers may have end faces coated with antireflection coatings. The antireflection coatings may be formed from amorphous fluoropolymer deposited from solution. The fluoropolymer may be applied to the end faces of the fibers by dipping, spraying, or by dispensing with a needle dispenser or other dispensing tool. An optical component such as a light-emitting device for a communications system, an illumination system, or a sensor system may provide infrared light that is guided through the fiber bundle.

    Electronic Devices With Optical Fiber Ribbons
    28.
    发明申请
    Electronic Devices With Optical Fiber Ribbons 有权

    公开(公告)号：US20220236507A1

    公开(公告)日：2022-07-28

    申请号：US17528023

    申请日：2021-11-16

    Applicant: Apple Inc.

    Inventor： Prabhakar Gulgunje ,  Brian S. Medower ,  Mahmut C. Orsan ,  Nathan K. Gupta ,  Shifa Xu ,  Shubhaditya Majumdar ,  Wei Lin ,  Yazan Z. Alnahhas

    IPC: G02B6/44 ,  G02B6/42

    Abstract: A light pipe such as a fiber ribbon may be formed from fibers joined by binder such as extruded binder. The fiber ribbon or other light pipe may have bends. A light source may provide light to an input of a fiber ribbon that is guided by the fiber ribbon to a corresponding output. The output may be located in an interior portion of an electronic device or may be positioned so that light from the output exits the electronic device and illuminates external objects. The light source may have light-emitting devices on a substrate. The light-emitting devices may be vertical cavity surface-emitting laser diodes or other lasers and/or may be light-emitting diodes. Light-emitting devices may be arranged in discrete clusters corresponding to the locations of fiber cores in the fiber ribbon.

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