MICROCAPILLARY WIRE COATING DIE ASSEMBLY

    公开(公告)号:CA3045107A1

    公开(公告)日:2018-06-07

    申请号:CA3045107

    申请日:2017-11-13

    Abstract: Polymeric coatings comprising microcapillary structures are applied to a wire or optic fiber using a wire coating apparatus comprising a die (13) assembly comprising a mandrel assembly (16) comprising: (A) a housing (12) comprising: (1) a housing (12) wire tubular channel extending along (a) the length of the housing (12), and (b) the longitudinal centerline axis of the housing (12); (2) a fluid annular channel encircling the wire tubular channel; (3) a fluid ring (28) in fluid communication with the fluid annular channel, the fluid ring (28) positioned at one end of the housing (12); and (B) a cone-shaped tip having a wide end and a narrow end, the wide end of the tip attached to the end of the housing (12) at which the fluid ring (28) is positioned, the tip comprising: (1) a tip wire tubular channel extending along (a) the length of the tip, and (b) the longitudinal centerline axis of the tip; (2) a tip fluid channel (27) in fluid communication with the fluid ring (28); and (3) one or more nozzles (29A) in fluid communication with the tip fluid channel (27), the nozzles (29A) located at the end and extending beyond the narrow end of the tip; the housing (12) wire tubular channel and the tip wire tubular channel in open communication with one another such that a wire can pass from one to the other in a straight line and without interruption.

    LIQUID COOLING MEDIUM FOR ELECTRONIC DEVICE COOLING

    公开(公告)号:CA2897962A1

    公开(公告)日:2014-07-31

    申请号:CA2897962

    申请日:2013-12-17

    Abstract: Liquid cooling mediums employed to immersion-cool electronic hardware devices. Such liquid cooling mediums have a flash point of at least 190 °C, as determined according to ASTM D92, and a viscosity of 27 centistokes ("cSt") or less at 40 °C, as determined according to ASTM D445. Such liquid cooling mediums can be employed to immersion-cool such devices as computer servers, server motherboards, and microprocessors.

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