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    WAVEGUIDE COMMUNICATION WITH INCREASED LINK DATA RATE
    3.
    发明申请
    WAVEGUIDE COMMUNICATION WITH INCREASED LINK DATA RATE 审中-公开

    公开(公告)号：WO2018118337A1

    公开(公告)日：2018-06-28

    申请号：PCT/US2017/063058

    申请日：2017-11-22

    Applicant: INTEL CORPORATION

    Inventor： DOGIAMIS, Georgios C. ,  KAMGAING, Telesphor ,  COHEN, Emanuel ,  OSTER, Sasha N.

    IPC: H04B10/2575 ,  H04B10/2507 ,  H04B3/52

    Abstract: Embodiments of the present disclosure may relate to a transceiver to transmit and receive concurrently radio frequency (RF) signals via a dielectric waveguide. In embodiments, the transceiver may include a transmitter to transmit to a paired transceiver a channelized radio frequency (RF) transmit signal via the dielectric waveguide. A receiver may receive from the paired transceiver a channelized RF receive signal via the dielectric waveguide. In embodiments, the channelized RF receive signal may include an echo of the channelized RF transmit signal. The transceiver may further include an echo suppression circuit to suppress from the channelized RF receive signal the echo of the channelized RF transmit signal. In some embodiments, the channelized RF transmit signal and the channelized RF receive signal may be within a frequency range of approximately 30 gigahertz (GHz) to approximately 1 terahertz (THz), and the transceiver may provide full-duplex millimeter-wave communication.

    CHANNELIZATION FOR DISPERSION LIMITED WAVEGUIDE COMMUNICATION CHANNELS
    4.
    发明申请
    CHANNELIZATION FOR DISPERSION LIMITED WAVEGUIDE COMMUNICATION CHANNELS 审中-公开

    公开(公告)号：WO2018118331A1

    公开(公告)日：2018-06-28

    申请号：PCT/US2017/062872

    申请日：2017-11-21

    Applicant: INTEL CORPORATION

    Inventor： DOGIAMIS, Georgios C. ,  OSTER, Sasha N. ,  KAMGAING, Telesphor ,  COHEN, Emanuel

    IPC: H04B10/2507 ,  H04B10/2575 ,  H04B10/50 ,  H04B10/60

    Abstract: Embodiments of the present disclosure may relate to a transmitter to transmit a radio frequency (RF) signal to a receiver via a dielectric waveguide where the transmitter includes a plurality of mixers to generate modulated RF signals and a combiner to combine the modulated RF signals. Embodiments may also include a receiver to receive, from a dielectric waveguide, a RF signal where the receiver includes a splitter to split the RF signal into a plurality of signal paths, a plurality of filters, and a plurality of demodulators. Embodiments may also include a dielectric waveguide communication apparatus that may include the transmitter and the receiver. Other embodiments may be described and/or claimed.

    WAVEGUIDE CONNECTOR WITH TAPERED SLOT LAUNCHER
    7.
    发明申请
    WAVEGUIDE CONNECTOR WITH TAPERED SLOT LAUNCHER 审中-公开
    带有锥形插槽发射器的波导连接器

    公开(公告)号：WO2018063627A1

    公开(公告)日：2018-04-05

    申请号：PCT/US2017/048755

    申请日：2017-08-25

    Applicant: INTEL CORPORATION

    Inventor： ELSHERBINI, Adel A. ,  OSTER, Sasha N ,  SWAN, Johanna M. ,  DOGIAMIS, Georgios C. ,  LIFF, Shawna M. ,  ALEKSOV, Aleksandar ,  KAMGAING, Telesphor

    IPC: G02B6/42 ,  G02B6/43

    Abstract: The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide connector. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a planar first member and a planar second member that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide connector.

    Abstract translation: 这里描述的系统和方法提供了一种行波发射器系统，其物理地且可通信地耦合到半导体封装和波导连接器。 行波发射器系统包括一个槽线信号转换器和一个锥形槽发射器。 槽线信号转换器可以与半导体封装整体形成并且包括将微带信号转换为槽线信号的平衡 - 不平衡转换器结构。 锥形槽发射器可通信地耦合到槽线信号转换器并且包括形成槽的平面第一构件和平面第二构件。 锥形槽发射器将槽线信号转换成传播到波​​导连接器的行波信号。

    SEMICONDUCTOR PACKAGE INCLUDING A MODULAR SIDE RADIATING WAVEGUIDE LAUNCHER
    8.
    发明申请
    SEMICONDUCTOR PACKAGE INCLUDING A MODULAR SIDE RADIATING WAVEGUIDE LAUNCHER 审中-公开
    半导体封装，包括模块化边辐射波导发射器

    公开(公告)号：WO2018057006A1

    公开(公告)日：2018-03-29

    申请号：PCT/US2016/053491

    申请日：2016-09-23

    Applicant: INTEL CORPORATION

    Inventor： DOGIAMIS, Georgios ,  OSTER, Sasha ,  SWAN, Johanna ,  LIFF, Shawna ,  ELSHERBINI, Adel ,  KAMGAING, Telesphor ,  ALEKSOV, Aleksandar

    IPC: H01P5/107 ,  H01P3/00 ,  H01L23/66

    CPC classification number: H01Q13/02 ,  H01L23/66 ,  H01P3/121 ,  H01P5/107 ,  H01Q21/064

    Abstract: Integration of a side-radiating waveguide launcher system into a semiconductor package beneficially permits the coupling of a waveguide directly to the semiconductor package. Included are a first conductive member and a second conductive member separated by a dielectric material. Also included is a conductive structure, such as a plurality of vias, that conductively couples the first conductive member and the second conductive member. Together, the first conductive member, the second conductive member, and the conductive structure form an electrically conductive side-radiating waveguide launcher enclosing shaped space within the dielectric material. The shaped space includes a narrow first end and a wide second end. An RF excitation element is disposed proximate the first end and a waveguide may be operably coupled proximate the second end of the shaped space.

    Abstract translation: 侧辐射波导发射器系统集成到半导体封装中有利地允许波导直接耦合到半导体封装。 包括由电介质材料分开的第一导电构件和第二导电构件。 还包括导电结构，诸如多个通孔，其导电地耦合第一导电构件和第二导电构件。 第一导电构件，第二导电构件和导电结构一起形成封闭电介质材料内的成形空间的导电侧向辐射波导发射器。 成形空间包括窄的第一端和宽的第二端。 RF激励元件设置在第一端附近，并且波导可以可操作地耦合到成形空间的第二端附近。

    SEMICONDUCTOR PACKAGES WITH ANTENNAS
    9.
    发明申请
    SEMICONDUCTOR PACKAGES WITH ANTENNAS 审中-公开
    具有天线的半导体封装

    公开(公告)号：WO2018004684A1

    公开(公告)日：2018-01-04

    申请号：PCT/US2016/040828

    申请日：2016-07-01

    Applicant: INTEL CORPORATION

    Inventor： KAMGAING, Telesphor ,  ELSHERBINI, Adel A. ,  OSTER, Sasha N.

    IPC: H01L23/66 ,  H01L23/498 ,  H01L23/525

    Abstract: In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

    Abstract translation: 在各种实施例中，本文所公开的是系统和方法，涉及制造无芯半导体封装（例如，毫米（mm）波天线封装），其具有不对称的积层层数 被制造在临时衬底（例如，芯）的两侧上。 不对称的积层层数可以减少制造半导体封装时的总层数，并因此可以有助于降低制造成本。 在进一步的实施例中，半导体封装（例如，毫米（mm）波天线封装）可以进一步包括设置在一个或多个天线层附近的干化元件。 此外，设置在一个或多个天线层附近的模块化元件可以减少图像电流，从而增加天线增益和效率。

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