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21.发明申请
公开(公告)号：WO2018236336A1
公开(公告)日：2018-12-27
申请号：PCT/US2017/038114
申请日：2017-06-19
Applicant: INTEL CORPORATION , ALEKSOV, Aleksandar , KAMGAING, Telesphor , BOYAPATI, Sri Ranga Sai , DARMAWIKARTA, Kristof , FAYNEH, Eyal , DEGANI, Ofir , LEVY, David , SWAN, Johanna M.
Inventor： ALEKSOV, Aleksandar , KAMGAING, Telesphor , BOYAPATI, Sri Ranga Sai , DARMAWIKARTA, Kristof , FAYNEH, Eyal , DEGANI, Ofir , LEVY, David , SWAN, Johanna M.
Abstract: In-package radio frequency (RF) waveguides as high bandwidth chip-to-chip interconnects and methods for using the same are disclosed. In one example, an electronic package includes a package substrate, first and second silicon dies or tiles, and an RF waveguide. The first and second silicon dies or tiles are attached to the package substrate. The RF waveguide is formed in the package substrate and interconnects the first silicon die or tile with the second silicon die or tile.
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公开(公告)号：WO2018125240A1
公开(公告)日：2018-07-05
申请号：PCT/US2016/069621
申请日：2016-12-30
Applicant: INTEL CORPORATION
Inventor： KAMGAING, Telesphor , OSTER, Sasha N. , DOGIAMIS, Georgios C.
IPC: H01L23/66 , H01L23/498 , H01L23/522 , H01Q1/24 , H01Q1/38
Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having organic dielectric material, conductive layers, and a first portion of a distributed antenna unit. The first substrate supports at least one radio frequency (RF) component. A second substrate is coupled to the first substrate. The second substrate is integrated with a housing of the microelectronic device and includes a second portion of the distributed antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.
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公开(公告)号：WO2018063708A1
公开(公告)日：2018-04-05
申请号：PCT/US2017/049350
申请日：2017-08-30
Applicant: INTEL CORPORATION
Inventor： OSTER, Sasha N. , ALEKSOV, Aleksandar , DOGIAMIS, Georgios C. , KAMGAING, Telesphor , ELSHERBINI, Adel A. , LIFF, Shawna M. , SWAN, Johanna M. , RAWLINGS, Brandon M. , DISCHLER, Richard J.
CPC classification number: H01P3/122 , H01P3/14 , H01P3/16 , H01P11/006
Abstract: A method of making a waveguide ribbon that includes a plurality of waveguides comprises joining a first sheet of dielectric material to a first conductive sheet of conductive material, patterning the first sheet of dielectric material to form a plurality of dielectric waveguide cores on the first conductive sheet, and coating the dielectric waveguide cores with substantially the same conductive material as the conductive sheet to form the plurality of waveguides.
Abstract translation: 制造包括多个波导的波导带的方法包括将第一片介电材料接合到第一导电材料的导电片，图案化第一片介电材料以形成多个 在第一导电片上形成电介质波导芯，并且用与导电片基本上相同的导电材料涂覆电介质波导芯以形成多个波导。
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公开(公告)号：WO2018063687A1
公开(公告)日：2018-04-05
申请号：PCT/US2017/049226
申请日：2017-08-29
Applicant: INTEL CORPORATION
Inventor： HUA, Fay , RAWLINGS, Brandon , DOGIAMIS, Georgios C. , KAMGAING, Telesphor
IPC: H01L49/02 , H01L21/768
Abstract: Embodiments are generally directed to non-planar on-package via capacitor. An embodiment of an embedded capacitor includes a first plate that is formed in a package via; a dielectric layer that is applied on the first plate; and a second plate that is formed in a cavity in the dielectric layer, wherein the first plate and the second plate are non-planar plates.
Abstract translation: 实施例通常针对非平面封装过孔电容器。 嵌入式电容器的实施例包括：第一板，其形成在封装件通孔中; 施加在第一板上的介电层; 以及形成在介电层中的空腔中的第二板，其中第一板和第二板是非平面板。
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公开(公告)号：WO2018057002A1
公开(公告)日：2018-03-29
申请号：PCT/US2016/053463
申请日：2016-09-23
Applicant: INTEL CORPORATION
Inventor： OSTER, Sasha N. , DOGIAMIS, Georgios C. , KAMGAING, Telesphor , ELSHERBINI, Adel A. , LIFF, Shawna M. , ALEKSOV, Aleksandar , SWAN, Johanna M.
Abstract: A waveguide coupling system may include at least one waveguide member retention structure disposed on an exterior surface of a semiconductor package. The waveguide member retention structure may be disposed a defined distance or at a defined location with respect to an antenna carried by the semiconductor package. The waveguide member retention structure may engage and guide a waveguide member slideably inserted into the respective waveguide member retention structure. The waveguide member retention structure may position the waveguide member at a defined location with respect to the antenna to maximize the power transfer from the antenna to the waveguide member.
Abstract translation: 波导耦合系统可以包括设置在半导体封装的外表面上的至少一个波导构件保持结构。 波导构件保持结构可以相对于由半导体封装承载的天线设置限定的距离或者限定的位置。 波导构件保持结构可接合并引导可滑动地插入到相应的波导构件保持结构中的波导构件。 波导构件保持结构可以将波导构件定位在相对于天线的限定位置处，以最大化从天线到波导构件的功率传输。
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Patent Agency Ranking26.发明申请PIEZOELECTRIC PACKAGE-INTEGRATED DELAY LINES FOR RADIO FREQUENCY IDENTIFICATION TAGS 审中-公开用于射频识别标签的压电包装集成延时线
公开(公告)号：WO2017172074A1
公开(公告)日：2017-10-05
申请号：PCT/US2017/017701
申请日：2017-02-13
Applicant: INTEL CORPORATION
Inventor： ELSHERBINI, Adel A. , KAMGAING, Telesphor , EID, Feras , NAIR, Vijay K. , DOGIAMIS, Georgios C. , SWAN, Johanna M. , RAO, Valluri R.
CPC classification number: G06K7/10297 , G06K7/10316 , G06K19/0672 , G06K19/0675 , H03H9/30
Abstract: Embodiments of the invention include delay line circuitry that is integrated with an organic substrate. Organic dielectric material and a plurality of conductive layers form the organic substrate. The delay line circuitry includes a piezoelectric transducer to receive a guided electromagnetic wave signal and to generate an acoustic wave signal to be transmitted with an acoustic transmission medium. An acoustic reflector is communicatively coupled to the acoustic transmission medium. The acoustic reflector receives a plurality of acoustic wave signals from the acoustic transmission medium and reflects acoustic wave signals to the piezoelectric transducer using the acoustic transmission medium. The transducer converts the reflected acoustic signals into electromagnetic waves which are then transmitted back through the antenna and decoded by the reader.
Abstract translation: 本发明的实施例包括与有机衬底集成的延迟线电路。 有机介电材料和多个导电层形成有机衬底。 延迟线电路包括压电换能器，以接收被导引的电磁波信号并且产生将与声音传输介质一起传输的声波信号。 声学反射器通信地耦合到声音传输介质。 声学反射器从声传输介质接收多个声波信号，并使用声传输介质将声波信号反射到压电传感器。 传感器将反射的声音信号转换成电磁波，然后通过天线传回并由读取器解码。
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27.发明申请TUNABLE RADIO FREQUENCY SYSTEMS USING PIEZOELECTRIC PACKAGE-INTEGRATED SWITCHING DEVICES 审中-公开使用压电包装集成开关设备的可调谐射频系统
公开(公告)号：WO2017172064A1
公开(公告)日：2017-10-05
申请号：PCT/US2017/017243
申请日：2017-02-09
Applicant: INTEL CORPORATION
Inventor： KAMGAING, Telesphor , EID, Feras , ELSHERBINI, Adel A. , DOGIAMIS, Georgios C. , NAIR, Vijay K. , SWAN, Johanna M. , RAO, Valluri R.
CPC classification number: H04B1/48 , H01H57/00 , H01H2057/006 , H03H7/38 , H03H2015/005
Abstract: Embodiments of the invention include a tunable radio frequency (RF) communication module that includes a transmitting component having at least one tunable component and a receiving component having at least one tunable component. The tunable RF communication module includes at least one piezoelectric switching device coupled to at least one of the transmitting and receiving components. The at least one piezoelectric switching device is formed within an organic substrate having organic material and is designed to tune at least one tunable component of the tunable RF communication module.
Abstract translation: 本发明的实施例包括可调谐射频（RF）通信模块，其包括具有至少一个可调谐组件的发送组件和具有至少一个可调谐组件的接收组件。 可调谐RF通信模块包括耦合到发射和接收组件中的至少一个的至少一个压电切换装置。 所述至少一个压电开关器件形成在具有有机材料的有机衬底内，并被设计成调谐可调谐RF通信模块的至少一个可调谐部件。
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公开(公告)号：WO2017172062A1
公开(公告)日：2017-10-05
申请号：PCT/US2017/017239
申请日：2017-02-09
Applicant: INTEL CORPORATION
Inventor： ELSHERBINI, Adel A. , EID, Feras , BICEN, Baris , KAMGAING, Telesphor , NAIR, Vijay K. , SWAN, Johanna M. , DOGIAMIS, Georgios C. , RAO, Valluri R.
Abstract: Embodiments of the invention include a piezoelectric resonator which includes an input transducer having a first piezoelectric material, a vibrating structure coupled to the input transducer, and an output transducer coupled to the vibrating structure. In one example, the vibrating structure is positioned above a cavity of an organic substrate. The output transducer includes a second piezoelectric material. In operation the input transducer causes an input electrical signal to be converted into mechanical vibrations which propagate across the vibrating structure to the output transducer.
Abstract translation: 本发明的实施例包括压电谐振器，其包括具有第一压电材料的输入变换器，耦合到输入变换器的振动结构以及耦合到振动结构的输出变换器。 在一个示例中，振动结构位于有机基底的空腔上方。 输出变换器包括第二压电材料。 在操作中，输入传感器将输入电信号转换成机械振动，该振动通过振动结构传播到输出传感器。
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29.发明申请MICROELECTRONIC DEVICES DESIGNED WITH HIGH FREQUENCY COMMUNICATION DEVICES INCLUDING COMPOUND SEMICONDUCTOR DEVICES INTEGRATED ON A DIE FABRIC ON PACKAGE 审中-公开采用高频通信设备设计的微电子器件，包括复合半导体器件，集成于包装上的模具包装上
公开(公告)号：WO2017111766A1
公开(公告)日：2017-06-29
申请号：PCT/US2015/000156
申请日：2015-12-22
Applicant: INTEL CORPORATION , DOGIAMIS, Georgios, C. , KAMGAING, Telesphor , LI, Eric, J. , FALCON, Javier, A.
Inventor： DOGIAMIS, Georgios, C. , KAMGAING, Telesphor , LI, Eric, J. , FALCON, Javier, A. , TOMITA, Yoshihiro , NAIR, Vijay, K. , LIFF, Shawna, M.
IPC: H01L23/58
Abstract: Embodiments of the invention include a microelectronic device that includes a first die having a silicon based substrate and a second die coupled to the first die. In one example, the second die is formed with compound semiconductor materials. The microelectronic device includes a substrate that is coupled to the first die with a plurality of electrical connections. The substrate including an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.
Abstract translation: 本发明的实施例包括微电子器件，其包括具有硅基衬底的第一管芯和耦合到第一管芯的第二管芯。 在一个示例中，第二管芯由化合物半导体材料形成。 微电子器件包括通过多个电连接与第一管芯耦合的衬底。 该基片包括一个天线单元，用于以大约4GHz或更高的频率发送和接收通信。
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公开(公告)号：WO2017052740A1
公开(公告)日：2017-03-30
申请号：PCT/US2016/043583
申请日：2016-07-22
Applicant: INTEL CORPORATION
Inventor： DOGIAMIS, Georgios C. , OSTER, Sasha N. , KAMGAING, Telesphor , ELSHERBINI, Adel A. , RAWLINGS, Brandon M. , EID, Feras
CPC classification number: H01L23/66 , H01L23/367 , H01L23/3675 , H01L23/49827 , H01L23/49838 , H01L23/5383 , H01L24/13 , H01L24/16 , H01L24/73 , H01L25/0655 , H01L2223/6627 , H01L2223/6677 , H01L2224/12105 , H01L2224/131 , H01L2224/16227 , H01L2224/73253 , H01L2924/1421 , H01L2924/1432 , H01L2924/1434 , H01L2924/15192 , H01L2924/15311 , H01L2924/15313 , H01L2924/15321 , H01L2924/16251 , H01L2924/163 , H01L2924/014 , H01L2924/00014
Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.
Abstract translation: 本发明的实施例可以包括包括热稳定射频集成电路（RFIC）的封装装置。 在一个实施例中，封装的器件可以包括安装到封装衬底的集成电路芯片。 根据实施例，封装基板可以具有将集成电路芯片通信地耦合到一个或多个外部部件的导线。 外部组件中的一个可以是RFIC模块。 RFIC模块可以包括RFIC和天线。 另外的实施例还可以包括包括形成在封装衬底中的多个冷却点的封装器件。 在一个实施例中，冷却点可以靠近互连线形成，将集成电路芯片通信地耦合到RFIC。
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