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公开(公告)号：DE60330647D1
公开(公告)日：2010-02-04
申请号：DE60330647
申请日：2003-01-15
Applicant: KAO CORP
Inventor： HONMA YUICHI , TAMAKI RYOICHI , MUKAI TAKASHI
Abstract: The invention provides an additive for heated asphalt that can further improve a peeling prevention effect between asphalt and aggregates. The invention relates to an additive which is added to heated asphalt containing a particular gallic acid ester and so on.
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公开(公告)号：ES2337993T3
公开(公告)日：2010-05-03
申请号：ES03700574
申请日：2003-01-15
Applicant: KAO CORP
Inventor： HONMA YUICHI , TAMAKI RYOICHI , MUKAI TAKASHI
Abstract: Composición de asfalto calentado que se forma mezclando un aditivo que comprende uno o ambos de (I) y (II) a continuación: (I) un compuesto representado por la fórmula (1) a continuación **(Ver fórmula)** en la que R representa un grupo hidrocarbonado que tiene de 5 a 22 átomos de carbono; (II) un compuesto representado por la fórmula (2) y un compuesto representado por la fórmula (3): **(Ver fórmula)** teniendo el aditivo un contenido en agua del 0,2% en peso o menos, con asfalto calentado a una temperatura de 100ºC a 300ºC, en la que el aditivo está contenido en una cantidad del 0,005 al 3% en peso en relación con el asfalto.
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公开(公告)号：GB2412917A
公开(公告)日：2005-10-12
申请号：GB0505057
申请日：2005-03-11
Applicant: KAO CORP
Inventor： YOSHIDA HIROYUKI , HONMA YUICHI , TAKASHINA SHIGEAKI , HAGIHARA TOSHIYA
Abstract: A polishing composition containing an aqueous medium and silica particles, wherein the silica particles in the polishing composition has a zeta potential of from -15 to 40 mV; a method for manufacturing a substrate including the step of polishing a substrate to be polished with a polishing composition containing an aqueous medium and silica particles, wherein the silica particles in the polishing composition has a zeta potential of from -15 to 40 mV; and a method for reducing scratches on a substrate to be polished with a polishing composition containing an aqueous medium and silica particles, including the step of adjusting a zeta potential of silica particles in the polishing composition to -15 to 40 mV. The polishing composition can be favorably used in polishing the substrate for precision parts, including substrates for magnetic recording media such as magnetic discs, optical discs and opto-magnetic discs; photomask substrates; optical lenses; optical mirrors; optical prisms; semiconductor substrates; and the like.
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公开(公告)号：EP1466945A4
公开(公告)日：2005-01-26
申请号：EP03700574
申请日：2003-01-15
Applicant: KAO CORP
Inventor： HONMA YUICHI , TAMAKI RYOICHI , MUKAI TAKASHI
CPC classification number: C08K5/134 , C08L95/00 , C08L2666/74
Abstract: An additive for a heating type asphalt, which comprises a specific ester of gallic acid or the like. The additive exhibits significantly improved preventive effect for the separation of asphalt and an aggregate.
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公开(公告)号：MY142247A
公开(公告)日：2010-11-15
申请号：MYPI20053553
申请日：2005-08-01
Applicant: KAO CORP
Inventor： NISHIMOTO KAZUHIKO , TAIRA KOUJI , HONMA YUICHI , SUENAGA KENICHI
Abstract: A POLISHING COMPOSITION CONTAINING AN ABRASIVE AND WATER, WHEREIN THE POLISHING COMPOSITION HAS A PH OF FROM 0.1 TO 7, AND SATISFIES THE FOLLOWING CONDITIONS: (1) THAT THE NUMBER OF POLISHING PARTICLES HAVING SIZES OF 0.56 μM OR MORE AND LESS THAN 1μM IS 500,000 OR LESS PER 1 CM³ OF THE POLISHING COMPOSITION; AND (2) THAT THE RATIO OF POLISHING PARTICLES HAVING SIZES OF 1 μM OR MORE IS 0.001% BY WEIGHT OR LESS TO THE ENTIRE POLISHING PARTICLES IN THE POLISHING COMPOSITION. THE POLISHING COMPOSITION IS SUITABLE FOF POLISHING SUBSTRATES FOR PRECISION PARTS INCLUDING, FOR EXAMPLE, RECORDING DISK SUBSTRATES, SUCH AS MAGNETIC DISKS, OPTICAL DISKS, AND OPTO-MAGNETIC DISKS, PHOTOMASK SUBSTRATES,OPTICAL LENSES, OPTICAL MIRRORS, OPTICAL PRISMS AND SEMICONDUCTOR SUBSTRATES,AND THE LIKE.
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Patent Agency Ranking
公开(公告)号：MY141876A
公开(公告)日：2010-07-16
申请号：MYPI20051185
申请日：2005-03-18
Applicant: KAO CORP
Inventor： YOSHIDA HIROYUKI , HONMA YUICHI , TAKASHINA SHIGEAKI , HAGIHARA TOSHIYA
Abstract: THE PRESENT INVENTION RELATES TO A POLISHING COMPOSITION CONTAINING AN AQUEOUS MEDIUM AND SILICA PARTICLES, WHEREIN THE SILICA PARTICLES IN THE POLISHING COMPOSITION HAS A ZETA POTENTIAL OF FROM -15 TO 40 MV; A METHOD FOR MANUFACTURING A SUBSTRATE INCLUDING THE STEP OF POLISHING A SUBSTRATE TO BE POLISHED WITH A POLISHING COMPOSITION CONTAINING AN AQUEOUS MEDIUM AND SILICA PARTICLES, WHEREIN THE SILICA PARTICLES IN THE POLISHING COMPOSITION HAS A ZETA POTENTIAL OF FROM -15 TO 40 MV; AND A METHOD FOR REDUCING SCRATCHES ON A SUBSTRATE TO BE POLISHED WITH A POLISHING COMPOSITION CONTAINING AN AQUEOUS MEDIUM AND SILICA PARTICLES, INCLUDING THE STEP OF ADJUSTING A ZETA POTENTIAL OF SILICA PARTICLES IN THE POLISHING COMPOSITION TO -15 TO 40 MV. THE POLISHING COMPOSITION CAN BE FAVORABLY USED IN POLISHING THE SUBSTRATE FOR PRECISION PARTS, INCLUDING SUBSTRATES FOR MAGNETIC RECORDING MEDIA SUCH AS MAGNETIC DISCS, OPTICAL DISCS AND OPTO-MAGNETIC DISCS; PHOTOMASK SUBSTRATES; OPTICAL LENSES; OPTICAL MIRRORS; OPTICAL PRISMS; SEMICONDUCTOR SUBSTRATES; AND THE LIKE.
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公开(公告)号：MY139129A
公开(公告)日：2009-08-28
申请号：MYPI20051513
申请日：2005-04-05
Applicant: KAO CORP
Inventor： HONMA YUICHI , TAIRA KOUJI , TAKASHINA SHIGEAKI
Abstract: THE PRESENT INVENTION RELATES TO A POLISHING COMPOSITION CONTAINING AN ABRASIVE HAVING AN AVERAGE PARTICLE SIZE OF FROM 1 TO 30 NM AND WATER, WHEREIN THE ABRASIVE HAS A PACKING RATIO OF FROM 79 TO 90% BY WEIGHT; A METHOD FOR MANUFACTURING A SUBSTRATE, INCLUDING THE STEPS OF INTRODUCING THE ABOVE POLISHING COMPOSITION BETWEEN A SUBSTRATE AND A POLISHING PAD, AND POLISHING THE SUBSTRATE, WHILE CONTACTING THE SUBSTRATE WITH THE POLISHING COMPOSITION; AND A METHOD FOR REDUCING SCRATCHES OF A SUBSTRATE TO BE POLISHED, INCLUDING THE STEP OF POLISHING THE SUBSTRATE TO BE POLISHED WITH THE ABOVE POLISHING COMPOSITION. THE POLISHING COMPOSITION IS SUITABLE FOR POLISHING SUBSTRATES FOR PRECISION PARTS INCLUDING, FOR EXAMPLE, SUBSTRATES FOR MAGNETIC RECORDING MEDIA, SUCH AS MAGNETIC DISKS, AND OPTO-MAGNETIC DISKS, PHOTOMASK SUBSTRATES, OPTICAL DISKS, OPTICAL LENSES, OPTICAL MIRRORS; OPTICAL PRISMS AND SEMICONDUCTOR SUBSTRATES, AND THE LIKE.
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公开(公告)号：GB2417034B
公开(公告)日：2010-01-13
申请号：GB0514473
申请日：2005-07-14
Applicant: KAO CORP
Inventor： NISHIMOTO KAZUHIKO , TAIRA KOUJI , SUENAGA KENICHI , HONMA YUICHI
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公开(公告)号：GB2412917B
公开(公告)日：2009-06-10
申请号：GB0505057
申请日：2005-03-11
Applicant: KAO CORP
Inventor： YOSHIDA HIROYUKI , HONMA YUICHI , TAKASHINA SHIGEAKI , HAGIHARA TOSHIYA
Abstract: The present invention relates to a polishing composition containing an aqueous medium and silica particles, wherein the silica particles in the polishing composition has a zeta potential of from -15 to 40 mV; a method for manufacturing a substrate including the step of polishing a substrate to be polished with a polishing composition containing an aqueous medium and silica particles, wherein the silica particles in the polishing composition has a zeta potential of from -15 to 40 mV; and a method for reducing scratches on a substrate to be polished with a polishing composition containing an aqueous medium and silica particles, including the step of adjusting a zeta potential of silica particles in the polishing composition to -15 to 40 mV. The polishing composition can be favorably used in polishing the substrate for precision parts, including substrates for magnetic recording media such as magnetic discs, optical discs and opto-magnetic discs; photomask substrates; optical lenses; optical mirrors; optical prisms; semiconductor substrates; and the like.
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公开(公告)号：AU2003201889A1
公开(公告)日：2003-07-30
申请号：AU2003201889
申请日：2003-01-15
Applicant: KAO CORP
Inventor： TAMAKI RYOICHI , MUKAI TAKASHI , HONMA YUICHI
Abstract: The invention provides an additive for heated asphalt that can further improve a peeling prevention effect between asphalt and aggregates. The invention relates to an additive which is added to heated asphalt containing a particular gallic acid ester and so on.
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