公开(公告)号：JPH0563031A

公开(公告)日：1993-03-12

申请号：JP2089892

申请日：1992-02-06

Applicant: CASIO COMPUTER CO LTD

Inventor： SUGIYAMA KAZUHIRO ,  DEGUCHI TOSHIYOSHI ,  MASAKI HISASHI ,  YARITA YOSHIO ,  ATSUMI YOSHINORI ,  TAMAKI TOSHIHARU

IPC: H01L21/60 ,  H05K3/32

Abstract: PURPOSE:To provide a junction method between a semiconductor device and a board which is capable of bonding and joining the semiconductor device with the board with efficiency in a short time equivalent to the time required for a junction method which bonds the semiconductor device with the board by means of an isotropic conductive agent and connecting continuously the semiconductor device with the board definitely without producing any faulty continuity and, what is more, reducing production cost more than a junction method which uses the isotropic conductive agent. CONSTITUTION:There is interposed an ultraviolet-curing type or hot metal type insulating boding agent 6 between a plurality of terminals 2 formed on a semiconductor device 1 and a plurality of connection terminals 5a formed on a board 4. The semiconductor device 1 and the board 4 are relatively depressed with pressure ranging from 5 to 30g applied to each of the terminals 2 and 5a. Ultraviolet rays are emitted to the insulating bonding agent 6 under the pressure loading condition or the insulating bonding agent 6 is hardened by heating and cooling.

公开(公告)号：JPH0563028A

公开(公告)日：1993-03-12

申请号：JP2104792

申请日：1992-02-06

Applicant: CASIO COMPUTER CO LTD

Inventor： KASHIO YUKIO ,  MASAKI HISASHI ,  SUGIYAMA KAZUHIRO ,  DEGUCHI TOSHIYOSHI ,  TAMAKI TOSHIHARU ,  YARITA YOSHIO ,  ATSUMI YOSHINORI

IPC: H01L21/60

Abstract: PURPOSE:To enable junction without installing expensive gold bumps on pads of a semiconductor device and reduce production cost dramatically. CONSTITUTION:Conductive ink 20 is applied to each terminal 2a of a wiring board 10 while a bonding material, (anisotropic conductive bonding agent) which contains conductive particles 4 in an insulating bonding agent 3a, is interposed between a semiconductor device 10 are the wiring board 1. Then, each pad 11 of the semiconductor device 10 is aligned with each terminal f the board 1 where the semiconductor device 10 and the board 1 are relatively depressed so that each terminal 2a of the board 1 may be connected with each mating pad 11 of the semiconductor device 10 by way of the conductive particles 4 respectively. Furthermor, the semiconductor device 10 is bonded and joined with the board 1 by means of an insulating bonding agent 3a.

公开(公告)号：JPH02192793A

公开(公告)日：1990-07-30

申请号：JP1136889

申请日：1989-01-20

Applicant: CASIO COMPUTER CO LTD

Inventor： YARITA YOSHIO ,  KAWAMURA YOSHIHIRO

IPC: H05K3/42 ,  H05K3/02 ,  H05K3/24

Abstract: PURPOSE:To improve reliability by providing a metallic thin film and a coat layer on the inner wall of a pin hole by specific processes and forming wiring patterns on the top and rear faces of an insulative film such that they are connected with each other at the place of the pin hole. CONSTITUTION:A metallic thin film 4 is formed by vapor deposition or sputtering on the top and rear faces of an insulative film 1 in which a pin hole 3 has been formed. The thin film 4 serves as an underlying coat layer on the surface of which a desirable coat layer 6 can be obtained easily. Then, the metallic thin film on the top and rear faces of the insulative film 1 is removed except its parts corresponding to the regions where wiring patterns are to be formed. Since the inner wall of the pin hole 3 is covered with the metallic thin film 4 and the coat layer 7, wiring patterns 7 on the top and rear faces can be connected with each other at a low resistance. According to this method, the pointed tip end of a pin 2 can pierce the film to form the pin hole 3 without being crushed and, therefore, any trouble due to chips or the like can be prevented.

公开(公告)号：JPH02192791A

公开(公告)日：1990-07-30

申请号：JP1136789

申请日：1989-01-20

Applicant: CASIO COMPUTER CO LTD

Inventor： YARITA YOSHIO ,  KAWAMURA YOSHIHIRO

IPC: H05K3/42 ,  H05K3/02 ,  H05K3/06 ,  H05K3/24

Abstract: PURPOSE:To improve reliability while improving manufacturing efficiency by providing a metallic thin film and a coat layer on the inner wall of a pin hole by specific processes, and forming wiring patterns on the top and rear faces of an insulative film such that the wiring patterns are connected with each other at the place of the pin hole. CONSTITUTION:A metallic thin film 5 is formed by vapor deposition or sputtering on the top and rear faces of an insulative film 1 in which a pin hole 3 has been formed. The thin film 5 serves as an underlying coat on the surface of which a desirable coat layer 6 can be obtained easily. Since the inner wall of the pin hole 3 is coated with the metallic thin film 5 and the coat layer 6, wiring patterns 7 on the top and rear faces can be connected electrically with a low resistance. In this manner, a structure capable of connecting the wiring patterns on the top and rear faces reliably and having high reliability in conduction can be obtained. Finally, an insulating layer 4 is peeled off and parts of the thin film 5 outside the wiring pattern forming regions are removed.

公开(公告)号：JPH02192789A

公开(公告)日：1990-07-30

申请号：JP1136689

申请日：1989-01-20

Applicant: CASIO COMPUTER CO LTD

Inventor： YARITA YOSHIO ,  KAWAMURA YOSHIHIRO

IPC: H05K3/42 ,  H05K3/06 ,  H05K3/24

Abstract: PURPOSE:To improve reliability in resistance to weather and current capacity by providing a metallic thin film and a coat layer on the inner walls of a pin hole by specific processes and forming resist patterns on the surface of the coat layer so as to connect wiring patterns at a low resistance. CONSTITUTION:A metallic thin film 4 is formed by vapor deposition or sputtering on the top and rear faces of an insulative film 1 having a pin hole 3. The thin film 4 serves as an underlying coat on the surface of which a desirable coat layer 5 can be obtained easily. Resist patterns 6 are formed in the place of the pin hole 3 in the coat layer 5 by a screen printing or photo patterning process. The thin film 4 on the top and rear faces of the film 2 and the coat layer 5 masked with the resist patterns are etched so that wiring patterns 7 are formed in the place of the pin hole 3. The wiring patterns 7 thus connected with each other through the thin film 4 and the coat layer 5 have a low value of electric resistance and is allowed to have improved reliability in resistance to weather and current capacity.

公开(公告)号：JPH021336A

公开(公告)日：1990-01-05

申请号：JP14183888

申请日：1988-06-10

Applicant: CASIO COMPUTER CO LTD

Inventor： YARITA YOSHIO

IPC: B41J2/335

Abstract: PURPOSE:To make a heat generating section anew only by fixing a thermal resistance layer on many read electrodes which are formed and arranged the entire surface of flexible sheet, folding back the sheet as a fold-back section which is used as a heat generating section, and using this new section. CONSTITUTION:A thermal resistance layer 8 is fixed on read electrodes 7 of the heat-resistant sheet 6 with a number of such arranged electrodes 7 to constitute the first electrode body 4, and the electrode body is folded back with the thermal resistance layer 8 positioned inside. The second electrode body 5 is inserted in this fold-back section and an insulation layer 10 is partly cut off to expose a return electrode 9 at the lower end and the return electrode 9 communicates with the read electrode 7 at the bottom, as a heat-generating section 8a. Consequently, since the fold-back section is used as the heat generating section 8a, the structure can be simplified, and also the fold-back section can be used as a new heat generating section 8a only by changing the fold-back section of the heat-resistant sheet 6. Thus, the functional deterioration of the heat generating section can be ideally coped with.

公开(公告)号：JPS61206295A

公开(公告)日：1986-09-12

申请号：JP4603185

申请日：1985-03-08

Applicant: CASIO COMPUTER CO LTD

Inventor： SUGIYAMA KAZUHIRO ,  DEGUCHI TOSHIYOSHI ,  MASAKI HISASHI ,  YARITA YOSHIO ,  ATSUMI YOSHINORI ,  TAMAKI TOSHIHARU

IPC: H05K3/32 ,  G02F1/133 ,  G02F1/1345 ,  G09F9/00 ,  H01L21/60 ,  H05K1/18

公开(公告)号：JPS61187394A

公开(公告)日：1986-08-21

申请号：JP2796085

申请日：1985-02-15

Applicant: CASIO COMPUTER CO LTD

Inventor： DEGUCHI TOSHIYOSHI ,  SUGIYAMA KAZUHIRO ,  MASAKI HISASHI ,  YARITA YOSHIO ,  ATSUMI YOSHINORI ,  TAMAKI TOSHIHARU

IPC: H05K3/32 ,  C09J7/02 ,  G09F9/00