公开(公告)号：US20160074989A1

公开(公告)日：2016-03-17

申请号：US14854530

申请日：2015-09-15

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Keisuke NAMIKI

IPC: B24B37/005 ,  B24B37/04 ,  H01L21/306

CPC classification number: B24B37/005 ,  B24B37/042 ,  H01L21/31053 ,  H01L21/3212

Abstract: A polishing apparatus capable of eliminating a variation in film thickness along a circumferential direction of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a polishing head including an elastic membrane for pressing the substrate against the polishing surface and a retainer ring arranged so as to surround the substrate, the retainer ring being capable of contacting the polishing surface; a rotating mechanism configured to rotate the polishing head about its own axis; a rotation angle detector configured to detect a rotation angle of the polishing head; and a polishing controller configured to periodically change a polishing condition of the substrate in synchronization with the rotation angle of the polishing head.

Abstract translation: 公开了能够消除诸如晶片等基板的周向的膜厚变化的研磨装置。 抛光装置包括：抛光头，其包括用于将基板压靠在抛光表面上的弹性膜和设置成围绕基板的保持环，保持环能够与抛光表面接触; 旋转机构，其构造成使抛光头围绕其自身的轴线旋转; 旋转角度检测器，被配置为检测抛光头的旋转角度; 以及抛光控制器，被配置为与抛光头的旋转角度同步地周期性地改变基板的抛光状态。

公开(公告)号：US20140065934A1

公开(公告)日：2014-03-06

申请号：US14011626

申请日：2013-08-27

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Osamu NABEYA ,  Shingo TOGASHI

IPC: B24B37/30

CPC classification number: B24B37/30

Abstract: An elastic membrane is used in a substrate holding apparatus for holding a substrate such as a semiconductor wafer and pressing the substrate against a polishing surface. The elastic membrane includes a plurality of concentrically circumferential walls configured to define a plurality of pressurizing areas for pressing the substrate. The pressurizing areas includes a central pressurizing area located at a central part of the elastic membrane, an annular edge pressurizing area located at the outermost part of the elastic membrane, and a plurality of intermediate pressurizing areas located between the central pressurizing area and the annular edge pressurizing area. The area width of at least one of the intermediate pressurizing areas is set in a range to allow a polishing rate responsive width not to vary even when the area width is varied.

Abstract translation: 在用于保持诸如半导体晶片的基板并将基板压靠在抛光表面上的基板保持装置中使用弹性膜。 弹性膜包括多个同心圆周壁，其被配置为限定用于按压基板的多个加压区域。 加压区域包括位于弹性膜的中央部的中央加压区域，位于弹性膜的最外部的环状边缘加压区域和位于中央加压区域与环状边缘之间的多个中间加压区域 加压区域。 至少一个中间加压区域的面积宽度被设定在允许抛光速率响应宽度即使当面积宽度变化时也不变化的范围内。

公开(公告)号：US20130324012A1

公开(公告)日：2013-12-05

申请号：US13905763

申请日：2013-05-30

Applicant: Ebara Corporation

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Shingo TOGASHI ,  Satoru YAMAKI

IPC: B24B37/005 ,  B24B7/22 ,  B24B37/04 ,  B24B37/07 ,  B24B37/32

CPC classification number: B24B37/005 ,  B24B7/228 ,  B24B37/042 ,  B24B37/07 ,  B24B37/32 ,  B24B49/16

Abstract: A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface configured to press the substrate against the polishing surface, a retaining ring coupled to the substrate holding surface and configured to surround the substrate, wherein the retaining ring is brought into contact with the polishing surface during operation of the polishing apparatus, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface, the at least one local load exerting mechanism being arranged so as not to move in accordance with the substrate holder.

Abstract translation: 抛光装置通过使基板与抛光表面滑动接触来抛光基板。 抛光装置包括：基板保持器，其具有被配置为将基板压靠在抛光表面上的基板保持表面;保持环，其联接到基板保持表面并且构造成围绕基板，其中保持环与抛光接触 所述保持环被构造成可以独立于所述基板保持表面倾斜; 旋转机构，其构造成使所述衬底保持器围绕其自身的轴线旋转; 以及至少一个局部负载施加机构，其被构造成沿与所述抛光表面垂直的方向在所述保持环的一部分上施加局部负载，所述至少一个局部负载施加机构被布置成不依照所述衬底移动 持有人

公开(公告)号：US20240316720A1

公开(公告)日：2024-09-26

申请号：US18734791

申请日：2024-06-05

Applicant: Ebara Corporation

Inventor： Koichi TAKEDA ,  Tsuneo TORIKOSHI ,  Kunio OISHI ,  Katsuhide WATANABE ,  Hozumi YASUDA ,  Yu ISHII

IPC: B24B37/005 ,  B24B37/12 ,  B24B37/14 ,  B24B49/03 ,  B24B49/04 ,  B24B55/06 ,  H01L21/304

CPC classification number: B24B37/005 ,  B24B37/12 ,  B24B37/14 ,  B24B49/03 ,  B24B49/04 ,  B24B55/06 ,  H01L21/304

Abstract: A local polishing system comprises: a particle estimation unit (30) for estimating the film thickness distribution of a wafer; a local polishing region setting unit (11) for setting a local polishing region on the wafer based on the film thickness distribution; a polishing head selection unit (12) for selecting a polishing head based on the size of the local polishing region; a model storage (20) holding a recipe generating model that defines the relation between an input node and an output node, the input node being an attribute of the local polishing region, the output node comprising a recipe for a polishing process; a polishing recipe generator (13) that puts an attribute of the local polishing region set by the local polishing region setting unit (11) into the input node of the recipe generating model and determines a polishing recipe for polishing the local polishing region; and a polishing recipe transmitter (15) for transmitting data of the polishing recipe to a local polishing module (200) that performs local polishing.

公开(公告)号：US20200269383A1

公开(公告)日：2020-08-27

申请号：US16495010

申请日：2018-01-10

Applicant: Ebara Corporation

Inventor： Hozumi YASUDA ,  Itsuki KOBATA ,  Nobuyuki TAKAHASHI ,  Suguru SAKUGAWA

IPC: B24B53/017 ,  B24B37/005 ,  B24B53/12

Abstract: Provided is a polishing device for appropriately retaining a polishing member in an appropriate state in polishing. The polishing device for partially polishing a substrate includes a polishing member having a processing surface which comes into contact with the substrate and which is smaller than the substrate, a conditioning member for performing conditioning on the polishing member, a first pressing mechanism for pressing the conditioning member against the polishing member in polishing the substrate, and a control unit for controlling an operation of the polishing device. The control unit is configured to control the first pressing mechanism when the substrate is partially polished by the polishing member.

公开(公告)号：US20190240799A1

公开(公告)日：2019-08-08

申请号：US16338931

申请日：2017-09-07

Applicant: Ebara Corporation

Inventor： Koichi TAKEDA ,  Tsuneo TORIKOSHI ,  Kunio OISHI ,  Katsuhide WATANABE ,  Hozumi YASUDA ,  Yu ISHII

IPC: B24B37/005 ,  B24B37/14 ,  B24B49/03 ,  B24B49/04 ,  B24B55/06 ,  H01L21/304

CPC classification number: B24B37/005 ,  B24B37/12 ,  B24B37/14 ,  B24B49/03 ,  B24B49/04 ,  B24B55/06 ,  H01L21/304

Abstract: A local polishing system comprises: a particle estimation unit (30) for estimating the film thickness distribution of a wafer; a local polishing region setting unit (11) for setting a local polishing region on the wafer based on the film thickness distribution; a polishing head selection unit (12) for selecting a polishing head based on the size of the local polishing region; a model storage (20) holding a recipe generating model that defines the relation between an input node and an output node, the input node being an attribute of the local polishing region, the output node comprising a recipe for a polishing process; a polishing recipe generator (13) that puts an attribute of the local polishing region set by the local polishing region setting unit (11) into the input node of the recipe generating model and determines a polishing recipe for polishing the local polishing region; and a polishing recipe transmitter (15) for transmitting data of the polishing recipe to a local polishing module (200) that performs local polishing.

公开(公告)号：US20160243670A1

公开(公告)日：2016-08-25

申请号：US15052540

申请日：2016-02-24

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Keisuke NAMIKI

IPC: B24B37/32

CPC classification number: B24B37/32

Abstract: According to one embodiment, a retainer ring for retaining a substrate to be polished, includes: an inside ring arranged to enclose the substrate; and an outside ring arranged outside the inside ring, abrasion-resistant of the outside ring being higher than abrasion-resistant of the inside ring, wherein the inside ring having a thickness in a radial direction in a range from a minimum of 0.05 mm to a maximum of 5 mm.

Abstract translation: 根据一个实施例，用于保持要抛光的基底的保持环包括：内环，其布置成包围基底; 以及设置在所述内圈的外侧的外圈，所述外圈的耐磨性高于所述内圈的耐磨性，其中，所述内圈的径向厚度为0.05mm以下的范围 最大5毫米。

公开(公告)号：US20150273657A1

公开(公告)日：2015-10-01

申请号：US14668844

申请日：2015-03-25

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Shingo TOGASHI ,  Satoru YAMAKI ,  Shintaro ISONO

IPC: B24B37/30

CPC classification number: B24B37/30

Abstract: An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion. The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.

Abstract translation: 公开了一种能够精确地控制晶片边缘部分的狭窄区域中的抛光轮廓的弹性膜。 弹性膜包括与基板接触的接触部分; 从所述接触部分的周缘向上延伸的第一边缘周向壁; 以及第二边缘周壁，其具有连接到所述第一边缘周壁的内周表面的水平部分。 第一边缘周壁的内圆周表面包括两个垂直于接触部分的上内圆周表面和下内圆周表面。 上部内周面从第二边缘周壁的水平部分向上延伸，下部内圆周表面从水平部分向下延伸。

公开(公告)号：US20150133038A1

公开(公告)日：2015-05-14

申请号：US14537809

申请日：2014-11-10

Applicant: Ebara Corporation

Inventor： Satoru YAMAKI ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Makoto FUKUSHIMA ,  Shingo TOGASHI

IPC: B24B37/32 ,  B24B37/10

CPC classification number: B24B37/32 ,  B24B37/04 ,  B24B37/107

Abstract: A substrate holder capable of preventing an increase in a polishing rate of an edge portion of a substrate, even when polishing a plurality of substrates successively, is disclosed. The substrate holder includes: a top ring body configured to hold the substrate; and a retaining ring disposed so as to surround the substrate held by the top ring body. The retaining ring includes a pad pressing structure in an annular shape which is to be brought into contact with the polishing pad and the pad pressing structure has a width in a range of 3 mm to 7.5 mm.

Abstract translation: 公开了即使在连续地研磨多个基板的情况下也能够防止基板的边缘部的研磨速度的提高的基板保持架。 衬底保持器包括：构造成保持衬底的顶环体; 以及保持环，其设置成围绕由顶环体保持的基板。 保持环包括与抛光垫接触的环状的垫压结构，垫压结构的宽度在3mm至7.5mm的范围内。

公开(公告)号：US20150093968A1

公开(公告)日：2015-04-02

申请号：US14563358

申请日：2014-12-08

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Katsuhide WATANABE ,  Hozumi YASUDA ,  Satoru YAMAKI

IPC: B24B37/015 ,  H01L21/67 ,  B24B37/30 ,  H01L21/683

CPC classification number: B24B37/005 ,  B24B37/015 ,  B24B37/10 ,  B24B37/30 ,  H01L21/67017 ,  H01L21/67092 ,  H01L21/6838

Abstract: A polishing is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to forma substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.