Abstract:
A system (120) for reflecting or redirecting incident light, microwave or sound energy includes a first substrate (144) configured to support an array of reflective elements (130) that can be angularly displaced through a range of substantially (90) degrees in response to a reflector angle control signal and a controller programmed to generate the reflector angle control signal to achieve desired incident energy, beam or wavefront re-direction. The reflective elements (130) preferably comprise MEMS micro-reflector elements hingedly or movably attached to the first substrate (130) and define a reflective surface that is aimed at the source of incident light, microwave or sound energy.
Abstract:
An ultrasonic computation apparatus includes first and second ultrasonic transducer arrays arranged on opposing ends thereof, and further comprises first and second ultrasonic propagation regions arranged between the first and second ultrasonic transducer arrays and proximate respective ones of the first and second ultrasonic transducer arrays, and an intermediate computational structure arranged between the first and second ultrasonic propagation regions. Respective first and second input signals applied to respective ones of the first and second ultrasonic transducer arrays cause propagation of corresponding ultrasonic waves through the respective first and second ultrasonic propagation regions towards the intermediate computational structure. The intermediate computational structure is configured to receive the propagating ultrasonic waves from the respective first and second ultrasonic propagation regions and to generate from the received propagating ultrasonic waves an additional signal that is a function of the first and second signals.
Abstract:
A zero power sensor node includes a sensor suite including two or more different types of zero power sensors, particularly including at least two of a zero power PZT-bimorph accelerometer, a zero power PZT-bimorph rotation sensor, a zero power PZT-bimorph magnetic sensor, a zero power PZT-bimorph gyroscope, and a zero power acoustic sensor, which may be a PZT-bimorph acoustic sensor or an resonant cavity, and a near zero power-consuming, multi gate electrostatic switch. The node output can send a wake-up signal to trigger a higher power consuming device.
Abstract:
Methods, devices and systems are disclosed for implementing ultrasonic communications in an integrated circuit. In one aspect, the disclosed technology integrates piezoelectric and electrostatic actuator arrays into IC chips to form sonar arrays that transmit from one location in chip to another, which can allows for tunable sonic communication links between any two points. For example, the sonar elements can also be used to transmit signals from one chip to another through a common substrate, while making use of the frequency- selective nature of acoustic transducers and waveguides to communicate to multiple receivers over different frequency bands at the same time, e.g., via frequency division multiplexing.
Abstract:
An ultrasonic or acoustic viscosity sensor or viscometer is provided that can be used to accurately measure viscosity for fluid samples of less than 1 µl in volume. Methods for measuring viscosity for fluid samples of less than 1 µl in volume are also provided. The viscosity sensor and methods based thereon enable simultaneous measurement of bulk and dynamic (shear-rate dependent) viscosity of a non-Newtonian fluid. Bulk and dynamic viscosity of the non-Newtonian fluid can be measured simultaneously without separating constituents of the fluid, and thus distinguishing the effect of constituents on the viscosity. Dynamic viscosity of the non-Newtonian fluid can be estimated at varying shear rates, to study the deformability of the constituents of the fluid as a function of shear rate.
Abstract:
A device configured for low-energy ultrasonic 2D Fourier transform analysis, comprising: (i) a first layer comprising an array of piezoelectric pixels; (ii) a second layer comprising an array of piezoelectric pixels; (iii) a third layer, positioned between the first and second layers, comprising a bulk ultrasonic transmission medium; wherein the second layer of array of piezoelectric pixels is in the Fourier plane of an input signal of the first layer array of piezoelectric pixels.
Abstract:
A SAW-based inertial sensor incorporates a curved SAW drive resonator and graphene electrodes to increase the Coriolis force on a pillar array and generate secondary SAW waves that create a strain-induced hyperfine frequency transition in an enclosed alkali atom vapor, in conjunction with an integrated FP resonator to measure very small inertial signals corresponding to 10 μg and 0.01 °/hr, representing a dynamic range of 10 orders of magnitude.
Abstract:
A multi-tip nano-probe apparatus and a method for probing a sample while using the multi-tip nano-probe apparatus each employ located over a substrate: (1) an immovable probe tip with respect to the substrate; (2) a movable probe tip with respect to the substrate; and (3) a motion sensor that is coupled with the movable probe tip. The multi-tip nano-probe apparatus and related method provide for improved sample probing due to close coupling of the motion sensor with the movable probe tip, and also retractability of the movable probe tip with respect to the immovable probe tip.
Abstract:
An exemplary thinned-down betavoltaic device includes an N+ doped silicon carbide (SiC) substrate having a thickness between about 3 to 50 microns, an electrically conductive layer disposed immediately adjacent the bottom surface of the SiC substrate; an N- doped SiC epitaxial layer disposed immediately adjacent the top surface of the SiC substrate, a P+ doped SiC epitaxial layer disposed immediately adjacent the top surface of the N- doped SiC epitaxial layer, an ohmic conductive layer disposed immediately adjacent the top surface of the P+ doped SiC epitaxial layer, and a radioisotope layer disposed immediately adjacent the top surface of the ohmic conductive layer. The radioisotope layer can be 63 Ni, 147 Pm, or 3 H. Devices can be stacked in parallel or series. Methods of making the devices are disclosed.