Abstract:
PROBLEM TO BE SOLVED: To provide a radiosensitive resin composition which has sufficient resolution, high resistance to a resist stripper or the like, excellent radiation sensitivity, and high light-shielding performance during heating. SOLUTION: The radiosensitive resin composition for forming partitions and insulating films includes: [A] an alkali-soluble resin of a copolymer obtained by copolymerization of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride and (a2) a monomer containing a compound selected from a group of phenol skeleton-containing unsaturated compounds, bisphenol skeleton-containing compounds, and naphthalene skeleton-containing compounds; [B] a 1, 2-quinonediazide compound; and [C] a heat sensitive dye. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition for forming a protective film capable of forming the protective film, having high surface evenness and excellent in characteristics such as transparency and heat resistance, on a substrate with an uneven surface, even when a slit coating method is employed as a coating method. SOLUTION: This resin composition for forming the protective film includes (A) a polymer having a repeating unit derived from a polymerizable unsaturated compound with an epoxy group, (B) at least one compound selected from the group consisting of polycarboxylic anhydride and polycarboxylic acid, (C) a specific polymer having a silicone chain, (D) a compound having at least two cationically polymerizable groups, and (E) an alkoxysilane compound having an epoxy group. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition for forming wiring partitions having sufficient resolution, wide exposure margin, and excellent flattening performance, maintaining high transparency even when being passed through a high temperature heating process and hardly secularly deteriorating metal wiring. SOLUTION: The radiation sensitive resin composition contains (A) polysiloxane obtained by poly-condensing (a-1) 50-99 wt.% of an alkoxy silane compound having an aryl group, (a-2) 1-45 wt.% of a silane compound having an alkyl group, and (a-3) 0-5 wt.% of the other alkoxy silane compound, and (B) a compound generating acid by receiving irradiation of radiation. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which, when used to form an interlayer insulation film under a baking condition of SOLUTION: The radiation-sensitive resin composition comprises [A] a polysiloxane having at least one group selected from the group consisting of an oxiranyl group and an oxetanyl group, and a functional group capable of addition reaction to an oxiranyl group or an oxetanyl group, and [B] a 1,2-quinonediazide compound. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition that has high radiation-sensitivity, has a developing margin capable of forming a superior pattern shape, even if exceeding the optimum developing time in a developing process and that can easily form a patterned thin film that is superior in adhesiveness. SOLUTION: The radiation-sensitive resin composition contains unsaturated carboxylic acid and/or unsaturated carboxylic acid anhydride, an unsaturated compound containing at least one from among an epoxy group or an oxetanyl group, (meth)acrylmorpholine, a compolymer of other unsaturated compounds and 1,2-quinonedizide compound. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high radiation sensitivity, having such a development margin that even if developing time exceeds the optimum time in a development step, a good pattern profile can be formed, and capable of easily forming a patterned thin film excellent in adhesion. SOLUTION: The radiation-sensitive resin composition includes [A] a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride, (a2) an unsaturated compound containing an epoxy group and/or an oxetanyl group and (a3) an unsaturated compound other than the components (a1) and (a2), [B] a 1,2-quinonediazide compound and [C] a siloxane oligomer containing a functional group which takes part in a crosslinking reaction with the component [A] under heat. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having sufficient process margin and good preservation stability and suitably used for forming protrusions of a perpendicularly oriented type liquid crystal display element, to provide the protrusions formed therefrom and to provide the liquid crystal display element having the protrusions. SOLUTION: The radiation-sensitive resin composition for forming the protrusions of the perpendicularly oriented type liquid crystal display element comprises [A] a copolymer obtained by copolymerizing (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride with (a2) a specific oxetanyl group-containing unsaturated compound and (a3) an olefinically unsaturated compound other than the (a1) and (a2) and [B] a 1,2-quinone diazide compound. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition for forming microlens which can form a microlens which has an excellent film thickness, resolution, pattern shape, transparency, heat resistance, heat discoloring resistance and solvent resistance or the like and a favorable preservation stability. SOLUTION: A radiation sensitive resin composition for forming microlens includes (A) an alkali soluble copolymer consists of (a) 10 to 50 wt.% of polymerizable unsaturated compound having an acid functional group, (b) 20 to 60 wt.% of polymerizable unsaturated compound having an alicyclic hydrocarbon group and having no acid functional group, (c) 5 to 40 wt.% of other polymerizable unsaturated compound ((a)+(b)+(c)=100 wt.%); (B) a polymerizable unsaturated compound; (C) a photopolymerization initiator and (D) a thermal polymerizable compound. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a wafer fixing composition containing a specific liquid crystal compound and an organic polymer and a semiconductor wafer processing method using the same, wherein a semiconductor wafer is brought into close contact with a base such as a hard plate, an elastic carrier (packing material), or a wafer and fixed so as to be held when the wafer is processed, the wafer as a work is easily separated, a fixing agent layer attached to the wafer is easily removed and/or cleaned, and the wafer as the work is kept free from contamination. SOLUTION: The wafer fixing composition contains a specific liquid crystal compound and an organic polymer. The wafer fixing composition can be provided in the form of liquid or a film. A thin film of the composition is formed on the wafer or the base. The wafer and the base, either of them is provided with the composition film on its surface, are brought into close contact with each other and fixed with each other. After the exposed surface of the wafer is subjected to processing, the wafer is separated from the base and cleaned, whereby the purpose can be achieved. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a wafer immobilizing agent, a composition for the wafer immobilizing agent and a method of working a wafer by using the same in which a semiconductor wafer is tightly immobilized and held on a substrate such as hard plate, elastic carrier (backing) or wafer when working the semiconductor wafer, the wafer of an object to be worked is easily released, further, a layer of the immobilizing agent stuck on the wafer is easily removed and irrigated and there is no danger of contamination with respect to the wafer of the object to be worked. SOLUTION: A liquid crystal compound is used as the immobilizing agent. Besides, the composition for immobilization contains the liquid crystal compound. By using them, a thin film of the liquid crystal compound is formed on a surface of the wafer or of the substrate and by using at least either one of the wafer or the substrate formed with the thin film on its surface, the both are tightly contacted and immobilized. Then, an exposed face of the wafer is worked and the wafer is separated from the substrate and irrigated to work the wafer. COPYRIGHT: (C)2004,JPO