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    21.
    发明专利
    未知

    公开(公告)号：AT114146T

    公开(公告)日：1994-12-15

    申请号：AT91114207

    申请日：1991-08-24

    Applicant: BASF AG

    Inventor： DOTZAUER BERNHARD DR ,  PORTUGALL MICHAEL DR ,  BECKERLE WILHELM FRIEDRICH ,  DENU HANS-JUERGEN

    IPC: C08J5/04 ,  C04B24/12 ,  C04B26/06 ,  C08K5/17 ,  C08K7/04 ,  C08L33/12

    Abstract: Light-weight building panels based on mineral fibres A and thermoplastic binders contain 1 to 25% by weight, relative to A, of a copolymer B having a glass transition temperature from 70 to 105 DEG C and built up essentially from 50 to 98% by weight of methyl methacrylate I, 2 to 50% by weight of one or more acrylates II of C1-C8-alkanols and 0 to 2.5% by weight of one or more crosslinking monomers III as binders, 0 to 150% by weight of fillers C and, relative to B, 0.2 to 15% by weight of one or more amines F of the general formula in which R is C8-C18-alkyl or C8-C18-alkenyl, U and V are C2-C4-alkylene, X and Y are hydrogen, C1-C18-alkyl or C2-C18-alkenyl and n and m are integers from 0 to 10, or acid addition salts thereof.

    Moulded prods. useful esp. as ceiling boards in damp rooms - contain finely-divided natural or synthetic materials and ester(s) of high mol.wt. poly:carboxylic acids and poly:hydric alcohol(s)
    26.
    发明专利
    Moulded prods. useful esp. as ceiling boards in damp rooms - contain finely-divided natural or synthetic materials and ester(s) of high mol.wt. poly:carboxylic acids and poly:hydric alcohol(s) 未知

    公开(公告)号：DE4006644A1

    公开(公告)日：1991-09-05

    申请号：DE4006644

    申请日：1990-03-03

    Applicant: BASF AG

    Inventor： DOTZAUER BERNHARD DR ,  BECKERLE WILHELM FRIEDRICH ,  DENU HANS-JUERGEN

    IPC: C08F2/44 ,  C08L33/02 ,  C08L33/06

    Abstract: Moulded prods. (I) contain as main components, finely-divided natural or synthetic materials (II) and esters (III) of high-mol. wt. polycarboxylic acids (IV) and polyhydric alcohols (V). (I) are produced (a) by mechanically mixing (II) with an aq. soln. of (IV) and (V) as binder, removing excess binder, moulding the resulting paste as required and drying at 100-250 deg.C, (b) by compression moulding (II), coating, impregnating, spraying or dip-coating the pre-form with an aq. soln. of (IV) and (V), and drying at 100-220 deg.C, or (c) by premoulding (II) with a binder, treating with aq. soln. and drying as in (b). Pref. (I) contains 0.5-15 wt.% (III) based on equiv. amts. of (IV) (w.r.t. COOH and OH gps.), pref. esters of poly(meth)acrylic acids whose Na salts have K-value 90-130 in water at 25 deg.C; (V) is trimethylolpropane, glycerol or 2-hydroxymethylbutane-1,4-diol. USE/ADVANTAGE - Flat mouldings (I) are useful as ceiling boards in damp areas (claimed). W.r.t. prior-art binders (e.g. PF resin, amino resins), (III) gives a prod. with increased dimensional stability under damp conditions, which contains much less (or no) volatile binder component (formaldehyde, etc.).

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