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公开(公告)号：US20190084090A1
公开(公告)日：2019-03-21
申请号：US16183065
申请日：2018-11-07
Applicant: CORNING INCORPORATED
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Shyamala Shanmugam , Carlos Alberto Pons Siepermann , Sergio Tsuda , Zsigmond Varga , Robert Stephen Wagner
IPC: B23K26/384 , B23K26/38 , C03B33/09 , C03C15/00 , B23K26/06 , B23K26/04 , C03B33/02 , B32B17/06 , B23K26/0622 , B23K26/53 , B23K26/402 , C03C17/00 , B23K26/55 , B23K103/00 , C09K13/00
Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
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公开(公告)号：US20180179100A1
公开(公告)日：2018-06-28
申请号：US15812156
申请日：2017-11-14
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Helmut Schillinger , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/0222 , B23K26/0622 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2103/172 , B23K2103/50 , C03B17/064 , C03B25/087 , C03B29/10 , C03B33/0215 , C03B33/07 , C03B33/091 , Y02P40/57 , Y10T428/24777 , Y10T428/249921
Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (
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公开(公告)号：US09676167B2
公开(公告)日：2017-06-13
申请号：US14529976
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
IPC: B32B3/00 , B32B17/06 , C03B33/02 , B23K26/00 , B23K26/06 , B23K26/073 , B23K26/0622 , B23K103/00
CPC classification number: C03B33/0222 , B23K26/0006 , B23K26/0613 , B23K26/0624 , B23K26/0738 , B23K26/40 , B23K26/53 , B23K26/55 , B23K2103/50 , B32B17/06 , B32B2250/02 , B32B2315/02 , Y02P40/57 , Y10T428/21 , Y10T428/24273 , Y10T428/24355
Abstract: A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.
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4.发明授权Method for rapid laser drilling of holes in glass and products made therefrom 有权用于在玻璃中快速激光钻孔和由其制成的产品的方法公开(公告)号：US09517963B2
公开(公告)日：2016-12-13
申请号：US14535754
申请日：2014-11-07
Applicant: CORNING INCORPORATED
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Shyamala Shanmugam , Carlos Alberto Pons Siepermann , Sergio Tsuda , Zsigmond Varga , Robert Stephen Wagner
IPC: B32B3/24 , C03B33/09 , C03C15/00 , B32B17/06 , C03C17/00 , B23K26/06 , B23K26/38 , C03B33/02 , B23K26/00
CPC classification number: B23K26/384 , B23K26/04 , B23K26/0613 , B23K26/0617 , B23K26/0624 , B23K26/38 , B23K26/402 , B23K26/53 , B23K26/55 , B23K2103/50 , B32B17/064 , C03B33/0222 , C03B33/091 , C03C15/00 , C03C17/00 , C03C2217/70 , C09K13/00 , Y02P40/57 , Y10T428/24273 , Y10T428/24322
Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
Abstract translation: 在材料中形成的孔包括将脉冲激光束聚焦到沿着光束传播方向定向的激光束焦线并被引导到材料中，激光束焦线在材料内产生诱导吸收，诱导吸收产生沿着 材料内的激光束焦线，并且相对于彼此平移材料和激光束，从而在材料中形成多条缺陷线，并在酸溶液中蚀刻材料以产生直径大于1微米的孔 通过扩大材料中的缺陷线。 玻璃制品包括一叠玻璃基底，其具有延伸穿过该叠层的1-100微米直径的形成的孔。
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公开(公告)号：US20150166391A1
公开(公告)日：2015-06-18
申请号：US14530244
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: B23K26/0057 , B23K26/0006 , B23K26/0622 , B23K26/0624 , B23K26/359 , B23K26/402 , B23K26/53 , B23K26/55 , B23K26/57 , B23K2103/172 , B23K2103/50 , B23K2103/54 , B32B7/02 , B32B17/00 , B32B2457/20 , C03B17/02 , C03B17/064 , C03B25/087 , C03B29/10 , C03B33/0215 , C03B33/0222 , C03B33/07 , C03B33/091 , Y02P40/57 , Y10T428/15 , Y10T428/24777
Abstract: The present disclosure relates to a process for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets, and the disclosure also relates to a glass article prepared by the method. The developed laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermally stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a CO2 laser (coupled with high pressure air flow) for fully automated separation.
Abstract translation: 本公开涉及一种用于切割和分离任意形状的透明材料的薄基板，特别是定制的复合融合拉制玻璃板的方法，并且本公开还涉及通过该方法制备的玻璃制品。 开发的激光方法可以通过热应力所需的轮廓来定制，从面板手动分离零件或完全激光分离。 自分离方法涉及利用可以跟随CO 2激光器（与高压空气流耦合）以实现全自动分离的超短脉冲激光器。
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Patent Agency Ranking
公开(公告)号：US11992894B2
公开(公告)日：2024-05-28
申请号：US16971501
申请日：2019-02-22
Applicant: CORNING INCORPORATED
Inventor： Hasan Fiaz , Jann Paul Kaminski , Raymond Miller Karam , Brian Nilsen , Marie Bernadette O'Regan , Garrett Andrew Piech , Sergio Tsuda , ChuanChe Wang , Ming Ying
CPC classification number: B23K26/0006 , B23K26/32 , C03B33/0222 , C03C23/0025 , C03C27/08
Abstract: A method of separating a portion of an object comprising: presenting an object having a thickness; using a laser emission at a wavelength to perforate at least a portion of the thickness of the object sequentially over a length to form a series of perforations between a first portion of the object on one side of the series of perforations and a second portion of the object on the other side of the series of perforations; and applying a stress to the object at the series of perforations to separate the first portion of the object from the second portion of the object, wherein the thickness of the object, at the series of perforations, is transparent to the wavelength of the laser emission.
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公开(公告)号：US20230025312A1
公开(公告)日：2023-01-26
申请号：US17867147
申请日：2022-07-18
Applicant: CORNING INCORPORATED
Abstract: A method of marking an optical fiber that includes directing a laser beam onto a first colored layer of an optical fiber. The optical fiber includes a core and a cladding surrounding the core, the first colored layer surrounds the cladding, and the laser beam modifies the first colored layer to form one or more laser-modified regions along an outer surface of the first colored layer.
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8.发明申请公开(公告)号：US20220339751A1
公开(公告)日：2022-10-27
申请号：US17621049
申请日：2020-06-11
Applicant: CORNING INCORPORATED
Inventor： Jonas Bankaitis , Duc Anh Bui , Scott Steven Cronk , Christopher Paul Daigler , Christina Marie Laskowski , Neil Eugene Partridge , Uwe Stute , Sergio Tsuda , Chad Michael Wilcox
IPC: B24B9/10
Abstract: Processes and devices by which a brittle material substrate may be edge formed and finished to simultaneously remove corresponding damage remaining on the edges in the areas formed by cutting and separation while imposing a desired edge profile and achieving a desired mechanical edge strength. Processes of the present disclosure may include a chemical and mechanical brush polishing process configured to shape and/or polish a surface of one or more thin substrates. A plurality of substrates may be arranged in a stacked configuration, and engineered interposer devices may be arranged between the stacked substrates. The interposers may provide between the substrates and may direct filament placement during brushing so as to guide material removal on the substrate edges. Substrate edge profile shapes, including symmetric and asymmetric profiles, may be formed by strategic manipulation of interposer properties including dimensions, mechanical features, material properties, and positioning.
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公开(公告)号：US10335902B2
公开(公告)日：2019-07-02
申请号：US15325893
申请日：2015-07-14
Applicant: Corning Incorporated
Inventor： Dana Craig Bookbinder , Stephan Lvovich Logunov , Albert Roth Nieber , Garrett Andrew Piech , Pushkar Tandon , Sergio Tsuda
IPC: B23K26/402 , B23K26/0622 , B23K26/064 , B23K26/08 , B23K26/359 , B23K26/57 , B23K26/53 , B23K26/073 , C03B33/07 , C03B33/02 , B23K103/00
Abstract: A method of arresting propagation of an incident crack through a transparent material includes focusing pulsed laser beams into a laser beam focal line directed into the transparent material a series of locations corresponding to a predetermined pattern that is designed to arrest an incident crack that propagates through the transparent material, and generating, with the laser beam focal line (1460), an induced absorption within the transparent material in order to produce a defect (1440) in the transparent material.
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公开(公告)号：US10179748B2
公开(公告)日：2019-01-15
申请号：US15585305
申请日：2017-05-03
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
IPC: B32B3/00 , C03B33/02 , B32B17/06 , B23K26/53 , B23K26/55 , B23K26/06 , B23K26/073 , B23K26/00 , B23K26/0622 , B23K26/40 , B23K103/00
Abstract: A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.
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