中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

283 records (took 0.033 seconds)

    PRINTHEADS AND METHODS OF FABRICATING A PRINTHEAD
    21.
    发明申请
    PRINTHEADS AND METHODS OF FABRICATING A PRINTHEAD 审中-公开
    打印头和制作打印头的方法

    公开(公告)号：WO2017074302A1

    公开(公告)日：2017-05-04

    申请号：PCT/US2015/057389

    申请日：2015-10-26

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： CUMBIE, Michael W. ,  CHEN, Chien-Hua ,  MACKENZIE, Mark H. ,  CLARK, Garrett E.

    IPC: B41J2/04 ,  B41J2/14 ,  B41J2/145

    CPC classification number: B41J2/1637 ,  B41J2/155 ,  B41J2/16 ,  B41J2/1632 ,  B41J2/1635 ,  B41J2202/20

    Abstract: Printheads and methods of fabricating printheads are disclosed. An example printhead includes a substrate and a printhead die disposed on a surface of the substrate, where a top surface of the printhead die projects a first distance from the surface of the substrate. The example printhead also includes a barrier at least partially surrounding the printhead die. A top surface of the barrier projects a second distance from the surface of the substrate, where the first distance is less than the second distance.

    Abstract translation: 公开了打印头和制造打印头的方法。 示例性打印头包括基底和设置在基底表面上的打印头模具，其中打印头模具的顶表面从基底表面突出第一距离。 示例性打印头还包括至少部分围绕打印头模具的阻挡件。 阻挡层的顶部表面从衬底的表面投射第二距离，其中第一距离小于第二距离。

    PRINTHEAD WITH S-SHAPED DIE
    22.
    发明申请
    PRINTHEAD WITH S-SHAPED DIE 审中-公开
    PRINTHEAD与S形模具

    公开(公告)号：WO2017065743A1

    公开(公告)日：2017-04-20

    申请号：PCT/US2015/055227

    申请日：2015-10-13

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： CUMBIE, Michael W. ,  CHOY, Silam J. ,  CHEN, Chien-Hua ,  MOUREY, Devin Alexander

    IPC: B41J2/14 ,  B41J2/155 ,  B41J2/16

    CPC classification number: B41J2/155 ,  B41J2/14072 ,  B41J2/1603 ,  B41J2/1632 ,  B41J2/1635 ,  B41J2/1637 ,  B41J2202/20

    Abstract: A printhead may include a number of s-shaped dies embedded in a moldable substrate. An medium-wide array may include a number of printheads with each printhead including a number of s-shaped dies and an ejection fluid feed slot to provide a single type of ejection fluid to the s-shaped dies. An s-shaped die of a printhead may include a number of columns of nozzles and an electrical interconnect coupled to a number of firing chambers associated with each of the nozzles, the electrical interconnect positioned adjacent to the number of columns.

    Abstract translation: 打印头可以包括嵌入可模制基板中的多个S形模具。 中等宽度的阵列可以包括多个打印头，其中每个打印头包括多个s形模具和喷射流体供给槽以向s形模具提供单一类型的喷射流体。 打印头的S形模具可以包括多个喷嘴列和耦合到与每个喷嘴相关联的多个喷射室的电互连，电互连定位在多个列附近。

    PRINTHEAD WITH BOND PAD SURROUNDED BY DAM
    23.
    发明申请
    PRINTHEAD WITH BOND PAD SURROUNDED BY DAM 审中-公开
    用DAM环绕的BOND PAD打印

    公开(公告)号：WO2015080730A1

    公开(公告)日：2015-06-04

    申请号：PCT/US2013/072261

    申请日：2013-11-27

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： CHEN, Chien-Hua ,  CUMBIE, Michael W. ,  MOUREY, Devin A.

    IPC: B41J2/045 ,  B41J2/14

    CPC classification number: B41J2/1433 ,  B41J2/04541 ,  B41J2/0458 ,  B41J2/14072 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1632 ,  B41J2/1637

    Abstract: In an embodiment, a printhead includes a printhead die molded into a molding. The die has a front surface exposed outside the molding to dispense fluid and an opposing back surface covered by the molding except at a channel in the molding through which fluid may pass directly to the back surface. The die has a first bond pad on the front surface surrounded by a first dam to prevent the molding from contacting the first bond pad.

    Abstract translation: 在一个实施例中，打印头包括模制成模制品的打印头模具。 模具具有暴露在模制件外部的前表面，以分配流体，以及由模制品覆盖的相对的后表面，除了模制品中的通道之外，流体可以通过该通道直接通过背面。 模具在前表面上具有由第一坝围成的第一接合焊盘，以防止模制物接触第一接合焊盘。

    MOLDED PRINTHEAD
    25.
    发明申请
    MOLDED PRINTHEAD 审中-公开
    模制打印

    公开(公告)号：WO2014133633A1

    公开(公告)日：2014-09-04

    申请号：PCT/US2013/074925

    申请日：2013-12-13

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： CHEN, Chien-Hua ,  CUMBIE, Michael W.

    IPC: B41J2/045 ,  B41J2/14

    CPC classification number: B41J2/17526 ,  B41J2/14072 ,  B41J2/14145 ,  B41J2/1433 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/1628 ,  B41J2/1637 ,  B41J2/17553 ,  B41J2002/14362 ,  B41J2002/14419 ,  B41J2202/20

    Abstract: In one example, a molded printhead includes a printhead die embedded in a molding and an external electrical contact electrically connected to the printhead die and exposed outside the molding to connect to circuitry external to the printhead. The molding has a channel therein through which fluid may pass to the back part of the die. The front part of the die is exposed outside the molding and the back part of the die is covered by the molding except at the channel and the thickness of the molding varies from a lesser thickness around the die to a greater thickness away from the die.

    Abstract translation: 在一个示例中，模制打印头包括嵌入模制件中的打印头模头和电连接到打印头模具的外部电触头，并暴露在模制件外部以连接到打印头外部的电路。 模制件具有通道，流体可以通过该通道传递到模具的后部。 模具的前部暴露在模制件的外部，并且模具的后部由模具覆盖，除了在通道之外，模制件的厚度从模具周围的较小厚度变化到离模具更大的厚度。

    FLUID NOZZLE ARRAY
    28.
    发明申请
    FLUID NOZZLE ARRAY 审中-公开
    流体喷嘴阵列

    公开(公告)号：WO2012036682A1

    公开(公告)日：2012-03-22

    申请号：PCT/US2010/048976

    申请日：2010-09-15

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. ,  BENGALI, Sadiq ,  CHEN, Chien-Hua ,  COOK, Galen P. ,  CUMBIE, Michael W. ,  MESSENGER, Robert K.

    Inventor： BENGALI, Sadiq ,  CHEN, Chien-Hua ,  COOK, Galen P. ,  CUMBIE, Michael W. ,  MESSENGER, Robert K.

    IPC: B41J2/16 ,  B41J2/14 ,  B41J2/145

    CPC classification number: B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1634

    Abstract: A method for fabricating a fluid nozzle array includes forming a circuitry layer (410) onto a substrate (412), the substrate (412) comprising a stopping layer (404) disposed between a membrane layer (406) and a handle layer (402), forming a fluid feedhole (502) extending from a surface of the membrane layer (406) to the stopping layer (404), and forming a fluid supply trench (702) extending from a surface of the handle layer (402) to the stopping layer (404). A fluid nozzle array includes a substrate (412) including a membrane layer (406), a stopping layer (404) adjacent to the membrane layer, a handle layer (406) adjacent to the stopping layer, and a set of fluid chambers (610) disposed on a surface of the membrane layer above and along a width of a fluid supply trench (702) extending from a surface of the handle layer to the stopping layer.

    Abstract translation: 用于制造流体喷嘴阵列的方法包括在基底（412）上形成电路层（410），所述基底（412）包括设置在膜层（406）和手柄层（402）之间的阻挡层（404） 形成从所述膜层（406）的表面延伸到所述止挡层（404）的流体供给孔（502），以及形成从所述手柄层（402）的表面延伸到所述止动层（404）的流体供给沟槽（702） 层（404）。 流体喷嘴阵列包括基片（412），其包括膜层（406），邻近膜层的阻挡层（404），邻近止动层的手柄层（406）和一组流体室 ）设置在膜层的表面上方并沿着从手柄层的表面延伸到止挡层的流体供应沟槽（702）的宽度。

Patent Agency Ranking