公开(公告)号：JP2001201856A

公开(公告)日：2001-07-27

申请号：JP2000012838

申请日：2000-01-21

Applicant: DAICEL CHEM

Inventor： ARAI TAKASHI ,  TOUBOU KAZUHISA ,  AIDA SUSUMU

IPC: G03F7/039 ,  C08F2/00 ,  C08F20/18 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To produce a resin for photoresist of superior homogeneity and capable of giving a fine pattern with high resolution. SOLUTION: The resin for photoresist comprises a copolymer of a monomer A, having a relatively high rate of polymerization and a monomer B having a relatively low rate of polymerization. The resin-producing method comprises a preceding step, in which the monomers A and B are fed into a reaction system in such a way that the abundance ratio k between the monomers A and B in the reaction system (A/B: molar ratio) is made less than the composition ratio α between the monomers A and B in the copolymer (A/B; molar ratio) and the monomers are polymerized, and a subsequent step in which the remaining monomers are fed into the system and polymerized. A vinyl monomer having an alicyclic hydrocarbon skeleton may be used as the monomer B.

公开(公告)号：JP2001166463A

公开(公告)日：2001-06-22

申请号：JP34695999

申请日：1999-12-06

Applicant: DAICEL CHEM

Inventor： TSUTSUMI KIYOHARU ,  ARAI TAKASHI ,  TSUNO MASUMI ,  MICHITSU KUNIHIKO

IPC: H01L21/027 ,  C08F12/00 ,  C08F20/10 ,  G03F7/004 ,  G03F7/027

Abstract: PROBLEM TO BE SOLVED: To obtain a stable polymerizable compound for a photoresist less liable to cause decomposition. SOLUTION: The polymerizable compound used as a monomer of a polymer for a photoresist has

公开(公告)号：JP2000080131A

公开(公告)日：2000-03-21

申请号：JP24952598

申请日：1998-09-03

Applicant: DAICEL CHEM

Inventor： ARAI TAKASHI ,  YAMAGUCHI YOSHIAKI

IPC: C08L51/04 ,  C08F6/10 ,  C08F279/02

Abstract: PROBLEM TO BE SOLVED: To provide a preparative process for a rubber-modified styrenic resin which is capable of giving a molded article excellent gloss and mechanical properties such as impact resistance. SOLUTION: A preparative process for a rubber-modified styrenic resin contains the steps: a step of polymerizing a rubbery polymer and an aromatic vinyl monomer to such an extent that the rubbery polymer does not become dispersed particulates, a step of polymerizing the rubbery polymer and the aromatic vinyl monomer until the rubbery polymer has changed into dispersed particulates, and a step of the deaeration to remove unnecessary matters in the polymerization reaction liquid. In this process, an emulsion of silicone powder-water system is added prior to the deaeration step.

公开(公告)号：JPH06290499A

公开(公告)日：1994-10-18

申请号：JP10020493

申请日：1993-04-01

Applicant: SUMITOMO CHEMICAL CO ,  SUMITOMO METAL MINING CO ,  DAICEL CHEM

Inventor： ARAI TAKASHI ,  KAWABUCHI AKIRA ,  YOKOYAMA HIROYUKI ,  TAKATSUKA YUJI

IPC: G11B7/24 ,  G11B7/26 ,  G11B11/10 ,  G11B11/105

Abstract: PURPOSE:To prevent the coefft. of friction and abrasion wear of the magneto- optical disk and to prevent chipping of a recording film in spite of generation of a head clash. CONSTITUTION:A recording film 2 and a protective layer 3 are formed on a transparent substrate 1 constituting the optical disk. This protective layer 3 is composed of a resin layer 4 functioning as a buffer layer and an inorg. layer 5 consisting of an inorg. dielectric substance material and having high wear resistance. The recording film is composed of a dielectric substance interference layer, magneto-optical recording layer, dielectric substance protective layer and reflection layer formed on the transparent substrate 1. The surfaces of the resin layer 4 and the inorg. layer 5 may be smooth but may respectively have rough surface. The coefft. of friction is lowered while abrasion is suppressed if the inorg. layer 5 has a rough surface.

公开(公告)号：JP2001098025A

公开(公告)日：2001-04-10

申请号：JP27919499

申请日：1999-09-30

Applicant: DAICEL CHEM

Inventor： ARAI TAKASHI ,  TSUTSUMI KIYOHARU ,  NAGANO SHINYA

IPC: C08F2/00 ,  C08F2/06 ,  C08F20/28 ,  C08F20/30

Abstract: PROBLEM TO BE SOLVED: To provide a polymerization process which is useful for obtaining a uniform polymer from an acrylic monomer. SOLUTION: At least an acrylic monomer of formula I (wherein R1 is H or an alkyl group; R2 is a group containing a polycyclic aliphatic hydrocarbon ring; and n is an integer of from 1 to 3) is polymerized in at least one solvent chosen from alcohols, sulfoxides (dimethylsulfoxide or the like) and amides (dimethylformamide or the like). Here, alcohols may be used in combination with organic solvents [e.g. cyclic ethers (tetrahydrofuran, tetrahydropyran, dioxane or the like), ketones, esters and the like]. The weight ratio of the alcohols to the organic solvents (alcohols/organic solvents) is about from 50/50 to 99/1.

公开(公告)号：JP2000080244A

公开(公告)日：2000-03-21

申请号：JP24952498

申请日：1998-09-03

Applicant: DAICEL CHEM

Inventor： ARAI TAKASHI ,  YAMAGUCHI YOSHIAKI

IPC: C08L51/04

Abstract: PROBLEM TO BE SOLVED: To obtain a rubber-modified styrenic resin composition giving molded products having excellent surface glosses and excellent mechanical properties such as impact resistance. SOLUTION: This rubber-modified styrenic resin composition comprises 100 pts.wt. of a rubber-modified styrenic resin and 0.001-3.0 pts.wt. of a silicone elastomer powder having a rubber hardness of

公开(公告)号：JPH05298763A

公开(公告)日：1993-11-12

申请号：JP12686092

申请日：1992-04-20

Applicant: SUMITOMO CHEMICAL CO ,  SUMITOMO METAL MINING CO ,  DAICEL CHEM

Inventor： ARAI TAKASHI ,  KAWABUCHI AKIRA

IPC: C23C14/06 ,  C23C14/35 ,  G11B11/10 ,  G11B11/105

Abstract: PURPOSE:To allow adsorption, friction to scarcely occur even if a magnetic head is brought into contact with an organic resin protective layer at the time of starting/stopping and to prevent damage of a surface by suitably specifying a surface hardness and reducing a frictional coefficient of the surface. CONSTITUTION:Surface hardness of an organic resin protective layer 3 opposed directly to a levitation magnetic head is set to 3H to 9H by pencil hardness at 25 deg.C. The reason why the hardness is set to 3H or above is because an effect of low friction of the surface from this cannot be obtained. The reason why the hardness is set to 9H as an upper limit is because, when the hardness is increased thereover, it is apprehended that the head is damaged. Accordingly, even if the head is brought into contact with the layer 3 at the time of starting/ stopping by using a driver of a magnetic field modulation type, adsorption, friction scarcely occur to prevent damage of the surface.

公开(公告)号：JPH05159400A

公开(公告)日：1993-06-25

申请号：JP35030591

申请日：1991-12-09

Applicant: SUMITOMO CHEMICAL CO ,  SUMITOMO METAL MINING CO ,  DAICEL CHEM

Inventor： ARAI TAKASHI ,  AKIMOTO ETSUJI

IPC: C23C14/58 ,  G11B11/10 ,  G11B11/105

Abstract: PURPOSE:To decrease the deterioration in the characteristics occurring in a change in warpage with lapse of time. CONSTITUTION:The prescribed warpage is imparted to the optical information recording medium formed by using a substrate 1 and the unit contg. a recording layer 2 and org. resin protective layer 3 successively laminated on this substrate 2 as a single number in such a manner that the surface on the side mounted with the recording layer 2 and org. resin protective layer 3 of the substrate 1 is recessed. This warpage is set in a range from +1 to +4mrad warpage angle. The warpage of the direction opposite from the direction of the warpage to be generated in the optical information recording medium by a temp. change, etc., is previously applied and therefore, the absolute value of the warpage angle is deceased.

公开(公告)号：JP2009242809A

公开(公告)日：2009-10-22

申请号：JP2009174921

申请日：2009-07-28

Applicant: Daicel Chem Ind Ltd ,  ダイセル化学工業株式会社

Inventor： ARAI TAKASHI ,  MIZUTANI YOSHIHISA ,  ITOKAZU TERUO

IPC: C08F2/40 ,  C08F2/44 ,  C08F220/18 ,  G03F7/039

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a polymer for photoresist in which a microscopic pattern can be formed without causing an insoluble material during alkaline development, with high clearness and precision.
SOLUTION: A method of manufacturing a copolymer for photoresist includes as follows. A specific (meth)acrylic ester, a (meth)acrylic ester composition for synthesis of a polymer for photoresist having no acid leaving group to develop alkali solubility by leaving a part thereof with an acid, in which content of an oligomer of the (meth)acrylic ester is ≤2000 wt.ppm, is manufactured by making an alcohol and a (meth)acrylic acid halide corresponding to the (meth)acrylic ester react under existence of a base and a polymerization inhibitor, then, the copolymer for photoresist is manufactured by making the (meth)acrylic ester composition for synthesis of the polymer for photoresist and a polymerizable monomer having an acid leaving group to develop alkali solubility by leaving a part thereof with an acid copolymerize.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种制造光致抗蚀剂的聚合物的方法，其中可以形成微观图案，而不会在碱性显影期间不引起不溶物质，而且清晰度和精度高。 光致抗蚀剂共聚物的制造方法如下。 一种特定的（甲基）丙烯酸酯，（甲基）丙烯酸酯组合物，其用于合成无酸离子基团的光致抗蚀剂聚合物，通过留下一部分酸而产生碱溶解性，其中（甲基） ）丙烯酸酯的含量为≤2000重量ppm，通过制备醇和与（甲基）丙烯酸酯对应的（甲基）丙烯酸酰卤在碱和阻聚剂存在下反应，然后光刻胶共聚物为 通过制备用于合成光致抗蚀剂用聚合物的（甲基）丙烯酸酯组合物和具有酸性离去基团的可聚合单体以通过使其部分酸共聚来显示碱溶解性而制备。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009067883A

公开(公告)日：2009-04-02

申请号：JP2007237448

申请日：2007-09-13

Applicant: Daicel Chem Ind Ltd ,  ダイセル化学工業株式会社

Inventor： ARAI TAKASHI ,  ITOKAZU TERUO

IPC: C08F220/28 ,  C07D311/94 ,  G03F7/039 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a photoresist resin keeping stability of chemical resistance and the like, excellent in organic solvent solubility, improving hydrolyzability and/or water solubility after hydrolysis, and exhibiting high etching resistance, and to provide a composition of the resin. SOLUTION: A monomer for photoresists, represented by formula (I) [wherein, R a represents H, a halogen atom or a (halogen atom-containing) 1-6C alkyl group; R 1 represents a methyl group; and A represents a methylene group, O or S] is provided. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：为了提供保持耐化学性等的稳定性的光致抗蚀剂树脂，有机溶剂溶解性优异，水解后水解性和/或水溶性提高，耐腐蚀性高，并且提供组合物 树脂。 解决方案：由式（I）表示的光致抗蚀剂单体[其中，R SP表示H，卤素原子或（含卤素原子）1-6C烷基; R SP 1表示甲基; 并且A表示亚甲基，O或S]。 版权所有（C）2009，JPO＆INPIT