公开(公告)号：EP2954462A1

公开(公告)日：2015-12-16

申请号：EP14701070.6

申请日：2014-01-21

Applicant: Gemalto SA

Inventor： OTTOBON, Stéphane ,  DOSSETTO, Lucile ,  SEBAN, Frédérick ,  AUDOUARD, Laurent

IPC: G06K19/077

CPC classification number: G06K19/07747 ,  G06K19/07769 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: The invention concerns a method for connecting conductive pads (9) of a micromodule (2) to accessible connection areas (3a, 3b) of a support (1) of a portable object (100), comprising the following steps of: - providing or producing a body 1 of the portable object comprising a recess (11) for receiving the micromodule and connection areas in the recess, said recess opening at the surface of the body and being defined at the surface of the body by a first periphery (P1), - producing a micromodule comprising conductive pads (9) on a front face, defined by a second periphery P2 substantially corresponding to first periphery P1, and connection portions (10) folded towards a rear face of the micromodule opposite the front face, - inserting the module into the recess, said connection portions being brought into electrical connection with the respective connection areas (3a, 3b) thereof. The method is characterised in that said connection areas extend in said recess perpendicular to a direction of insertion of the micromodule into the recess. The invention also concerns the portable object obtained.

Abstract translation: 该方法包括提供或产生对象的主体（1），包括用于（3B 3A）在所述凹部接收的微型模块和连接区域中的凹部（11）。 微模块在其正面包括用导电垫（9）产生的，其中所述垫通过周边和连接部分（10）朝向微模块的背面折叠限定。 微模块被插入到所述凹部中，并且所述部分被带入与区域电连接。 该区域在所述凹部垂直于所述微模块到凹部的插入方向延伸。 因此独立claimsoft包括用于便携式对象。

公开(公告)号：EP2606454A1

公开(公告)日：2013-06-26

申请号：EP11727179.1

申请日：2011-06-23

Applicant: Gemalto SA

Inventor： DOSSETTO, Lucile ,  AUDOUARD, Laurent ,  LESUR, Jean-Luc

IPC: G06K19/077 ,  G06K19/073

CPC classification number: G06K19/07745 ,  G06K19/07381 ,  G06K19/07743 ,  H01L21/566 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2224/8593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: The invention relates to a method for manufacturing an electronic device (13a, 13b), including a module (1, 15) attached in a recess of a carrier body, said module including a backing film (2) having a metal coating (3) on an upper surface side and on a lower surface side, an integrated-circuit chip (6) connected to the metal coating using electric connection wires (7, 8), the integrated-circuit chip being coated with a coating and mechanically protective material (9). The method is characterized in that it includes an anchoring step according to which a second anchoring material (11) is provided for bonding a portion (7p, 8p, 17p, 18p) of at least one of said electric wires and for anchoring said wire portion to the carrier body.