公开(公告)号：US10730783B2

公开(公告)日：2020-08-04

申请号：US15718848

申请日：2017-09-28

Applicant: CORNING INCORPORATED

Inventor： Ravindra Kumar Akarapu ,  Garrett Andrew Piech ,  Sergio Tsuda ,  James Andrew West

IPC: B23K26/40 ,  C03B33/08 ,  B23K26/53 ,  B23K26/06 ,  B23K26/00 ,  B23K26/067 ,  B23K26/073 ,  B23K26/08 ,  B23K26/38 ,  C03B33/10 ,  B23K103/00

Abstract: A method for laser processing a transparent workpiece includes forming a contour line that includes defects, by directing a pulsed laser beam output by a beam source through an aspheric optical element positioned offset in a radial direction from the beam pathway and into the transparent workpiece such that the portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece that produces a defect within the transparent workpiece. The portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, an effective spot size wo,eff, and a non-axisymmetric beam cross section having a minimum Rayleigh range ZRx,min in an x-direction and a minimum Rayleigh range ZRy,min in a y-direction. Further, the smaller of ZRx,min and ZRy,min is greater than F D ⁢ π ⁢ ⁢ w 0 , eff 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater.

公开(公告)号：US10144093B2

公开(公告)日：2018-12-04

申请号：US15251453

申请日：2016-08-30

Applicant: CORNING INCORPORATED

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Shyamala Shanmugam ,  Carlos Alberto Pons Siepermann ,  Sergio Tsuda ,  Zsigmond Varga ,  Robert Stephen Wagner

IPC: B23K26/384 ,  B23K26/402 ,  C03B33/09 ,  B23K26/04 ,  C03B33/02 ,  C03C15/00 ,  B32B17/06 ,  C03C17/00 ,  B23K26/00 ,  B23K26/06 ,  B23K26/38 ,  B23K26/0622 ,  C09K13/00

Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

公开(公告)号：US09850160B2

公开(公告)日：2017-12-26

申请号：US14529520

申请日：2014-10-31

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Helmut Schillinger ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/02 ,  C03B17/06 ,  B23K26/40 ,  B23K26/53

CPC classification number: C03B33/0222 ,  B23K26/0622 ,  B23K26/40 ,  B23K26/53 ,  B23K26/57 ,  B23K2103/172 ,  B23K2103/50 ,  C03B17/064 ,  C03B25/087 ,  C03B29/10 ,  C03B33/0215 ,  C03B33/07 ,  C03B33/091 ,  Y02P40/57 ,  Y10T428/24777 ,  Y10T428/249921

Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (

公开(公告)号：US20170266757A1

公开(公告)日：2017-09-21

申请号：US15617622

申请日：2017-06-08

Applicant: CORNING INCORPORATED

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: B23K26/00 ,  B23K26/382 ,  C03B33/02 ,  B23K26/0622

Abstract: A system for laser drilling of a material includes a pulsed laser configured to produce a pulsed laser beam having a wavelength less than or equal to about 850 nm, the wavelength selected such that the material is substantially transparent at this wavelength. The system further includes an optical assembly positioned in the beam path of the laser, configured to transform the laser beam into a laser beam focal line oriented along the beam propagation direction, on a beam emergence side of the optical assembly.

公开(公告)号：US20170197862A1

公开(公告)日：2017-07-13

申请号：US15472593

申请日：2017-03-29

Applicant: Corning Incorporated

Inventor： Dana Craig Bookbinder ,  Albert Roth Nieber ,  Stephan Lvovich Logunov ,  Pushkar Tandon ,  Sergio Tsuda

IPC: C03B9/46 ,  C03B33/08 ,  C03B9/12

CPC classification number: C03B9/46 ,  B23K26/0624 ,  B23K26/0648 ,  B23K26/0652 ,  B23K26/0738 ,  B23K26/0838 ,  B23K26/103 ,  B23K26/38 ,  B23K26/382 ,  B23K26/402 ,  B23K2101/04 ,  B23K2103/50 ,  B23K2103/54 ,  C03B9/12 ,  C03B9/42 ,  C03B13/04 ,  C03B21/04 ,  C03B33/0222 ,  C03B33/04 ,  C03B33/082 ,  C03B33/091

Abstract: Methods of fabricating formed glass articles are described herein. In one embodiment, a method for fabricating a formed glass article may include forming a glass ribbon, forming a parson, and shaping the parson to form a glass article. The glass article may be attached to the glass ribbon at an attachment region defining an edge of the glass article. The process may also include contacting the attachment region with a focal line of a laser beam and separating the glass article from the glass ribbon at the attachment region. The attachment region may be perforated by the laser beam and the focal line may be substantially perpendicular to the plane of the glass ribbon.

公开(公告)号：US09701564B2

公开(公告)日：2017-07-11

申请号：US14794378

申请日：2015-07-08

Applicant: Corning Incorporated

Inventor： Dana Craig Bookbinder ,  Lewis Kirk Klingensmith ,  Stephan Lvovich Logunov ,  Albert Roth Nieber ,  Helmut Schillinger ,  Pushkar Tandon ,  Sergio Tsuda

IPC: C03B33/06 ,  C03B17/04 ,  C03B33/09 ,  C03B33/10 ,  C03B33/02 ,  C03B9/12 ,  C03B33/095 ,  B23K103/00

CPC classification number: C03B33/06 ,  B23K2103/54 ,  C03B9/12 ,  C03B33/0222 ,  C03B33/095 ,  C03B33/0955

Abstract: Embodiments of the present method of laser cutting a laser wavelength transparent glass article comprises feeding at least one glass article to a pulsed laser assembly having at least one pulsed laser, wherein the pulsed laser defines a laser beam focal line with a length of 0.1-100 mm, the glass article being comprised of two end sections, and at least one lateral surface disposed lengthwise between the end sections. The method further comprises laser cutting at least one perforation line onto the lateral surface of the glass article while there is relative motion between the glass article and the pulsed laser and separating the glass article along the at least one perforation line to yield a laser cut glass article.

公开(公告)号：US20160368809A1

公开(公告)日：2016-12-22

申请号：US15251605

申请日：2016-08-30

Applicant: Corning Incorporated

Inventor： Thomas Hackert ,  Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/08 ,  B23K26/53 ,  C03B33/04 ,  B23K26/06 ,  C03B33/02 ,  B23K26/00 ,  B23K26/0622

CPC classification number: C03B33/082 ,  B23K26/0608 ,  B23K26/0622 ,  B23K26/359 ,  B23K26/382 ,  B23K26/389 ,  B23K26/53 ,  B23K26/55 ,  B23K2103/54 ,  C03B33/0222 ,  C03B33/04 ,  C03B33/091 ,  Y02P40/57 ,  Y10T428/15 ,  Y10T428/24273

Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.

公开(公告)号：US20160311717A1

公开(公告)日：2016-10-27

申请号：US15105741

申请日：2014-12-17

Applicant: CORNING INCORPORATED

Inventor： Albert Roth Nieber ,  Sergio Tsuda

IPC: C03B33/02 ,  C03B23/035 ,  B23K26/0622 ,  B23K26/359 ,  B23K26/386 ,  B23K26/402 ,  C03B23/023 ,  B23K26/00

CPC classification number: C03B33/0222 ,  B23K26/0622 ,  B23K26/359 ,  B23K26/382 ,  B23K26/386 ,  B23K26/389 ,  B23K26/402 ,  B23K26/55 ,  B23K26/57 ,  B23K2103/50 ,  B23K2103/54 ,  B23K2103/56 ,  C03B23/02 ,  C03B23/023 ,  C03B23/0252 ,  C03B23/0357 ,  Y02P40/57

Abstract: A method of making a glass article having non-flat portions, said method comprising the steps of (i) perforating a glass blank along a contour with a laser and forming multiple perforations in the glass blank; (ii) bending the glass bank along at least one area containing perforations, such that the glass is curved, forming a glass article having the non-flat portion.

Abstract translation: 一种制造具有非平坦部分的玻璃制品的方法，所述方法包括以下步骤：（i）用激光沿轮廓穿孔玻璃坯料，并在玻璃坯料中形成多个穿孔; （ii）沿着包含穿孔的至少一个区域弯曲玻璃组，使得玻璃弯曲，形成具有非平坦部分的玻璃制品。

公开(公告)号：US20160009586A1

公开(公告)日：2016-01-14

申请号：US14794378

申请日：2015-07-08

Applicant: Corning Incorporated

Inventor： Dana Craig Bookbinder ,  Lewis Kirk Klingensmith ,  Stephan Lvovich Logunov ,  Albert Roth Nieber ,  Helmut Schillinger ,  Pushkar Tandon ,  Sergio Tsuda

IPC: C03B33/06 ,  C03B33/09 ,  C03B33/10 ,  C03B17/04

CPC classification number: C03B33/06 ,  B23K2103/54 ,  C03B9/12 ,  C03B33/0222 ,  C03B33/095 ,  C03B33/0955

Abstract: Embodiments of the present method of laser cutting a laser wavelength transparent glass article comprises feeding at least one glass article to a pulsed laser assembly having at least one pulsed laser, wherein the pulsed laser defines a laser beam focal line with a length of 0.1-100 mm, the glass article being comprised of two end sections, and at least one lateral surface disposed lengthwise between the end sections. The method further comprises laser cutting at least one perforation line onto the lateral surface of the glass article while there is relative motion between the glass article and the pulsed laser and separating the glass article along the at least one perforation line to yield a laser cut glass article.

Abstract translation: 激光切割激光波长透明玻璃制品的本方法的实施例包括将至少一个玻璃制品馈送到具有至少一个脉冲激光的脉冲激光组件，其中脉冲激光器限定长度为0.1-100的激光束焦线 mm，所述玻璃制品由两个端部部分组成，以及纵向设置在所述端部之间的至少一个侧面。 该方法还包括将玻璃制品的侧表面上的至少一个穿孔线激光切割，同时在玻璃制品和脉冲激光器之间存在相对运动并沿着至少一个穿孔线分离玻璃制品以产生激光切割玻璃 文章。

公开(公告)号：US20150232369A1

公开(公告)日：2015-08-20

申请号：US14529520

申请日：2014-10-31

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Helmut Schillinger ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/02

CPC classification number: C03B33/0222 ,  B23K26/0622 ,  B23K26/40 ,  B23K26/53 ,  B23K26/57 ,  B23K2103/172 ,  B23K2103/50 ,  C03B17/064 ,  C03B25/087 ,  C03B29/10 ,  C03B33/0215 ,  C03B33/07 ,  C03B33/091 ,  Y02P40/57 ,  Y10T428/24777 ,  Y10T428/249921

Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (

Abstract translation: 本发明涉及用于切割和分离透明材料薄基板的激光切割技术，例如切割主要用于制造薄膜晶体管（TFT）器件的显示玻璃组合物。 所描述的激光工艺可以用于例如以> 1m / sec的速度进行直线切割，以切割尖锐的半径外角（<1mm），并且产生包括形成内部孔和狭槽的任意弯曲形状。 激光加工碱土硼硅铝酸盐玻璃复合工件的方法包括将脉冲激光束聚焦到焦线中。 焦线被引导到玻璃复合工件中，在材料内产生诱导吸收。 工件和激光束相对于彼此平移以沿着轮廓形成多条缺陷线，其中相邻的缺陷线具有0.1-20微米的间隔。