公开(公告)号：US5439731A

公开(公告)日：1995-08-08

申请号：US208598

申请日：1994-03-11

Applicant: Che-Yu Li ,  Peter Borgesen ,  Matt A. Korhonen

Inventor： Che-Yu Li ,  Peter Borgesen ,  Matt A. Korhonen

IPC: H01L23/528 ,  H01L23/532 ,  B32B9/00

CPC classification number: H01L23/53223 ,  H01L23/5283 ,  H01L2924/0002 ,  Y10T428/24917

Abstract: Interconnect or metallization structures for integrated circuits on semiconductor chips contain blocked conductor segments to limit atomic transport from one segment to another thus minimizing stress migration and electromigration damage. Since the blocked conductor segments prevent atomic transport between two neighboring segments, the total amount of atoms and vacancies available for hillock and void growth in a segment can be controlled by the length of the segment. The conductor segments are made of high electrical conductance metals, such as aluminum, copper or gold based alloys, and are separated by very short segments of a high melting temperature refractory metal or alloy. Because of their high melting temperatures, refractory metals or alloys suppress atomic transport. The interconnect structures can be fabricated by conventional lithographic and deposition techniques.

Abstract translation: 用于半导体芯片上的集成电路的互连或金属化结构包含阻塞的导体部分，以限制从一个部分到另一个部分的原子传输，从而最小化应力迁移和电迁移损伤。 由于阻塞的导体段阻止两个相邻段之间的原子传输，可用于段中的小丘和空隙生长的原子和空位的总量可以由段的长度来控制。 导体段由诸如铝，铜或金基合金的高电导金属制成，并且由非常短的高熔点难熔金属或合金段分开。 由于其熔融温度高，难熔金属或合金抑制原子运输。 互连结构可以通过常规的光刻和沉积技术制造。

公开(公告)号：US08093970B2

公开(公告)日：2012-01-10

申请号：US12249535

申请日：2008-10-10

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01H51/22

CPC classification number: H01H50/005 ,  H01H1/5822 ,  H01H2001/0042 ,  H01H2050/007

Abstract: A relay including a coil or solenoid, at least one fixed substrate and a moving substrate, a plurality of braided electrical contact element contacts making contact with pads on the fixed and moving substrates, returning springs mounted on alignment pins, and an optional cover for hermetical sealing. A further embodiment presents a horizontally-moving armature actuated by one or more solenoids.

Abstract translation: 包括线圈或螺线管的继电器，至少一个固定基板和移动基板，多个编织的电接触元件触头，与固定和移动的基板上的焊盘接触，安装在对准引脚上的复位弹簧和用于密封的可选盖 密封。 另一实施例呈现由一个或多个螺线管致动的水平移动的衔铁。

公开(公告)号：US20090096560A1

公开(公告)日：2009-04-16

申请号：US12249535

申请日：2008-10-10

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01H3/00

CPC classification number: H01H50/005 ,  H01H1/5822 ,  H01H2001/0042 ,  H01H2050/007

Abstract: A relay including a coil or solenoid, at least one fixed substrate and a moving substrate, a plurality of braided electrical contact element contacts making contact with pads on the fixed and moving substrates, returning springs mounted on alignment pins, and an optional cover for hermetical sealing. A further embodiment presents a horizontally-moving armature actuated by one or more solenoids.

Abstract translation: 包括线圈或螺线管的继电器，至少一个固定基板和移动基板，多个编织的电接触元件触头，与固定和移动的基板上的焊盘接触，安装在对准引脚上的复位弹簧和用于密封的可选盖 密封。 另一实施例呈现由一个或多个螺线管致动的水平移动的衔铁。

公开(公告)号：US07293995B2

公开(公告)日：2007-11-13

申请号：US11334993

申请日：2006-01-18

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01R12/00

CPC classification number: H01R13/2435 ,  H01R13/03

Abstract: An electrical contact formed from a compliant folded sheet that includes a top surface, a bottom surface, a first contact edge and a second contact edge. A plurality of corrugations are formed in the top surface and the bottom surface that terminate at the first contact edge and the second contact edge. A connector system having a housing that has a plurality of through openings. A plurality of electrical contacts, each being formed from a compliant folded sheet that includes a top surface, a bottom surface, a first contact edge and a second contact edge. A plurality of corrugations are formed in the top surface and the bottom surface that terminate at the first contact edge and the second contact edge. Each of the electrical contacts is arranged within a corresponding one of the plurality of through openings such that the first contact edge is positioned outside of the through-opening in which electrical contact is positioned, and the second contact edge is positioned outside of the through-opening in which electrical contact is positioned, but spaced from the first contact edge.

公开(公告)号：US07128592B2

公开(公告)日：2006-10-31

申请号：US11082365

申请日：2005-03-17

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01R13/28

CPC classification number: H01R13/2435 ,  H01R12/7052 ,  H01R12/714 ,  H01R12/89

Abstract: A connector system including first housing having a first header, the first header including one or more conductive pads that are in electrical communication with a conductor. A second housing that is mateable with the first housing and includes a second header positioned on a mating face. The second header includes one or more conductive pad that are electrically engaged with a conductor and positioned in confronting relation with the one or more conductive pads of the first header. An interposer located between the first header and the second header, with an electrical contact that extends continuously through the interposer toward conductive pads on the first and second headers. The interposer is movable between a first position where the electrical contact is spaced away from the at least one of the conductive pads, and a second position where the electrical contact electrically engages one of the conductive pads.

Abstract translation: 一种连接器系统，包括具有第一集管的第一壳体，所述第一集管包括与导体电连通的一个或多个导电焊盘。 第二壳体，其可与第一壳体配合并且包括位于配合面上的第二头部。 第二标头包括一个或多个导电焊盘，其与导体电接合并且与第一集管的一个或多个导电焊盘相对定位。 位于第一集管和第二集管之间的插入件，其具有电接触件，其连续延伸穿过插入件朝向第一和第二集管上的导电焊盘。 插入器可在第一位置和第二位置之间移动，该第一位置电触头与至少一个导电焊盘间隔开，而第二位置电触头与导电焊盘之一电接合。

公开(公告)号：US20050048807A1

公开(公告)日：2005-03-03

申请号：US10940457

申请日：2004-09-14

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01L23/48 ,  H01L23/498 ,  H01R13/33 ,  H05K3/32 ,  H01R13/15

CPC classification number: H01L23/49827 ,  G01R1/0466 ,  G01R1/06755 ,  H01L21/486 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R4/58 ,  H01R12/52 ,  H01R12/714 ,  H01R12/716 ,  H01R13/24 ,  H01R13/2407 ,  H01R13/33 ,  H05K3/325 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An electrical contact (2) and method of making the electrical contact (2), and a connector (11) and method making the connector (11), wherein the electrical contact (2) is an electrically conducting, interlaced mesh (40), with edges of the mesh providing multiple contact points for edgewise electrical connection of the electrical contact (2), wherein the mesh (40) is annealed while restrained in the form of the electrical contact (2) wherein the mesh (40) is free of internal elastic strain, or the mesh (40) is hardened, and wherein the connector (11) retains the electrical contact (2) for edgewise connection.

Abstract translation: 电触头（2）和制造电触点（2）的方法，以及制造连接器（11）的连接器（11）和方法，其中电触头（2）是导电的交织网（40）， 所述网状物的边缘为所述电接触件（2）的沿边电连接提供多个接触点，其中所述网状物（40）在电接触（2）的形式被退火，其中所述网状物（40）不含 内部弹性应变或网格（40）被硬化，并且其中连接器（11）保持用于沿边连接的电触点（2）。

公开(公告)号：US06712621B2

公开(公告)日：2004-03-30

申请号：US10055771

申请日：2002-01-23

Applicant: Che-Yu Li ,  Zhineng Fan ,  Dirk D. Brown

Inventor： Che-Yu Li ,  Zhineng Fan ,  Dirk D. Brown

IPC: H01R1200

CPC classification number: H01L23/3677 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/523 ,  H05K1/141 ,  H05K3/4641 ,  H05K7/1061 ,  H01L2924/00

Abstract: The present invention provides a heat spreading connector suitable for use with electronic components including those using land grid arrays and pin grid arrays and a method for its use. The connector of the present invention includes at least one dielectric layer and at least one thermally conductive layer.

Abstract translation: 本发明提供一种适用于电子部件的散热连接器，包括使用焊盘网格阵列和引脚格栅阵列的散热连接器及其使用方法。 本发明的连接器包括至少一个介电层和至少一个导热层。

公开(公告)号：US06661690B2

公开(公告)日：2003-12-09

申请号：US10077057

申请日：2002-02-19

Applicant: Sharon L. Moriarty ,  Zineng Fan ,  Dirk D. Brown ,  Che-Yu Li

Inventor： Sharon L. Moriarty ,  Zineng Fan ,  Dirk D. Brown ,  Che-Yu Li

IPC: G11C526

CPC classification number: H05K1/0246 ,  G11C5/04 ,  G11C5/063 ,  G11C2207/105 ,  H05K1/0231 ,  H05K1/0262 ,  H05K3/222 ,  H05K2201/10022

Abstract: A memory module with any combination of driver line terminators, power supply circuits, and components integral to a memory control subsystem mounted directly on the memory module for use with high speed, impedance-controlled memory buses. The memory module may be formed on a conventional printed circuit card with unpacked or packed memory chips attached directly to the memory module. Including the additional functionality directly on the memory modules improves the EMC/EMI performance as well as signal quality and integrity, thereby enhancing the memory subsystem performance. Such designs may also eliminate the need for bus exit connections, thereby allowing the freed-up connection capacity to be used to address additional memory capacity on the module. Another embodiment features a module with the additional features but without memory devices.

Abstract translation: 具有驱动器线路终端器，电源电路和与直接安装在存储器模块上用于与高速阻抗控制的存储器总线一起使用的存储器控​​制子系统的组件的存储器模块。 存储器模块可以形成在传统的印刷电路卡上，其具有直接连接到存储器模块的未包装或打包的存储器芯片。 在内存模块中直接添加附加功能可提高EMC / EMI性能以及信号质量和完整性，从而提高内存子系统的性能。 这样的设计也可以消除对总线出口连接的需要，从而允许自由连接容量用于解决模块上的附加存储器容量。 另一个实施例具有具有附加特征但没有存储器件的模块。

公开(公告)号：US06638077B1

公开(公告)日：2003-10-28

申请号：US09791342

申请日：2001-02-26

Applicant: Zhineng Fan ,  Ai D. Le ,  Che-Yu Li

Inventor： Zhineng Fan ,  Ai D. Le ,  Che-Yu Li

IPC: H01R909

CPC classification number: H05K1/145 ,  H01L23/49827 ,  H01L23/552 ,  H01L23/64 ,  H01L2223/6622 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15192 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0246 ,  H05K3/301 ,  H05K2201/10022 ,  H05K2201/10424 ,  H05K2201/10636 ,  H05K2203/167 ,  Y02P70/611 ,  H01L2224/0401

Abstract: A shielded carrier with electrical components is provided, resulting in LGA interposer connectors with improved electrical performance and enhanced functionality. The carrier includes components such as resistors and capacitors on and/or in the carrier. The components are preferably of the surface mount variety or are imbedded within the carrier, due to the inherent lower profile of these form factors. Decoupling capacitors and terminating resistors are two examples of components that may improve performance.

Abstract translation: 提供具有电气元件的屏蔽载体，从而导致具有改进的电气性能和增强功能的LGA插入器连接器。 载体在载体上和/或载体中包括诸如电阻器和电容器的组件。 由于这些形状因子的固有的较低的轮廓，这些部件优选地是表面安装型的或嵌入在载体内。 去耦电容和终端电阻是可以提高性能的组件的两个例子。

公开(公告)号：US06551112B1

公开(公告)日：2003-04-22

申请号：US10100667

申请日：2002-03-18

Applicant: Che-Yu Li ,  Zhineng Fan ,  Linh Van

Inventor： Che-Yu Li ,  Zhineng Fan ,  Linh Van

IPC: H01R1200

CPC classification number: G01R1/0466 ,  H01R13/2421 ,  H01R2201/20 ,  H05K3/325 ,  Y10S439/931

Abstract: An interconnection device is provided for temporary connection of a first electronic system to a second electronic system having a support substrate that includes an ordered array of conductive solder pads. A plurality of coil signal contacts are mounted to the conductive solder pads. Each one of the coil signal contacts comprises a central longitudinal axis, a top turn and a bottom turn that are arranged in spaced relation to one another. In this way, the bottom turn of one of the plurality of coil signal contacts is fastened to each of the conductive pads such that the top turns are spaced away from the support substrate.