21.
    发明专利
    未知

    公开(公告)号:AT502973T

    公开(公告)日:2011-04-15

    申请号:AT01272033

    申请日:2001-12-20

    Applicant: ESSILOR INT

    Abstract: A process for making a stabilized, liquid, diepisulfide based prepolymer having a viscosity at 25 C. ranging from 20 to 330000 centipoises which comprises polymerizing at room temperature a monomer composition comprising at least one diepisulfide monomer in the presence of at least one anionic polymerization initiator and at least one halogenated polymerization inhibitor and compositions made therefrom.

    Photocurable adhesive composition and its use in the optical field

    公开(公告)号:AU2004230413C1

    公开(公告)日:2011-01-27

    申请号:AU2004230413

    申请日:2004-04-15

    Applicant: ESSILOR INT

    Abstract: The invention concerns a photocurable adhesive composition comprising, based on total weight of photopolymerizable monomers and/or oligomers of the composition: 5 to 60 wt % of at least one mono or polyacrylate monomer or oligomer thereof (A); 5 to 50 wt % of at least one thio(meth)acrylate monomer or oligomer thereof (B); and 20 to 50 wt % of at least one aromatic dimethacrylate monomer or oligomer thereof (C); with the proviso that the composition does not contain a brominated monofunctional acrylate.

    Photocurable adhesive composition and its use in the optical field

    公开(公告)号:AU2004230413B2

    公开(公告)日:2010-03-11

    申请号:AU2004230413

    申请日:2004-04-15

    Applicant: ESSILOR INT

    Abstract: The invention concerns a photocurable adhesive composition comprising, based on total weight of photopolymerizable monomers and/or oligomers of the composition: 5 to 60 wt % of at least one mono or polyacrylate monomer or oligomer thereof (A); 5 to 50 wt % of at least one thio(meth)acrylate monomer or oligomer thereof (B); and 20 to 50 wt % of at least one aromatic dimethacrylate monomer or oligomer thereof (C); with the proviso that the composition does not contain a brominated monofunctional acrylate.

    24.
    发明专利
    未知

    公开(公告)号:DE602004016990D1

    公开(公告)日:2008-11-20

    申请号:DE602004016990

    申请日:2004-04-15

    Applicant: ESSILOR INT

    Abstract: The invention concerns a photocurable adhesive composition comprising, based on total weight of photopolymerizable monomers and/or oligomers of the composition: 5 to 60 wt % of at least one mono or polyacrylate monomer or oligomer thereof (A); 5 to 50 wt % of at least one thio(meth)acrylate monomer or oligomer thereof (B); and 20 to 50 wt % of at least one aromatic dimethacrylate monomer or oligomer thereof (C); with the proviso that the composition does not contain a brominated monofunctional acrylate.

    25.
    发明专利
    未知

    公开(公告)号:DE60112261T2

    公开(公告)日:2006-03-30

    申请号:DE60112261

    申请日:2001-02-02

    Applicant: ESSILOR INT

    Abstract: A process for polymerizing/curing a photopolymerizable monomer composition comprising at least one diepisulfide monomer which comprises the steps of:a) mixing to the monomer composition an effective amount of a cationic photopolymerization initiator, andb) irradiating the mixture of a) with an ultraviolet radiation to at least partially cationically photopolymerize the monomer composition.

    29.
    发明专利
    未知

    公开(公告)号:AT449808T

    公开(公告)日:2009-12-15

    申请号:AT02751086

    申请日:2002-06-28

    Applicant: ESSILOR INT

    Abstract: The present invention relates to room temperature or thermally polymerizable/curable episulfide based compositions for making polymerized/cured episulfide based resins, and in particular episulfide based compositions which can be fastly polymerized/cured, as well as to a room temperature or thermal polymerization process for making such episulfide based resins.

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