公开(公告)号：EP3314359A1

公开(公告)日：2018-05-02

申请号：EP16814855.9

申请日：2016-04-22

Applicant: Intel Corporation

Inventor： KAM, Timothy Y. ,  AHUJA, Sandeep ,  AGARWAL, Rajat ,  SODANI, Avinash ,  SUH, Jinho ,  CHINTHAMANI, Meenakshisundaram

IPC: G06F1/20

CPC classification number: G06F1/206 ,  G06F1/3206 ,  G06F1/3225 ,  G06F1/3234 ,  G06F1/324 ,  G06F1/3275 ,  G06F2212/1028 ,  G11C7/04 ,  Y02D10/126 ,  Y02D10/13 ,  Y02D10/14 ,  Y02D10/16

Abstract: Disclosed herein is a computing device configured to implement thermal throttling of a component of the computing device. The computing device includes an electronic component and a temperature sensor thermally coupled to the electronic component. The computing device also includes a thermal management controller to receive a temperature measurement from the temperature sensor and generate a throttling factor for the electronic component. If the temperature measurement is greater than a specified threshold, the throttling factor is to reduce performance of the electronic component to be at least the performance guarantee for the electronic component.