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公开(公告)号:WO2022245368A1
公开(公告)日:2022-11-24
申请号:PCT/US2021/033633
申请日:2021-05-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: CUMBIE, Michael W. , CHEN, Chien-Hua , SHKOLNIKOV, Viktor
Abstract: The present disclosure describes electrowetting surfaces, digital microfluidic devices that include electrowetting surfaces, and methods of making electrowetting surfaces. In one example, an electrowetting surface can include a substrate, a plurality of electrodes on the substrate, and a nanoceramic coating over the plurality of electrodes. The electrodes can include a layer of conductive material deposited over the substrate. The nanoceramic coating can include ceramic nanoparticles bound together by a polymeric binder.
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公开(公告)号:WO2022191821A1
公开(公告)日:2022-09-15
申请号:PCT/US2021/021437
申请日:2021-03-09
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: GOVYADINOV, Alexander N. , CUMBIE, Michael W. , OLBRICH, Craig A. , TORNIAINEN, Erik D. , GILA, Omer
Abstract: In some examples, a fluid dispensing device includes a fluid chamber, a heating element adjacent the fluid chamber, and an orifice adjacent the fluid chamber. A ratio of an area of a surface of the heating element to an orifice area of the orifice is greater than or equal to 3, where the surface of the heating element faces the fluid chamber.
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公开(公告)号:WO2022086540A1
公开(公告)日:2022-04-28
申请号:PCT/US2020/056857
申请日:2020-10-22
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: NG, Boon Bing , ROSSI, John , GARDNER, James Michael , LINN, Scott A. , CUMBIE, Michael W.
Abstract: A circuitry component comprises a communications interface to communicate with a host apparatus. The component may comprise device adapted to transfer and/or sense liquids based on instructions received over the interface. The component may also comprise a logic circuit configured to, in response to at least one enable instruction, generate a device signal to enable at least one function of the device.
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公开(公告)号:WO2020162921A1
公开(公告)日:2020-08-13
申请号:PCT/US2019/016818
申请日:2019-02-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: LINN, Scott A. , GARDNER, James Michael , CUMBIE, Michael W.
IPC: B41J2/045
Abstract: An integrated circuit for a fluidic die including an address bus to communicate a set of addresses, a first group of die configuration functions including a first address driver to drive a first portion of an address of the set of addresses on the address bus, a second group of die configuration functions including a second address driver to drive a second portion of the address of the set of addresses on the address bus, and an array of fluid actuating devices addressable by the set of addresses communicated via the address bus.
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公开(公告)号:WO2020162919A1
公开(公告)日:2020-08-13
申请号:PCT/US2019/016815
申请日:2019-02-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: LINN, Scott A. , GARDNER, James Michael , CUMBIE, Michael W.
IPC: B41J2/045
Abstract: An integrated circuit to drive a number of fluid actuation devices, comprising a circuit configured to have a memory access state which can be set to one of an enabled state and disabled state. The integrated circuit to include a fluid actuation circuit to transmit selection information for a fluid actuation device, the selection information comprising a data state bit. The integrated circuit to include a memory cell array, configured so that each memory cell is accessible by the memory access state being enabled, and the data state bit being set.
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公开(公告)号:WO2020162918A1
公开(公告)日:2020-08-13
申请号:PCT/US2019/016812
申请日:2019-02-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: CUMBIE, Michael W. , BROWNING, Robert N. K. , GARDNER, James Michael
Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.
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公开(公告)号:WO2020162917A1
公开(公告)日:2020-08-13
申请号:PCT/US2019/016811
申请日:2019-02-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.
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公开(公告)号:WO2020162887A1
公开(公告)日:2020-08-13
申请号:PCT/US2019/016725
申请日:2019-02-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: GARDNER, James Michael , LINN, Scott A. , CUMBIE, Michael W.
Abstract: An integrated circuit to drive a plurality of fluid actuation devices includes an interface, a first sensor, a second sensor, and control logic. The interface is to connect to a single contact pad of a host print apparatus. The first sensor is of a first type and is coupled to the interface. The second sensor is of a second type and is coupled to the interface. The second type is different from the first type. The control logic enables the first sensor or the second sensor to provide an enabled sensor. A voltage bias or a current bias applied to the interface generates a sensed current or a sensed voltage, respectively, on the interface indicating the state of the enabled sensor.
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公开(公告)号:WO2020117774A1
公开(公告)日:2020-06-11
申请号:PCT/US2019/064192
申请日:2019-12-03
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: CUMBIE, Michael W. , GARDNER, James Michael , LINN, Scott A.
Abstract: A logic circuitry package includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit including at least one heater and a temperature sensor. The at least one logic circuit is configured to receive, via the interface, a heater command to address the at least one heater. The at least one logic circuit is configured to receive, via the interface, subsequent to the heater command, a sensor command corresponding to a sensor ID to address the temperature sensor. The at least one logic circuit is configured to transmit, via the interface, a digital value in response to the sensor command. The digital value corresponds to a print material level of a print material within a reservoir.
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公开(公告)号:WO2020117307A1
公开(公告)日:2020-06-11
申请号:PCT/US2019/026159
申请日:2019-04-05
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: GARDNER, James Michael , LU, Sirena Chi , LINN, Scott A. , PANSHIN, Stephen D. , ROETHIG, David Owen , OLSEN, David N. , STUDER, Anthony D. , CUMBIE, Michael W. , WARD, Jefferson P.
Abstract: In an example, a method includes, by logic circuitry associated with a replaceable print apparatus component installed in a print apparatus, responding to a sensor data request received from the print apparatus by returning a first response; receiving a calibration parameter from the print apparatus; and returning a second response which is different from the first response.
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