Abstract:
To place an insert cut out of film with no gaps in a cavity formed in a foil, after placing the foil on a supporting substrate, the cavity is punched into the foil by means of a tubular cutting punch comprising an inner pusher with a cutting edge in the required shaped of the cavity and the insert, so that the edge goes through the thickness of the foil and cuts a slug out of it; the punch is lifted with the slug held inside the punch, without moving the foil, the film is brought between the foil and the edge of the punch, the punch is lowered once again so as to cut the insert out of the film and then push the insert cut in that way in the cavity with a pusher, and the punch and the pusher are removed, with the insert held in place in the cavity.
Abstract:
The invention relates to a chip holder, such as a smartcard (2), comprising: a holding body element, such as a card body (4), comprising a printed circuit board (14) and a photovoltaic sensor (12) that is at least partially transparent to visible light and that extends over at least part of one face of the holding body element and that is electrically connected to the printed circuit board by an electrical connection; and a layer or film of a material that is opaque to visible light, which layer or film is located between the printed circuit board and the photovoltaic sensor (12) and at least partially masks the printed circuit board, characterised in that said electrical connection extends through an aperture in the opaque film or layer.
Abstract:
The invention relates to a device having an integrated-circuit chip, and including an insulating body (2) containing at least one conductive pad (3, 4), at least one electrical contact (5, 6) opposite said electrically conductive pad, at least one recess (7, 8) provided in the body, including a bottom (9, 10) and one aperture (11, 12), said recess being connected, at the bottom thereof, to the conductive pad (3, 4) and, at the aperture thereof, to the electrical contact (5, 6). The device further includes at least one coil spring (12, 13) arranged in the recess (8) and connecting the conductive pad to the electrical contact. The device is characterized in that it includes means (8, 16, 42) configured to facilitate the installation of the spring in the recess thereof and to support same at least by means of the friction of the central portion (C) of the spring relative to the walls of the recess thereof. The invention also relates to a method for producing an electrical connection between at least one conductive pad arranged in an insulating body and at least one electrical contact arranged opposite said electrically conductive pad.
Abstract:
The invention relates to a method for creating a multi-component device, including the following steps, creating a module (1) having a multilayer structure comprising electrical/electronic components (C10, C20) arranged on at least one substrate in stacked layers, the components each having a main surface (F1, F2) exposed to the outside, characterized in that the components are arranged such that the respective main surfaces (F1, F2) thereof are oriented in mutually opposite directions. The invention also relates to the corresponding device.
Abstract:
The invention relates to a portable electronic device (SC, TK) comprising electric input means (VCC, GND, ANT) for receiving electric power from an external power supply. The portable electronic device (SC, TK) comprises an application, the application being set to be triggered when power is supplied to said electric input means (VCC, GND, ANT), and to not communicate with entities external to the portable electronic device (SC, TK), or to only notify such entities of an event. The application is further set to configure the portable electronic device (SC, TK), and to be successfully executable at most once. The invention also relate to a manufacturing equipment (M) for configuring a portable electronic device (SC, TK) and to a method for configuring a portable electronic device (SC, TK).
Abstract:
The invention relates to secured identification documents and method for making them. The problem to be solved by the invention is to develop a secured identification document, comprising at least two flexible layers (32-37) embedding an electronic module (21), said electronic module including a flexible substrate (30) on which are positioned an antenna and a radiofrequency microcontroller storing identification data, said microcontroller being electrically connected to said antenna, said identification document being physically resistant against all type of attacks, in order to avoid a fraudulent person pulling out the module from the identification document by delamination of the constitution layers. The solution to this problem is achieved by the fact that the electronic module is strongly embedded and made interdependent with the stack of said at least two layers (32-37) by means of a chemically and mechanically tamper proof material .
Abstract:
The invention relates to a system with a dual integrated circuit for a communication terminal, wherein said system includes: an integrated circuit smart card including a substrate (20); a first integrated circuit (μP1) in the substrate and a first integrated-circuit communication interface (24), said first integrated circuit being adapted for communication with the device; a second portable integrated circuit (μP2) including a third communication (48, 49, 51) / interconnection (28) interface. The system is characterised in that the first integrated circuit includes a second communication (40, 55)/ interconnection (30) interface coupled to/in contact with said third interface (48, 49, 51, 28) of the second portable integrated circuit. The invention also relates to a smart card, to a method and to the use of the system for implementing any application via a communication.