Print head nozzle formation
    1.
    发明专利
    Print head nozzle formation 有权
    打印头喷嘴形成

    公开(公告)号:JP2011156873A

    公开(公告)日:2011-08-18

    申请号:JP2011089638

    申请日:2011-04-13

    Abstract: PROBLEM TO BE SOLVED: To provide a technique including a method and device for forming nozzles in a microelectromechanical device such as an ink jet print head.
    SOLUTION: The nozzles 460 are formed in a layer 420 prior to the layer 420 being bonded onto another portion 440 of the device. Forming the nozzles 460 in the layer 420 prior to bonding enables forming nozzles 460 that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles 460 can reduce the resistance to ink flow as well as improve the uniformity of the nozzles 460 across the microelectromechanical device.
    COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种包括在诸如喷墨打印头的微电子机械装置中形成喷嘴的方法和装置的技术。 解决方案:在层420结合到装置的另一部分440之前,喷嘴460形成在层420中。 在接合之前在层420中形成喷嘴460可形成具有期望深度和期望几何形状的喷嘴460。 为喷嘴460选择特定的几何形状可以降低油墨流动的阻力,并且可以改善穿过微机电装置的喷嘴460的均匀性。 版权所有(C)2011,JPO&INPIT

    PRINT HEAD NOZZLE FORMATION
    2.
    发明专利

    公开(公告)号:HK1104263A1

    公开(公告)日:2008-01-11

    申请号:HK07112674

    申请日:2007-11-21

    Abstract: Techniques are provided for forming nozzles in a microelectromechanical device. The nozzles are formed in a layer prior to the layer being bonded onto another portion of the device. Forming the nozzles in the layer prior to bonding enables forming nozzles that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles can reduce the resistance to ink flow as well as improve the uniformity of the nozzles across the microelectromechanical device.

    PRINT HEAD WITH THIN MEMBRANE
    4.
    发明专利

    公开(公告)号:HK1097229A1

    公开(公告)日:2007-06-22

    申请号:HK07104236

    申请日:2007-04-23

    Abstract: A microfabricated device and method for forming a microfabricated device are described. A thin membrane including silicon (630) is formed on a silicon body (25) by bonding a silicon-on-insulator substrate (685) to a silicon substrate. The handle and insulator layers (695,690) of the silicon-on-insulator substrate are removed, leaving a thin membrane of silicon bonded to a silicon body such that no intervening layer of insulator material remains between the membrane and the body. A piezoelectric layer is bonded to the membrane.

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