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公开(公告)号：JP2004149624A
公开(公告)日：2004-05-27
申请号：JP2002314622
申请日：2002-10-29
Applicant: Kao Corp , Nichireki Co Ltd , ニチレキ株式会社 , 花王株式会社
Inventor： HONMA YUICHI , TAMAOKI RYOICHI , MUKAI TAKASHI , SASAKI HIROTAKA , OKUDA KOJI , UENO SADAJI , HAIRI SHOKICHI
Abstract: PROBLEM TO BE SOLVED: To obtain a heat-modified asphalt composition which can improve further peeling prevention effect between asphalt and aggregate, and does not lose such an effect even by heating for a long period of time.
SOLUTION: This heat-modified asphalt composition comprises a specific gallic ester, or the like, and a rubber and/or a thermoplastic elastomer each at a specific ratio to the asphalt.
COPYRIGHT: (C)2004,JPO-
公开(公告)号：JP2003277614A
公开(公告)日：2003-10-02
申请号：JP2003007046
申请日：2003-01-15
Inventor： HONMA YUICHI , TAMAOKI RYOICHI , MUKAI TAKASHI
Abstract: PROBLEM TO BE SOLVED: To obtain an additive for heated asphalt, capable of remarkably improving an inhibiting effect on separation of the asphalt from aggregates.
SOLUTION: This additive for the heated asphalt contains a compound (I) and/or compounds (II), wherein the compound (I) is expressed by formula (1) (R is a 1-22C hydrocarbon residue), and the compounds (II) are expressed by formulae (2) and (3).
COPYRIGHT: (C)2004,JPOAbstract translation: 要解决的问题：为了获得加热沥青添加剂，能够显着提高沥青与聚集体分离的抑制效果。 解决方案：用于加热沥青的这种添加剂含有化合物（I）和/或化合物（II），其中化合物（I）由式（1）表示（R是1-22℃烃残基），和 化合物（II）由式（2）和（3）表示。 版权所有（C）2004，JPO
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公开(公告)号：JP2002138201A
公开(公告)日：2002-05-14
申请号：JP2001152320
申请日：2001-05-22
Applicant: KAO CORP
Inventor： HONMA YUICHI , TAMAOKI RYOICHI , SASAKI HIROTAKA
IPC: C10L1/32 , B01F17/42 , C08G65/329 , C08J3/03 , C08K5/06 , C08K5/101 , C08L71/02 , C08L95/00 , C10L10/18
Abstract: PROBLEM TO BE SOLVED: To obtain a stabilizer for an asphalt emulsion that has good chemical stability and gives an asphalt emulsion excellent in both standing stability and storage stability. SOLUTION: As a stabilizer for an asphalt emulsion, a polyoxyethylene-added compound is used, which has a terminal group A selected from an 8-22C alkyl group, and the like, a terminal group B selected from hydrogen atom, a 1-4C alkyl group, and the like, and 130-500 on the average of oxyethylene groups bonding the terminal groups A and B.
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公开(公告)号：JPH11114400A
公开(公告)日：1999-04-27
申请号：JP28681897
申请日：1997-10-20
Applicant: KAO CORP
Inventor： ISOBE KAZUO , HONMA YUICHI , TAMAOKI RYOICHI
Abstract: PROBLEM TO BE SOLVED: To improve emulsifying action to hard asphalt having low penetration and modified asphalt and to also improve shelf stability by incorporating a specified compd. SOLUTION: The cationic emulsifier contains a compd. represented by the formula, wherein R1 is an 11-23C linear or branched alkyl or alkenyl, preferably a 13-21C linear or branched alkyl or alkenyl, particularly preferably a 15-19C linear or branched alkyl or alkenyl, R2 and R3 are each a 1-4C alkyl, preferably 1 or 2C alkyl, R4 is H or a 1-4C alkyl, preferably H or 1 or 2C alkyl and (x) is an integer of 1-4, preferably 2 or 3.
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公开(公告)号：JP2006102829A
公开(公告)日：2006-04-20
申请号：JP2004289475
申请日：2004-10-01
Inventor： HONMA YUICHI , SUENAGA KENICHI
IPC: B24B37/00 , B24B37/005 , C09K3/14
Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate, remarkably reducing nano-scratch, which is significant in high densification, and performing polishing economically in a polishing process of a precise part substrate such as a memory hard disc and a semiconductor element. SOLUTION: This manufacturing method of a substrate includes: a process of polishing a substrate by supplying a polishing liquid composition to a polishing machine having a surface plate at a flow rate of 0.06 cm 3 /min per polished area 1cm 2 of the substrate or more. The polishing liquid composition at least contains polishing material and water, and has pH of 0.1 to 7. The number of polishing particles from 0.56 μm and under 1 μm is 500,000 per polishing liquid composition 1 cm 3 . COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：为了提供一种基板的制造方法，显着降低了在高致密化中显着的纳米划痕，并且在诸如存储硬盘的精密部件基板的抛光工艺中经济地进行抛光，以及 半导体元件。 解决方案：这种基板的制造方法包括：通过将抛光液组合物以0.06cm 3 / SP / min的流速向具有表面板的抛光机提供抛光底物的方法 每个抛光面积1cm
2 或更多。 抛光液组合物至少含有研磨材料和水，pH为0.1〜7。研磨液组合物1cm×SP 3的研磨粒子数0.56μm以下1μm以下为500,000。 版权所有（C）2006，JPO＆NCIPI -
Patent Agency Ranking
公开(公告)号：JP2005319573A
公开(公告)日：2005-11-17
申请号：JP2004259986
申请日：2004-09-07
Inventor： HONMA YUICHI , TAIRA KOJI , TAKASHINA SHIGEAKI
CPC classification number: C09K3/1463 , C09G1/02 , C09K3/1409
Abstract: PROBLEM TO BE SOLVED: To provide a polishing fluid composition allowing economical polishing at high polishing speed while remarkably reducing nano-scratches with small surface roughness of a polished material after polishing, and to provide a substrate manufacturing method remarkably reducing nano-scratches with small surface roughness.
SOLUTION: The polishing fluid composition contains an abrasive having an average particle size of 1-30 nm and water, wherein the abrasive has a packing ratio of 79-90 wt%. The substrate manufacturing method has a process for introducing the polishing fluid composition with the abrasive packing ratio of 79-90 wt% between a substrate and a polishing pad and polishing while bringing the polishing fluid composition into contact with the substrate. The substrate manufacturing method has a polishing process using the above polishing fluid composition.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：提供一种能够以高抛光速度经济地研磨的抛光液组合物，同时显着地减少研磨后抛光材料表面粗糙度小的纳米划痕，并提供显着降低纳米划痕的基板制造方法 表面粗糙度小。 抛光液组合物含有平均粒径为1-30nm的磨料和水，其中磨料的填充率为79-90重量％。 基板制造方法具有将基板和研磨垫之间的研磨填充率为79〜90重量％的研磨液组合物导入，同时使抛光液组合物与基板接触的工序。 基板制造方法具有使用上述研磨液组合物的研磨工序。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2005262413A
公开(公告)日：2005-09-29
申请号：JP2004081768
申请日：2004-03-22
Inventor： YOSHIDA HIROYUKI , HONMA YUICHI
Abstract: PROBLEM TO BE SOLVED: To provide a polishing liquid composition capable of providing a small surface roughness of a polished object and remarkably reducing nanoscratch, and a manufacturing method of a substrate having a small surface roughness and a remarkable reduction of the nano scratch. SOLUTION: A polishing liquid composition formed by containing a polishing material wherein the average particle diameter of a primary particle is not less than 1nm and under 40 nm, e.g. the polishing liquid composition wherein the zeta potential of the polishing material in the polishing liquid composition is -15 to 30 mV, and a manufacturing method of a substrate having the step of polishing by using the polishing liquid composition wherein the zeta potential of the polishing material in the polishing liquid composition is adjusted to -15 to 30 mV. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题：提供能够提供抛光对象的小表面粗糙度并显着减少纳米尺度的抛光液组合物，以及具有小表面粗糙度和显着降低纳米划痕的基板的制造方法 。 解决方案：通过包含一次粒子的平均粒径为1nm以上且40nm以下的研磨材料形成的研磨液组合物， 研磨液组合物中的研磨材料的ζ电位为-15〜30mV的研磨液组合物，以及具有使用抛光液组合物进行研磨的工序的基板的制造方法，其中研磨材料的ζ电位 在抛光液中组合物调节至-15〜30mV。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2002294077A
公开(公告)日：2002-10-09
申请号：JP2001316340
申请日：2001-10-15
Applicant: KAO CORP
Inventor： HONMA YUICHI , TAMAOKI RYOICHI , SASAKI HIROTAKA
Abstract: PROBLEM TO BE SOLVED: To provide especially a cationic asphalt emulsion composition scarcely being influenced with temperatures during application or characteristics of an aggregate used and capable of ensuring a sufficient aggregate mixing time and affording slurry fluidity suitable for application. SOLUTION: This asphalt emulsion composition comprises an asphalt and water and further contains (A) a kraft lignin having 4,000-60,000 molecular weight and (B) a specific polyamine in respective ratios based on the asphalt emulsion composition.
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公开(公告)号：JP2002256297A
公开(公告)日：2002-09-11
申请号：JP2001391293
申请日：2001-12-25
Applicant: KAO CORP
Inventor： TAMAOKI RYOICHI , HONMA YUICHI , SASAKI HIROTAKA
IPC: E01H1/10 , C11D1/14 , C11D1/22 , C11D1/28 , C11D1/29 , C11D1/30 , C11D1/72 , C11D3/06 , C11D3/37 , C11D10/02 , C11D17/00
Abstract: PROBLEM TO BE SOLVED: To provide a detergent that can efficiently and effectively remove the soil, sand, dirt, dust or cloggings in the gaps of a draining or water- permeating pavement road to restore the original water-draining or water- permeating properties of the paved road. SOLUTION: The objective detergent for the paved road includes a dispersant having the surface tension of 45-72 mN/m, when it is diluted with water to 0.1 wt.% concentration, a penetration agent having the surface tension of 20-45 mN/m, when it is diluted with water to 0.1 wt.% concentration.
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公开(公告)号：JP2008012668A
公开(公告)日：2008-01-24
申请号：JP2007222604
申请日：2007-08-29
Inventor： HONMA YUICHI , TAIRA KOJI , TAKASHINA SHIGEAKI
IPC: B24B37/00 , B82Y10/00 , B82Y99/00 , C09K3/14 , H01L21/304
Abstract: PROBLEM TO BE SOLVED: To provide a polishing-fluid composition that achieves a small surface roughness of a workpiece after polishing while remarkably reducing nano-scratches and allows to polish economically at a high polishing speed, and a manufacturing method for a substrate that has the small surface roughness and whose nano-scratches are remarkably reduced. SOLUTION: The polishing-fluid composition includes an abrasive, having an average particle size of 1-30 nm, and water. The substrate manufacturing method has the step of polishing a substrate by introducing the polishing-fluid composition, in which the abrasive has 79-90 wt.% of a packing ratio, between the substrate and a polishing pad while contacting the substrate with the polishing-fluid composition. The substrate manufacturing method has a polishing step using the polishing-fluid composition. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 解决的问题：提供一种能够在抛光后实现工件的表面粗糙度小的抛光液组合物，同时显着地减少纳米划痕并允许以高抛光速度经济地抛光，以及基板的制造方法 具有小的表面粗糙度并且其纳米刮痕显着减少。 抛光液组合物包括平均粒径为1-30nm的研磨剂和水。 基板制造方法具有以下步骤：在将基板与抛光垫相接触的同时，在基板和抛光垫之间引入研磨剂含有79-90重量％的填充率的研磨液组合物， 流体组成。 基板制造方法具有使用研磨液组合物的研磨工序。 版权所有（C）2008，JPO＆INPIT
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