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    ELECTROWETTING SURFACES
    1.
    发明申请
    ELECTROWETTING SURFACES 审中-公开

    公开(公告)号：WO2022245368A1

    公开(公告)日：2022-11-24

    申请号：PCT/US2021/033633

    申请日：2021-05-21

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： CUMBIE, Michael W. ,  CHEN, Chien-Hua ,  SHKOLNIKOV, Viktor

    IPC: B01L3/00 ,  B81C1/00 ,  B81B7/02 ,  B82Y30/00

    Abstract: The present disclosure describes electrowetting surfaces, digital microfluidic devices that include electrowetting surfaces, and methods of making electrowetting surfaces. In one example, an electrowetting surface can include a substrate, a plurality of electrodes on the substrate, and a nanoceramic coating over the plurality of electrodes. The electrodes can include a layer of conductive material deposited over the substrate. The nanoceramic coating can include ceramic nanoparticles bound together by a polymeric binder.

    INTEGRATED CIRCUIT WITH ADDRESS DRIVERS FOR FLUIDIC DIE
    4.
    发明申请
    INTEGRATED CIRCUIT WITH ADDRESS DRIVERS FOR FLUIDIC DIE 审中-公开

    公开(公告)号：WO2020162921A1

    公开(公告)日：2020-08-13

    申请号：PCT/US2019/016818

    申请日：2019-02-06

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： LINN, Scott A. ,  GARDNER, James Michael ,  CUMBIE, Michael W.

    IPC: B41J2/045

    Abstract: An integrated circuit for a fluidic die including an address bus to communicate a set of addresses, a first group of die configuration functions including a first address driver to drive a first portion of an address of the set of addresses on the address bus, a second group of die configuration functions including a second address driver to drive a second portion of the address of the set of addresses on the address bus, and an array of fluid actuating devices addressable by the set of addresses communicated via the address bus.

    COMMUNICATING PRINT COMPONENT
    5.
    发明申请
    COMMUNICATING PRINT COMPONENT 审中-公开

    公开(公告)号：WO2020162919A1

    公开(公告)日：2020-08-13

    申请号：PCT/US2019/016815

    申请日：2019-02-06

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： LINN, Scott A. ,  GARDNER, James Michael ,  CUMBIE, Michael W.

    IPC: B41J2/045

    Abstract: An integrated circuit to drive a number of fluid actuation devices, comprising a circuit configured to have a memory access state which can be set to one of an enabled state and disabled state. The integrated circuit to include a fluid actuation circuit to transmit selection information for a fluid actuation device, the selection information comprising a data state bit. The integrated circuit to include a memory cell array, configured so that each memory cell is accessible by the memory access state being enabled, and the data state bit being set.

    MULTIPLE CIRCUITS COUPLED TO AN INTERFACE
    8.
    发明申请
    MULTIPLE CIRCUITS COUPLED TO AN INTERFACE 审中-公开

    公开(公告)号：WO2020162887A1

    公开(公告)日：2020-08-13

    申请号：PCT/US2019/016725

    申请日：2019-02-06

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： GARDNER, James Michael ,  LINN, Scott A. ,  CUMBIE, Michael W.

    IPC: B41J2/045 ,  B41J2/14

    Abstract: An integrated circuit to drive a plurality of fluid actuation devices includes an interface, a first sensor, a second sensor, and control logic. The interface is to connect to a single contact pad of a host print apparatus. The first sensor is of a first type and is coupled to the interface. The second sensor is of a second type and is coupled to the interface. The second type is different from the first type. The control logic enables the first sensor or the second sensor to provide an enabled sensor. A voltage bias or a current bias applied to the interface generates a sensed current or a sensed voltage, respectively, on the interface indicating the state of the enabled sensor.

    LOGIC CIRCUITRY PACKAGE
    9.
    发明申请
    LOGIC CIRCUITRY PACKAGE 审中-公开

    公开(公告)号：WO2020117774A1

    公开(公告)日：2020-06-11

    申请号：PCT/US2019/064192

    申请日：2019-12-03

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： CUMBIE, Michael W. ,  GARDNER, James Michael ,  LINN, Scott A.

    IPC: G06F21/44 ,  G06F21/60 ,  G06F13/42 ,  B41J2/175

    Abstract: A logic circuitry package includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit including at least one heater and a temperature sensor. The at least one logic circuit is configured to receive, via the interface, a heater command to address the at least one heater. The at least one logic circuit is configured to receive, via the interface, subsequent to the heater command, a sensor command corresponding to a sensor ID to address the temperature sensor. The at least one logic circuit is configured to transmit, via the interface, a digital value in response to the sensor command. The digital value corresponds to a print material level of a print material within a reservoir.

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