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    METHOD OF FORMING A DEVICE WITH A PIEZOELECTRIC TRANSDUCER
    21.
    发明专利
    METHOD OF FORMING A DEVICE WITH A PIEZOELECTRIC TRANSDUCER 未知

    公开(公告)号：HK1163345A1

    公开(公告)日：2012-09-07

    申请号：HK12103670

    申请日：2008-02-06

    Applicant: FUJIFILM DIMATIX INC

    Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  MENZEL CHRISTOPH ,  HOISINGTON PAUL A

    IPC: H01L20060101 ,  B41J20060101

    Abstract: A method of forming a microelectromechanical device with a piezoelectric transducer is described, the method comprising the steps of bonding a first surface of a body of piezoelectric material (107) to a first surface of a handle layer (135); forming alignment cuts (171) into a second surface of the body of piezoelectric material, the alignment cuts extending entirely through the body of piezoelectric material and partially into the handle layer; after forming the alignment cuts, attaching the second surface of the body of piezoelectric material to a device body; and after attaching the body of piezoelectric material to the device body, removing the handle layer from the first surface of the body of piezoelectric material.

    PRINT HEAD NOZZLE FORMATION
    23.
    发明专利
    PRINT HEAD NOZZLE FORMATION 未知

    公开(公告)号：HK1104263A1

    公开(公告)日：2008-01-11

    申请号：HK07112674

    申请日：2007-11-21

    Applicant: FUJIFILM DIMATIX INC

    Inventor： CHEN ZHENFANG ,  BIBL ANDREAS ,  HOISINGTON PAUL A

    IPC: B41J20060101

    Abstract: Techniques are provided for forming nozzles in a microelectromechanical device. The nozzles are formed in a layer prior to the layer being bonded onto another portion of the device. Forming the nozzles in the layer prior to bonding enables forming nozzles that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles can reduce the resistance to ink flow as well as improve the uniformity of the nozzles across the microelectromechanical device.

    BONDED MICROELECTROMECHANICAL ASSEMBLIES
    28.
    发明申请
    BONDED MICROELECTROMECHANICAL ASSEMBLIES 审中-公开
    粘结微电子机械组件

    公开(公告)号：WO2010088111A2

    公开(公告)日：2010-08-05

    申请号：PCT/US2010021470

    申请日：2010-01-20

    Applicant: FUJIFILM DIMATIX INC ,  HOISINGTON PAUL A ,  TORREY MARC A

    Inventor： HOISINGTON PAUL A ,  TORREY MARC A

    IPC: B81C1/00 ,  B41J2/045 ,  B81B7/02 ,  H01L21/60

    CPC classification number: B81C1/00904 ,  B81B2201/058 ,  B81C1/00119 ,  B81C2201/0143 ,  B81C2201/019

    Abstract: A MEMS device is described that has a body with a component bonded to the body. The body has a main surface and a side surface adjacent to the main surface and smaller than the main surface. The body is formed of a material and the side surface is formed of the material and the body is in a crystalline structure different from the side surface. The body includes an outlet in the side surface and the component includes an aperture in fluid connection with the outlet.

    Abstract translation: 描述了一种MEMS器件，其具有与部件结合在一起的本体。 主体具有主表面和与主表面相邻并且小于主表面的侧表面。 主体由材料形成并且侧表面由材料形成并且主体处于与侧表面不同的晶体结构中。 该主体在侧表面中包括出口，并且该部件包括与出口流体连接的孔。

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