公开(公告)号：US20070152562A1

公开(公告)日：2007-07-05

申请号：US11711840

申请日：2007-02-28

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chih Yu

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chih Yu

IPC: H01J1/62 ,  H01J63/04

CPC classification number: C09K11/7731 ,  C09K11/7734 ,  H01J1/62 ,  H01L33/502 ,  H01L33/504 ,  H01L2224/48091 ,  Y02B20/181 ,  H01L2924/00014

Abstract: A white light source has a substrate with a blue light-emitting diode placed thereon and a cap layer enclosing the blue light-emitting diode. The cap layer includes a mixture of silicon and phosphor blend at ratio of 1:0.2-0.5. The phosphor blend includes a red phosphor, a green phosphor and a yellow phosphor.

Abstract translation: 白光源具有放置在其上的蓝色发光二极管的基板和包围蓝色发光二极管的盖层。 盖层包括硅和磷掺合物的混合物，其比例为1:0.2-0.5。 荧光体掺合物包括红色荧光体，绿色荧光体和黄色荧光体。

公开(公告)号：US07211882B2

公开(公告)日：2007-05-01

申请号：US11085100

申请日：2005-03-22

Applicant: Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee ,  Hui-Yen Huang

Inventor： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee ,  Hui-Yen Huang

IPC: H01L23/02

CPC classification number: H01L33/62 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative body packaging the LED die and the metallic frame. The metallic frame has a first contact corresponding to the LED die and a second contact being relative to the first contact. The first and the second contacts inside the insulative body are electrically isolated from each other. The first contact has at least one recess around the LED die, and the second contact has at least one groove formed thereon.

Abstract translation: 描述了LED封装结构及其制造方法。 LED封装结构具有至少一个LED管芯，至少一个与LED管芯相关的金属框架，以及封装LED管芯和金属框架的绝缘体。 金属框架具有对应于LED管芯的第一接触件和相对于第一接触件的第二接触件。 绝缘体内的第一和第二触点彼此电隔离。 第一接触件具有围绕LED管芯的至少一个凹部，并且第二接触件具有形成在其上的至少一个凹槽。

公开(公告)号：US20070072506A1

公开(公告)日：2007-03-29

申请号：US11605425

申请日：2006-11-29

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chao-Yuan Huang

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chao-Yuan Huang

IPC: H01J9/00 ,  H01J9/24

CPC classification number: G09F9/302 ,  G09F9/33 ,  H05K1/0306 ,  H05K1/0393 ,  H05K1/181 ,  H05K2201/0108 ,  H05K2201/10106 ,  Y02P70/611

Abstract: A laminated light-emitting diode display device and a manufacturing method thereof are described. The laminated light-emitting diode display device has an insulator, a circuitry device placed on the insulator and having of a plurality of circuits interconnected with each other, and a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.

Abstract translation: 对层叠型发光二极管显示装置及其制造方法进行说明。 层叠发光二极管显示装置具有绝缘体，放置在绝缘体上并具有彼此互连的多个电路的电路装置，以及电连接到电路的电路的多个SMT型发光二极管 单元。

公开(公告)号：US20060252173A1

公开(公告)日：2006-11-09

申请号：US11416161

申请日：2006-05-03

Applicant: Bily Wang ,  John Lin ,  Shih-Yu Wu

Inventor： Bily Wang ,  John Lin ,  Shih-Yu Wu

IPC: H01L21/00

CPC classification number: H01L25/167 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A manufacturing method for a photoelectric package structure having a control chip is proposed. The photoelectric package structure concentrates light emitted therefrom, prevents external light interference and can be applied for advertising signs and backlight modules. Using the present invention increases the defect-free ratio and production quality. Applying the present invention for packaging light-emitting diode (LED) or optical sensor chips allows the necessary light-emitting requirements of electronic chips to be easily met. The package structure of the present invention is superior to conventional ones and the installation of the control chip doesn't reduce the light-emitting intensity. The major innovation of the present invention is disposing a photoelectric chip (or multiple photoelectric chips) on a control chip and then installing the control chip upon a substrate. Thus, installation-of the components is more convenient. Furthermore, an external frame or optical gratings can also be included to prevent external light interference.

Abstract translation: 提出了一种具有控制芯片的光电封装结构的制造方法。 光电封装结构集中从其发出的光，防止外部光线干扰，并可应用于广告标牌和背光模块。 使用本发明增加了无缺陷比和生产质量。 应用本发明用于封装发光二极管（LED）或光学传感器芯片允许容易地满足电子芯片的必要的发光要求。 本发明的封装结构优于常规封装结构，并且控制芯片的安装不会降低发光强度。 本发明的主要创新是在控制芯片上设置光电芯片（或多个光电芯片），然后将控制芯片安装在基板上。 因此，组件的安装更方便。 此外，还可以包括外部框架或光栅以防止外部光线干扰。

公开(公告)号：US07049639B2

公开(公告)日：2006-05-23

申请号：US10855417

申请日：2004-05-28

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

IPC: H01L33/00

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2201/10666 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014

Abstract: An LED packaging structure has a substrate having two holes formed thereon. One of two conductive elements extends through the two holes to connect electrically to a conductive pad and a first electrode pad on the upper and lower surfaces of the substrate and the other of the two conductive elements extends through the holes to connect to the conductive strip and the second electrode pad on the upper and lower surfaces the substrate. A light-emitting chip electrically connects to the conductive pad and the conductive strip. The light-emitting chip is encapsulated by a protection colloid on the substrate, so as to make LED packaging structure easy to fabricate and avoid the short circuits of adjacent LED packaging structures due to contact between conductor materials therebetween.

Abstract translation: LED封装结构具有形成有两个孔的基板。 两个导电元件中的一个延伸穿过两个孔，以电连接到衬底的上表面和下表面上的导电焊盘和第一电极焊盘，并且两个导电元件中的另一个延伸穿过孔连接到导电条和 上，下表面上的第二电极焊盘。 发光芯片电连接到导电焊盘和导电条。 发光芯片由衬底上的保护胶体封装，从而使LED封装结构容易制造，并避免相邻LED封装结构之间的导体材料之间的接触导致短路。

公开(公告)号：US20060086945A1

公开(公告)日：2006-04-27

申请号：US10973408

申请日：2004-10-27

Applicant: Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu ,  Ching-Hung Ko ,  Chun-Cheng Weng

Inventor： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu ,  Ching-Hung Ko ,  Chun-Cheng Weng

IPC: H01L33/00

CPC classification number: H01L33/642 ,  H01L25/0753 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014

Abstract: A package structure for an optical-electrical semiconductor is described. The package structure has a thermal conductive structure for heat transfer and is integrally formed in one piece to improve the structural strength thereof, while the thermal conductive structure prevent over-heating of the LED device for greater longevity. The package structure reduces the failure rate in production and has improved quality. When the present invention is applied in light-emitting diode packages, the special requirement can be reached and has better properties than the prior art.

Abstract translation: 描述了一种用于光电半导体的封装结构。 封装结构具有用于传热的导热结构，并且整体形成为一体以提高其结构强度，而导热结构防止LED器件的过热延长寿命。 封装结构降低了生产中的故障率，并提高了质量。 当本发明应用于发光二极管封装中时，可以达到特殊要求并具有比现有技术更好的性能。

公开(公告)号：US20050274957A1

公开(公告)日：2005-12-15

申请号：US10855417

申请日：2004-05-28

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

IPC: H01L27/15 ,  H01L33/48 ,  H01L33/62 ,  H05K3/34

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2201/10666 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014

Abstract: An LED packaging structure has a substrate having two drills formed thereon. One of two conductive elements extends through the two drills to connect electrically to a conductive pad and a first electrode pad on the upper and lower surfaces of the substrate and the other of the two conductive elements extends through the drills to connect to the conductive strip and the second electrode pad on the upper and lower surfaces the substrate. A light-emitting chip electrically connects to the conductive pad and the conductive strip. The light-emitting chip is encapsulated by a protection colloid on the substrate, so as to make LED packaging structure easy to fabricate and avoid the short circuits of adjacent LED packaging structures due to contact between conductor materials therebetween.

Abstract translation: LED封装结构具有形成有两个钻头的基板。 两个导电元件中的一个延伸穿过两个钻头，以电连接到基板的上表面和下表面上的导电焊盘和第一电极焊盘，并且两个导电元件中的另一个延伸穿过钻头以连接到导电条和 上，下表面上的第二电极焊盘。 发光芯片电连接到导电焊盘和导电条。 发光芯片由衬底上的保护胶体封装，从而使LED封装结构容易制造，并避免相邻LED封装结构之间的导体材料之间的接触导致短路。

公开(公告)号：US20050200577A1

公开(公告)日：2005-09-15

申请号：US10795310

申请日：2004-03-09

Applicant: Bily Wang ,  John Lin

Inventor： Bily Wang ,  John Lin

IPC: G09G3/32

CPC classification number: G09G3/32 ,  G09G2300/06 ,  G09G2310/0205 ,  G09G2310/0272

Abstract: A circuit for driving a light-emitting diode (LED) display has multiple driving modes. The circuit has a control unit for outputting a mode-switching signal, a scan driving chip connecting with the control unit for providing a scan signal, a data driving chip connecting with the control unit and the scan driving chip for providing a data signal, a row control interface connecting with the row line, the control unit, the scan driving chip and the data driving chip to receive the mode-switching signal for switching an input end of the row control interface, and a column control interface connecting with the column line, the control unit, the scan driving chip and the data driving chip to receive the mode-switching signal for switching an input end of the column control interface.

Abstract translation: 用于驱动发光二极管（LED）显示器的电路具有多种驱动模式。 电路具有用于输出模式切换信号的控制单元，与用于提供扫描信号的控制单元连接的扫描驱动芯片，与控制单元连接的数据驱动芯片和用于提供数据信号的扫描驱动芯片， 与行线连接的行控制接口，控制单元，扫描驱动芯片和数据驱动芯片，以接收用于切换行控制接口的输入端的模式切换信号，以及与列线连接的列控制接口 ，控制单元，扫描驱动芯片和数据驱动芯片，以接收用于切换列控制接口的输入端的模式切换信号。

公开(公告)号：US20050139855A1

公开(公告)日：2005-06-30

申请号：US11011133

申请日：2004-12-15

Applicant: Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung ,  Chuan-Fa Lin

Inventor： Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung ,  Chuan-Fa Lin

IPC: H01L21/60 ,  H01L23/495 ,  H01L29/22 ,  H01L33/00

CPC classification number: H01L23/49562 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L25/167 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package structure for a semiconductor is described. The advantages thereof are that it has a great structural strength and when being penetrated by light, it will not be influenced by external light and can condense the light. Therefore, it is not easily be deformed so that the yield and quality of package can be increased, and when packaging an LED chip, it easily meets the package requirements of an electronic chip. In addition, the substrate structure is cheaper than the prior art, because a double-layered substrate is employed to improve the strength, and the package structure is also preferred because an external frame device is additionally used for preventing interference by external light. The package structure for the semiconductor has a substrate, an external frame device and a polymer filler.

Abstract translation: 描述了半导体的封装结构。 其优点在于它具有很强的结构强度，并且当被光穿透时，它不会被外界光影响并且可以使光凝结。 因此，不容易变形，可以提高封装的成品率和质量，并且在封装LED芯片时，容易满足电子芯片的封装要求。 此外，由于使用双层基板来提高强度，因此基板结构比现有技术便宜，并且封装结构也是优选的，因为外部框架装置另外用于防止外部光的干扰。 半导体的封装结构具有衬底，外部框架器件和聚合物填料。

公开(公告)号：US20050135113A1

公开(公告)日：2005-06-23

申请号：US10737904

申请日：2003-12-18

Applicant: Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

Inventor： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

IPC: F21K99/00 ,  H01L33/58 ,  H01L33/60 ,  F21V7/04

CPC classification number: H01L33/60 ,  F21K9/69 ,  F21Y2115/10 ,  H01L33/58

Abstract: An optical projection device with a colored lighting module has a mask, a lighting module and a lens. The mask has a receiving cavity formed therein, a first opening and a second opening relating to the first opening, the first opening and the second opening both communicating with the receiving cavity and respectively formed on two opposing sides of the mask, and the mask has a reflection layer disposed in an interior surface thereof. The lighting module and the lens are respectively disposed by the first and second openings of the mask.

Abstract translation: 具有彩色照明模块的光学投影装置具有掩模，照明模块和透镜。 掩模具有形成在其中的接收腔，与第一开口相关的第一开口和第二开口，第一开口和第二开口都与接收腔连通并分别形成在掩模的两个相对侧上，并且掩模具有 设置在其内表面中的反射层。 照明模块和透镜分别由掩模的第一和第二开口设置。