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公开(公告)号：US20210036685A1
公开(公告)日：2021-02-04
申请号：US16526672
申请日：2019-07-30
Applicant: Intel Corporation
Inventor： Telesphor Kamgaing , Feras Eid , Georgios Dogiamis , Aleksandar Aleksov , Johanna M. Swan
IPC: H03H9/205 , H03F3/24 , H03H9/25 , H01L41/053 , H03H9/64 , H03H9/54 , H01L25/10 , H01L23/10 , H01L23/552
Abstract: Embodiments may relate to a radio frequency (RF) front-end module (FEM) that includes a first acoustic wave resonator (AWR) die coupled with a package substrate. The RF FEM may also include a second AWR die coupled with the first AWR die. The first AWR die may be between the package substrate and the second AWR die. Other embodiments may be described or claimed.
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公开(公告)号：US20210036682A1
公开(公告)日：2021-02-04
申请号：US16526633
申请日：2019-07-30
Applicant: Intel Corporation
Inventor： Telesphor Kamgaing , Aleksandar Aleksov , Feras Eid , Georgios Dogiamis , Johanna M. Swan
IPC: H03H9/05 , H01L23/538 , H01L25/18 , H01L27/20 , H01L25/00 , H01L41/053 , H01L23/00 , H03H9/58 , H01L41/047
Abstract: Embodiments may relate to a radio frequency (RF) front-end module (FEM) that includes an acoustic wave resonator (AWR) die. The RF FEM may further include an active die coupled with the package substrate of the RF FEM. When the active die is coupled with the package substrate, the AWR die may be between the active die and the package substrate. Other embodiments may be described or claimed.
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公开(公告)号：US20200315052A1
公开(公告)日：2020-10-01
申请号：US16402055
申请日：2019-05-02
Applicant: Intel Corporation
Inventor： Telesphor Kamgaing , Johanna M. Swan , Georgios Dogiamis , Henning Braunisch , Adel A. Elsherbini , Aleksandar Aleksov , Richard Dischler
Abstract: Embodiments may relate an electronic device that includes a first platform and a second platform coupled with a chassis. The platforms may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first platform and the second platform such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.
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公开(公告)号：US20190356033A1
公开(公告)日：2019-11-21
申请号：US16014036
申请日：2018-06-21
Applicant: Intel Corporation
Inventor： Georgios Dogiamis , Adel A. Elsherbini , Telesphor Kamgaing , Henning Braunisch , Johanna M. Swan
Abstract: Disclosed herein are various designs for dielectric waveguides, as well as methods of manufacturing such waveguides. One type of dielectric waveguides described herein includes waveguides with one or more cavities in the dielectric waveguide material. Another type of dielectric waveguides described herein includes waveguides with a conductive ridge in the dielectric waveguide material. Dielectric waveguides described herein may be dispersion reduced dielectric waveguides, compared to conventional dielectric waveguides, and may be designed to adjust the difference in the group delay between the lower frequencies and the higher frequencies of a chosen bandwidth.
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公开(公告)号：US20190089409A1
公开(公告)日：2019-03-21
申请号：US16196367
申请日：2018-11-20
Applicant: Intel Corporation
Inventor： Telesphor Kamgaing , Georgios Dogiamis , Henning Braunisch , Hyung-Jin Lee , Richard Dischler
Abstract: Embodiments may relate to a transceiver chip. The transceiver chip may include a substrate that has a first transceiver component and a second transceiver component positioned therein. The transceiver chip may further include a well material that is positioned between the first transceiver component and the second transceiver component. The well material may mitigate cross-talk between the first transceiver component and the second transceiver component. Other embodiments may be described or claimed.
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Patent Agency Ranking
公开(公告)号：US12300579B2
公开(公告)日：2025-05-13
申请号：US17346895
申请日：2021-06-14
Applicant: Intel Corporation
Inventor： Georgios Dogiamis , Qiang Yu , Feras Eid , Adel Elsherbini , Kimin Jun , Johanna Swan , Shawna Liff
IPC: H01L23/473 , H01L23/13 , H01L23/538 , H01L25/065 , H05K7/20 , H01L23/00
Abstract: An integrated circuit (IC) package may be fabricated having an interposer, one or more microfluidic channels through the interposer, a first IC chip attached to a first side of the interposer, and a second IC chip attached to a second side of the interposer, where the first side of the interposer includes first bond pads coupled to first bond pads of the first IC chip, and the second side of the interposer includes second bond pads coupled to first bond pads of the second IC chip. In an embodiment of the present description, a liquid cooled three-dimensional IC (3DIC) package may be formed with the IC package, where at least two IC devices may be stacked with a liquid cooled interposer. In a further embodiment, the liquid cooled 3DIC package may be electrically attached to an electronic board. Other embodiments are disclosed and claimed.
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公开(公告)号：US12199012B2
公开(公告)日：2025-01-14
申请号：US16914066
申请日：2020-06-26
Applicant: Intel Corporation
Inventor： Adel Elsherbini , Stephen Morein , Feras Eid , Georgios Dogiamis
IPC: H01L23/467 , C23C24/04 , H01L21/48 , H01L23/373 , H01L23/473 , F28D1/03 , F28D21/00
Abstract: A microfluidic device having a channel within a first material to thermally couple with an IC die. The channel defines an initial fluid path between a fluid inlet port and a fluid outlet port. A second material is within a portion of the channel. The second material supplements the first material to modify the initial fluid path into a final fluid path between the fluid inlet port and the fluid outlet port. The second material may have a different composition and/or microstructure than the first material.
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公开(公告)号：US20250006719A1
公开(公告)日：2025-01-02
申请号：US18341875
申请日：2023-06-27
Applicant: Intel Corporation
Inventor： Georgios Panagopoulos , Richard Geiger , Steven Callender , Georgios Dogiamis , Manisha Dutta , Stefano Pellerano
Abstract: Example antenna module includes antenna units provided over an antenna unit support, and ICs communicatively coupled to various antenna units. The ICs are arranged in two or more subsets of one or more ICs in each subset, where an individual IC belongs to only one subset, different subsets are in different layers with respect to the antenna unit support, and an average pitch of projections of all of the ICs onto a plane parallel to the antenna unit support is substantially equal to, or smaller, than an average pitch of the antenna units. When an average width of the ICs is larger than the average pitch of the antenna units, arranging the ICs in two or more subsets in different layers means that at least one of the ICs of one subset partially overlaps with at least one of the ICs of another subset.
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公开(公告)号：US20240429221A1
公开(公告)日：2024-12-26
申请号：US18339685
申请日：2023-06-22
Applicant: Intel Corporation
Inventor： Bernd Waidhas , Thomas Wagner , Georg Seidemann , Nicolas Richaud , Manisha Dutta , Georgios Dogiamis , Harshit Dhakad , Michael Langenbuch
Abstract: Glass layers and capacitors for use with integrated circuit packages are disclosed. An example integrated circuit (IC) package includes a semiconductor die, a glass layer, and a capacitor electrically coupled to the semiconductor die, at least one side of the capacitor enclosed by the glass layer, the capacitor positioned closer to the glass layer than the semiconductor die is to the glass layer.
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公开(公告)号：US12126067B2
公开(公告)日：2024-10-22
申请号：US16911559
申请日：2020-06-25
Applicant: Intel Corporation
Inventor： Diego Correas-Serrano , Georgios Dogiamis , Henning Braunisch , Neelam Prabhu Gaunkar , Telesphor Kamgaing
CPC classification number: H01P3/16 , H01P1/2002 , H01P1/2088 , H01P5/087
Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.
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