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    Floating package stiffener
    21.
    发明授权
    Floating package stiffener 有权

    公开(公告)号：US10134690B2

    公开(公告)日：2018-11-20

    申请号：US15335999

    申请日：2016-10-27

    Applicant: Intel Corporation

    Inventor： Hao-Han Hsu ,  Ying Ern Ho ,  Jaejin Lee

    IPC: H01L23/00 ,  H01L23/66 ,  H01L23/498

    Abstract: Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package stiffener may also be coupled with the adhesive adjacent to the die. A magnetic thin film may be coupled with the package stiffener. Other embodiments may be described and/or claimed.

    Electronic computing device having self-shielding antenna
    24.
    发明授权
    Electronic computing device having self-shielding antenna 有权

    公开(公告)号：US12074368B2

    公开(公告)日：2024-08-27

    申请号：US17754149

    申请日：2019-12-27

    Applicant: INTEL CORPORATION

    Inventor： Denica Larsen ,  Dong-Ho Han ,  Kwan Ho Lee ,  Shantanu Kulkarni ,  Jaejin Lee

    IPC: H01Q1/52 ,  H01Q1/24 ,  H01Q9/28 ,  H01Q9/42

    CPC classification number: H01Q1/526 ,  H01Q1/243 ,  H01Q9/285 ,  H01Q9/42

    Abstract: An electronic computing device with a self-shielding antenna. An electronic computing device may include a frame, an antenna, and an antenna shielding. The frame includes a top cover and a bottom cover. Electronic components are included in a space formed between the top cover and the bottom cover. The antenna is for wireless transmission and reception and included in the frame near an edge of the frame. The antenna shielding is disposed around the antenna for providing electro-magnetic shielding from radio frequency (RE) noises generated from the electronic components included in the frame. The antenna shielding may be a metal wall disposed between the top cover and the bottom cover around the antenna. The frame may be a metallic frame and may include a cut-out in the top cover and the bottom cover above and below the antenna, and a non-metallic cover may be provided in the cut-out.

    Crosstalk reducing connector pin geometry
    26.
    发明授权
    Crosstalk reducing connector pin geometry 有权

    公开(公告)号：US10923859B2

    公开(公告)日：2021-02-16

    申请号：US16389781

    申请日：2019-04-19

    Applicant: Intel Corporation

    Inventor： Jaejin Lee ,  Jun Liao ,  Xiang Li ,  George Vergis ,  Christopher E. Cox

    IPC: H01R13/6471 ,  H05K5/00 ,  H05K5/02 ,  H01R12/73 ,  H05K1/18 ,  H01R12/70 ,  H01R12/72 ,  H01R13/6461 ,  H01R13/24

    Abstract: Embodiments of the present disclosure relate to a connector to connect a printed circuit board (PCB) with a memory device, where the connector includes a housing couplable with the PCB; a first signal pin coupled with the housing, where the first signal pin includes a first portion that includes a first curve, and a second portion that extends from the first portion and includes a second curve; and a second signal pin coupled with the housing, where the second signal pin includes a third portion that includes a third curve, and a fourth portion that extends from the third portion and includes a fourth curve, where the first curve is curved in a first opposite direction relative to the third curve, and where the second curve is curved in a second opposite direction relative to the fourth curve.

    MAGNETICALLY AFFIXED HEAT SPREADER
    27.
    发明申请
    MAGNETICALLY AFFIXED HEAT SPREADER 审中-公开

    公开(公告)号：US20190115281A1

    公开(公告)日：2019-04-18

    申请号：US16215228

    申请日：2018-12-10

    Applicant: Intel Corporation

    Inventor： Jaejin Lee ,  Hao-Han Hsu

    IPC: H01L23/40 ,  H01L23/427 ,  H01F7/02

    Abstract: There is disclosed in one example a computing apparatus, including: an active computing element; a first magnetic attractor mechanically coupled to the active computing element; and a cold plate disposed to conduct heat away from the active computing element, the cold plate including a second magnetic attractor disposed to magnetically couple with the first magnetic attractor.

    Heatpipe to help reduce radio frequency interference
    28.
    发明授权
    Heatpipe to help reduce radio frequency interference 有权

    公开(公告)号：US12160216B2

    公开(公告)日：2024-12-03

    申请号：US17122075

    申请日：2020-12-15

    Applicant: Intel Corporation

    Inventor： Kae-An Liu ,  Jaejin Lee ,  David W. Browning

    IPC: H03H7/01 ,  H01P1/20 ,  H01Q1/02 ,  H05K7/20

    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a heat source on the substrate, and a heat pipe. The heat pipe includes a plurality of bumps that extend from the heat pipe towards the substrate but do not come into contact with the substrate. The bumps are configured to help mitigate radio frequency interference in the electronic device. More specifically, the bumps can be configured to provide a resonant frequency in a specific radio frequency band and act as a radio frequency filter.

    ELECTROMAGNETIC INTERFERENCE SHIELDING ENCLOSURE WITH THERMAL CONDUCTIVITY
    29.
    发明申请
    ELECTROMAGNETIC INTERFERENCE SHIELDING ENCLOSURE WITH THERMAL CONDUCTIVITY 有权

    公开(公告)号：US20210153340A1

    公开(公告)日：2021-05-20

    申请号：US17127407

    申请日：2020-12-18

    Applicant: Intel Corporation

    Inventor： Jaejin Lee ,  James Panakkal ,  Min Suet Lim ,  Aiswarya M. Pious

    IPC: H05K1/02 ,  H05K9/00

    Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to EMI shielding and thermal conduction without using any surface area of a PCB. Embodiments of the EMI shield may include a planar top, with one or more walls extending from the planar top to a bottom surface of the PCB, the PCB having a top surface disposed between the bottom surface of the PCB and the planar top. A ground of the PCB may electrically couple with the one or more walls. The bottom of the walls may couple with an EMI gasket applied to a bottom chassis to increase the volume of EMI shielding. Other embodiments may be described and/or claimed.

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