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    MANUFACTURING METHOD FOR SURFACE-ENHANCED RAMAN SCATTERING ELEMENT
    21.
    发明公开
    MANUFACTURING METHOD FOR SURFACE-ENHANCED RAMAN SCATTERING ELEMENT 审中-公开
    方法表面强化拉曼散射元件

    公开(公告)号：EP2884266A4

    公开(公告)日：2016-08-10

    申请号：EP13828340

    申请日：2013-08-09

    Applicant: HAMAMATSU PHOTONICS KK

    Inventor： ITO MASASHI ,  SHIBAYAMA KATSUMI ,  KASAHARA TAKASHI ,  MARUYAMA YOSHIHIRO

    IPC: G01N21/65 ,  B82Y15/00 ,  B82Y40/00

    CPC classification number: G01J3/0205 ,  G01J3/4412 ,  G01N21/658 ,  Y10T29/49155

    Abstract: A method for making a surface enhanced Raman scattering element in accordance with one aspect of the present invention comprises a first step of forming a nanoimprint layer on a main surface of a wafer including a plurality of portions each corresponding to a substrate; a second step of transferring, by using a mold having a pattern corresponding to a fine structural part, the pattern to the nanoimprint layer after the first step, and thereby forming the molded layer including the fine structural part for each portion corresponding to the substrate; a third step of forming a conductor layer on the fine structural part after the second step; and a fourth step of cutting the wafer into each portion corresponding to the substrate after the second step.

    SURFACE-ENHANCED RAMAN SCATTERING ELEMENT
    26.
    发明公开
    SURFACE-ENHANCED RAMAN SCATTERING ELEMENT 审中-公开
    OBERFLÄCHENVERSTÄRKTESRAMANSTREUUNGSELEMENT

    公开(公告)号：EP2884263A4

    公开(公告)日：2016-08-10

    申请号：EP13827548

    申请日：2013-08-09

    Applicant: HAMAMATSU PHOTONICS KK

    Inventor： ITO MASASHI ,  SHIBAYAMA KATSUMI ,  HIROSE MASAKI ,  MARUYAMA YOSHIHIRO

    IPC: G01N21/65 ,  B82Y15/00 ,  B82Y40/00

    CPC classification number: G01N21/658 ,  B82Y40/00 ,  G01N2201/061

    Abstract: A surface-enhanced Raman scattering element comprises a substrate having a principal surface; a molded layer having a support part formed on the principal surface of the substrate so as to extend along the principal surface and a fine structure part formed on the support part; and a conductor layer formed on the fine structure part and constituting an optical functional part for generating surface-enhanced Raman scattering; the molded layer being relatively thinner in a direction intersecting the principal surface of the substrate at a center edge part of a fine structure area formed with the fine structure part in the molded layer than at an outer edge part of the fine structure area.

    Abstract translation: 表面增强拉曼散射元件包括具有主表面的基底; 模制层，其具有形成在所述基板的主表面上以沿所述主表面延伸的支撑部分和形成在所述支撑部分上的精细结构部分; 以及形成在所述精细结构部分上并且构成用于产生表面增强拉曼散射的光学功能部件的导体层; 在与该微细结构区域的外缘部相比，在模塑层中形成有微细结构部分的微细结构区域的中心边缘部分，在与基板主表面相交的方向上相对较薄。

    SPECTROSCOPE
    29.
    发明公开
    SPECTROSCOPE 审中-公开
    Shfektrioshkhof

    公开(公告)号：EP2063238A4

    公开(公告)日：2014-01-01

    申请号：EP08765190

    申请日：2008-06-05

    Applicant: HAMAMATSU PHOTONICS KK

    Inventor： SHIBAYAMA KATSUMI ,  SUZUKI TOMOFUMI ,  ITO MASASHI

    IPC: G01J3/02

    CPC classification number: G01J3/02 ,  G01J3/0208 ,  G01J3/0218 ,  G01J3/0259 ,  G01J3/0291

    Abstract: The spectrometer 1 is provided with a package 2 in which a light guiding portion 7 is provided, a spectorscopic module 3 accommodated inside the package 2, and a support member 29 arranged on an inner wall plane of the package 2 to support the spectorscopic module 3. The spectorscopic module 3 is provided with a body portion 11 for transmitting light made incident from the light guiding portion 7 and a spectroscopic portion 13 for dispersing light passed through the body portion 11 on a predetermined plane of the body portion 11, and the spectroscopic portion 13 is supported by the support member 29 on the predetermined plane in a state of being spaced away from the inner wall plane.

    SPECTROSCOPIC MODULE
    30.
    发明公开
    SPECTROSCOPIC MODULE 审中-公开
    SPEKTROSKOPISCHES MODUL

    公开(公告)号：EP2063239A4

    公开(公告)日：2013-12-25

    申请号：EP08765191

    申请日：2008-06-05

    Applicant: HAMAMATSU PHOTONICS KK

    Inventor： SUZUKI TOMOFUMI ,  SHIBAYAMA KATSUMI ,  YOKINO TAKAFUMI ,  ITO MASASHI ,  TEICHMANN HELMUT ,  HILLER DIETMAR ,  STARKER ULRICH

    IPC: G01J3/02 ,  G01J3/04 ,  G01J3/28

    CPC classification number: G01J3/02 ,  G01J3/0208 ,  G01J3/0243 ,  G01J3/0259 ,  G01J3/04

    Abstract: The spectroscopy module 1 is provided with a body portion 2 for transmitting light L1, L2, a spectroscopic portion 3 for dispersing light L1 made incident from the front plane 2a of the body portion 2 into the body portion 2 to reflect the light on the front plane 2a, a light detecting element 4 having a light detecting portion 41 for detecting the light L2 dispersed and reflected by the spectroscopic portion 3 and electrically connected to a wiring 9 formed on the front plane 2a of the body portion 2 by face-down bonding, and an underfill material 12 filled in the body portion 2 side of the light detecting element 4 to transmit the light L1, L2. The light detecting element 4 is provided with a light-passing hole 42 through which the light L1 advancing into the spectroscopic portion 3 passes, and a reservoir portion 43 is formed on a rear plane 4a of the body portion 2 side in the light detecting element 4 so as to enclose a light outgoing opening 42b of the light-passing hole 42.

    Abstract translation: 分光模块1具备使光L1，L2透过的主体部2，将从主体部2的前面2a入射的光L1分散到主体部2内，使前面的光反射的分光部3 具有光检测部分41的光检测元件4，光检测元件4用于检测由分光部分3分散和反射的光L2，并通过倒装键合与形成在主体部分2的前表面2a上的布线9电连接 以及填充在光检测元件4的主体部分2侧以透射光L1，L2的底部填充材料12。 在光检测元件4上设置有进入分光部3的光L1通过的通光孔42，在光检测元件4的主体部2侧的背面4a上形成有积存部43 以封闭通光孔42的出光口42b。

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