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公开(公告)号:JP2011156873A
公开(公告)日:2011-08-18
申请号:JP2011089638
申请日:2011-04-13
Applicant: Fujifilm Dimatix Inc , フジフィルム ディマティックス, インコーポレイテッド
Inventor: CHEN ZHENFANG , BIBL ANDREAS , HOISINGTON PAUL A
CPC classification number: B41J2/1623 , B41J2/162 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1645
Abstract: PROBLEM TO BE SOLVED: To provide a technique including a method and device for forming nozzles in a microelectromechanical device such as an ink jet print head.
SOLUTION: The nozzles 460 are formed in a layer 420 prior to the layer 420 being bonded onto another portion 440 of the device. Forming the nozzles 460 in the layer 420 prior to bonding enables forming nozzles 460 that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles 460 can reduce the resistance to ink flow as well as improve the uniformity of the nozzles 460 across the microelectromechanical device.
COPYRIGHT: (C)2011,JPO&INPITAbstract translation: 要解决的问题:提供一种包括在诸如喷墨打印头的微电子机械装置中形成喷嘴的方法和装置的技术。 解决方案:在层420结合到装置的另一部分440之前,喷嘴460形成在层420中。 在接合之前在层420中形成喷嘴460可形成具有期望深度和期望几何形状的喷嘴460。 为喷嘴460选择特定的几何形状可以降低油墨流动的阻力,并且可以改善穿过微机电装置的喷嘴460的均匀性。 版权所有(C)2011,JPO&INPIT
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公开(公告)号:HK1104263A1
公开(公告)日:2008-01-11
申请号:HK07112674
申请日:2007-11-21
Applicant: FUJIFILM DIMATIX INC
Inventor: CHEN ZHENFANG , BIBL ANDREAS , HOISINGTON PAUL A
IPC: B41J20060101
Abstract: Techniques are provided for forming nozzles in a microelectromechanical device. The nozzles are formed in a layer prior to the layer being bonded onto another portion of the device. Forming the nozzles in the layer prior to bonding enables forming nozzles that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles can reduce the resistance to ink flow as well as improve the uniformity of the nozzles across the microelectromechanical device.
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公开(公告)号:HK1208213A1
公开(公告)日:2016-02-26
申请号:HK15108767
申请日:2015-09-09
Applicant: FUJIFILM DIMATIX INC
Inventor: CHEN ZHENFANG , BIRKMEYER JEFFREY
IPC: C03C20060101 , C23F20060101 , H01L41/22
Abstract: Techniques are described for forming actuators having piezoelectric material. A block of piezoelectric material is bonded to a transfer substrate. The block is then polished. The polished surface is bonded to a MEMS body.
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公开(公告)号:HK1097229A1
公开(公告)日:2007-06-22
申请号:HK07104236
申请日:2007-04-23
Applicant: FUJIFILM DIMATIX INC
Inventor: CHEN ZHENFANG , BIBL ANDREAS , BIRKMEYER JEFFREY
IPC: B41J20100101 , B41J2/14 , B41J2/155 , B41J2/16
Abstract: A microfabricated device and method for forming a microfabricated device are described. A thin membrane including silicon (630) is formed on a silicon body (25) by bonding a silicon-on-insulator substrate (685) to a silicon substrate. The handle and insulator layers (695,690) of the silicon-on-insulator substrate are removed, leaving a thin membrane of silicon bonded to a silicon body such that no intervening layer of insulator material remains between the membrane and the body. A piezoelectric layer is bonded to the membrane.
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公开(公告)号:HK1218278A1
公开(公告)日:2017-02-10
申请号:HK16106303
申请日:2016-06-02
Applicant: FUJIFILM DIMATIX INC
Inventor: CHEN ZHENFANG , BIBL ANDREAS , HOISINGTON PAUL A A
IPC: B41J20060101 , B32B20060101
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公开(公告)号:HK1126180A1
公开(公告)日:2009-08-28
申请号:HK09104916
申请日:2009-06-01
Applicant: FUJIFILM DIMATIX INC
Inventor: CHEN ZHENFANG , BIRKMEYER JEFFREY
IPC: H01L41/22
Abstract: Techniques are described for forming actuators having piezoelectric material. A block of piezoelectric material is bonded to a transfer substrate. The block is then polished. The polished surface is bonded to a MEMS body.
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公开(公告)号:EP2021298A4
公开(公告)日:2012-08-01
申请号:EP07783321
申请日:2007-05-04
Applicant: FUJIFILM DIMATIX INC
Inventor: CHEN ZHENFANG , BIRKMEYER JEFFREY , BIBL ANDREAS
CPC classification number: B81C1/0038 , B41J2/161 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , H01L41/0973 , H01L41/312 , H01L41/337
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公开(公告)号:EP2024294A4
公开(公告)日:2012-07-25
申请号:EP07783312
申请日:2007-05-04
Applicant: FUJIFILM DIMATIX INC
Inventor: CHEN ZHENFANG , BIRKMEYER JEFFREY
CPC classification number: H01L41/337 , H01L41/313 , Y10T29/42 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155
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