公开(公告)号：US12160216B2

公开(公告)日：2024-12-03

申请号：US17122075

申请日：2020-12-15

Applicant: Intel Corporation

Inventor： Kae-An Liu ,  Jaejin Lee ,  David W. Browning

IPC: H03H7/01 ,  H01P1/20 ,  H01Q1/02 ,  H05K7/20

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a heat source on the substrate, and a heat pipe. The heat pipe includes a plurality of bumps that extend from the heat pipe towards the substrate but do not come into contact with the substrate. The bumps are configured to help mitigate radio frequency interference in the electronic device. More specifically, the bumps can be configured to provide a resonant frequency in a specific radio frequency band and act as a radio frequency filter.

公开(公告)号：US20210104995A1

公开(公告)日：2021-04-08

申请号：US17122075

申请日：2020-12-15

Applicant: Intel Corporation

Inventor： Kae-An Liu ,  Jaejin Lee ,  David W. Browning

IPC: H03H7/01 ,  H05K7/20 ,  H01Q1/02

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a heat source on the substrate, and a heat pipe. The heat pipe includes a plurality of bumps that extend from the heat pipe towards the substrate but do not come into contact with the substrate. The bumps are configured to help mitigate radio frequency interference in the electronic device. More specifically, the bumps can be configured to provide a resonant frequency in a specific radio frequency band and act as a radio frequency filter.