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公开(公告)号：SE518269C2
公开(公告)日：2002-09-17
申请号：SE9801528
申请日：1998-04-30
Applicant: ERICSSON TELEFON AB L M
Inventor： LIGANDER PER
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公开(公告)号：AU4968500A
公开(公告)日：2000-12-05
申请号：AU4968500
申请日：2000-05-18
Applicant: ERICSSON TELEFON AB L M
Inventor： BERGSTEDT LEIF , LIGANDER PER
IPC: H01L23/12 , H01L21/48 , H01L23/15 , H01L23/36 , H01L23/373
Abstract: A carrier intended for one or several electronic components and having spaces provided for the components on at least one surface is provided. The carrier has an at least partly conductive Low Temperature Cofire Ceramic (LTCC) material with good thermal conduction capacity, so that the carrier provides mechanical support for the components and conducts heat generated by the components.
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公开(公告)号：SE513786C2
公开(公告)日：2000-11-06
申请号：SE9900840
申请日：1999-03-09
Applicant: ERICSSON TELEFON AB L M
Inventor： BERGSTEDT LEIF , LIGANDER PER
Abstract: A component (16) mounted on the board (20) is cooled by a cooling surface (15) in contact with a heat sink element in the form of a metal stud (8) which, in turn, may be connected to an outer cooling surface. One method of achieving this is to form holes (4) in a laminate (1), etching patterns (5), placing a metal stud (8) in the hole (4), applying a dielectric (9) to the upper and lower side of the laminate (1), forming openings (14) in the dielectric (9), and thereafter metal plating the entire circuit board and etching further patterns. Component 16 can then be mounted on the printed circuit board (20). A heat sink element (8) includes a cutting edge (18) and can be used beneficially in conjunction with one embodiment of the method.
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公开(公告)号：SE9803392L
公开(公告)日：2000-04-07
申请号：SE9803392
申请日：1998-10-06
Applicant: ERICSSON TELEFON AB L M
Inventor： BERGSTEDT LEIF , LIGANDER PER , BOUSTEDT KATARINA
Abstract: Methods of manufacturing a printed board assembly. In one embodiment, a substrate is coated with an electrically conducting material; electrical components are mounted on some areas of the substrate; non-conducting material is disposed in areas between the electrical components; the substrate, electrical components and non-conducting material are sandwiched between two sheets of resin coated conducting foil, wherein the resin on the foils faces the substrate and buries the electrical components; circuit patterns are etched in the exposed surfaces of the resin coated conducting foils; and, electrical connections are established between at least one of the resin coated conducting foils and the electronic components.
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公开(公告)号：SE512578C2
公开(公告)日：2000-04-03
申请号：SE9703128
申请日：1997-08-29
Applicant: ERICSSON TELEFON AB L M
Inventor： LIGANDER PER , BERGSTEDT LEIF
Abstract: The invention relates to a method and an apparatus for making an air gap (L, 1a) over at least one conductor (5, 5a) on a printed circuit board (1), minimizing the losses in the conductor (5, 5a). The well known Sequential Build Up (SBU) technology is used, wherein a carrier (3) with the conductor (5, 5a) is covered by a photosensitive varnish layer (7, 7a). An opening (8, 8a) is made in the varnish layer (7, 7a) above the conductor (5, 5a) by a photographic method. A metal layer (11, 11a) is then fastened to the varnish layer (7, 7a) covering at least said opening 88, 8a) so that an air gap (L, 1a) is formed between the conductor (5, 5a) and the metal layer (11, 11a). The resulting circuit board (1) has an air gap (L, 1a) well adapted to the conductor (5, 5a). According to an alternative inventive method the carrier (3) also comprises a lower conductor (5b) placed opposite to the conductor (5a) described above on the opposite side of the carrier. In the same way as above the lower carrier (5b) is provided with an air gap (1b). A layer (13) of dielectric material can be fixed to the metal layer (11) to obtain a more rigid construction.
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Patent Agency Ranking
公开(公告)号：SE9901831D0
公开(公告)日：1999-05-19
申请号：SE9901831
申请日：1999-05-19
Applicant: ERICSSON TELEFON AB L M
Inventor： BERGSTEDT LEIF , LIGANDER PER
Abstract: A carrier intended for one or several electronic components and having spaces provided for the components on at least one surface is provided. The carrier has an at least partly conductive Low Temperature Cofire Ceramic (LTCC) material with good thermal conduction capacity, so that the carrier provides mechanical support for the components and conducts heat generated by the components.
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公开(公告)号：AU9012398A
公开(公告)日：1999-03-22
申请号：AU9012398
申请日：1998-08-25
Applicant: ERICSSON TELEFON AB L M
Inventor： LIGANDER PER , BERGSTEDT LEIF
Abstract: The invention relates to a method and an apparatus for making an air gap (L, 1a) over at least one conductor (5, 5a) on a printed circuit board (1), minimizing the losses in the conductor (5, 5a). The well known Sequential Build Up (SBU) technology is used, wherein a carrier (3) with the conductor (5, 5a) is covered by a photosensitive varnish layer (7, 7a). An opening (8, 8a) is made in the varnish layer (7, 7a) above the conductor (5, 5a) by a photographic method. A metal layer (11, 11a) is then fastened to the varnish layer (7, 7a) covering at least said opening 88, 8a) so that an air gap (L, 1a) is formed between the conductor (5, 5a) and the metal layer (11, 11a). The resulting circuit board (1) has an air gap (L, 1a) well adapted to the conductor (5, 5a). According to an alternative inventive method the carrier (3) also comprises a lower conductor (5b) placed opposite to the conductor (5a) described above on the opposite side of the carrier. In the same way as above the lower carrier (5b) is provided with an air gap (1b). A layer (13) of dielectric material can be fixed to the metal layer (11) to obtain a more rigid construction.
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公开(公告)号：SE9703128L
公开(公告)日：1999-03-01
申请号：SE9703128
申请日：1997-08-29
Applicant: ERICSSON TELEFON AB L M
Inventor： LIGANDER PER , BERGSTEDT LEIF
Abstract: The invention relates to a method and an apparatus for making an air gap (L, 1a) over at least one conductor (5, 5a) on a printed circuit board (1), minimizing the losses in the conductor (5, 5a). The well known Sequential Build Up (SBU) technology is used, wherein a carrier (3) with the conductor (5, 5a) is covered by a photosensitive varnish layer (7, 7a). An opening (8, 8a) is made in the varnish layer (7, 7a) above the conductor (5, 5a) by a photographic method. A metal layer (11, 11a) is then fastened to the varnish layer (7, 7a) covering at least said opening 88, 8a) so that an air gap (L, 1a) is formed between the conductor (5, 5a) and the metal layer (11, 11a). The resulting circuit board (1) has an air gap (L, 1a) well adapted to the conductor (5, 5a). According to an alternative inventive method the carrier (3) also comprises a lower conductor (5b) placed opposite to the conductor (5a) described above on the opposite side of the carrier. In the same way as above the lower carrier (5b) is provided with an air gap (1b). A layer (13) of dielectric material can be fixed to the metal layer (11) to obtain a more rigid construction.
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公开(公告)号：AU7948298A
公开(公告)日：1999-01-19
申请号：AU7948298
申请日：1998-06-16
Applicant: ERICSSON TELEFON AB L M
Inventor： BERGSTEDT LEIF , LIGANDER PER
Abstract: An environmentally compatible microstrip structure for electromagnetic signals in the microwave frequency range and higher. The microstrip structure according to the invention comprises at least two dielectric bodies made of an inorganic non-metallic material. Conductors of the microstrip structure are disposed on a first dielectric body. The ground plane of the microstrip structure is disposed on a second dielectric body. The dielectric bodies are so oriented that the second dielectric is between the at least one conductor and the ground plane while the first dielectric body is not. At least one cavitity is formed in the second dielectric body around at least one of the conductors to thereby create a composite dielectric comprising gas/air/vacuum of the cavity and the second dielectric body. The composite dielectric giving the microstrip structure adequate performance with dielectrically poor but environmentally compatible dielectric materials forming the dielectric bodies.
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公开(公告)号：SE9803204D0
公开(公告)日：1998-09-21
申请号：SE9803204
申请日：1998-09-21
Applicant: ERICSSON TELEFON AB L M
Inventor： BOUSTEDT KATARINA , BERGSTEDT LEIF , LIGANDER PER
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