公开(公告)号：WO2016064710A1

公开(公告)日：2016-04-28

申请号：PCT/US2015/056169

申请日：2015-10-19

Applicant: KLA-TENCOR CORPORATION ,  PLIHAL, Martin ,  ANANTHA, Vidyasagar

Inventor： PLIHAL, Martin ,  ANANTHA, Vidyasagar

IPC: H01L21/66

CPC classification number: G06T7/0004 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/8854 ,  G06K9/00 ,  G06K9/52 ,  G06K9/6255 ,  G06T7/001 ,  G06T2207/30148

Abstract: Methods and systems for generating a defect sample for a wafer are provided. One method includes separating defects detected on a wafer into bins having diversity in values of a first set of one or more first attributes of the defects. The method also includes selecting, independently from one or more of the bins, defects within the bins based on diversity in a second set of one or more second attributes of the defects. The selected defects are then used to create a defect sample for the wafer. In this manner, defects having diverse values of multiple attributes can be easily selected.

Abstract translation: 提供了用于生成晶片缺陷样品的方法和系统。 一种方法包括将在晶片上检测到的缺陷分离成具有缺陷的一个或多个第一属性的第一组的值的多样性的箱。 该方法还包括基于缺陷的一个或多个第二属性的第二组中的多样性来独立于从一个或多个箱中选择箱内的缺陷。 然后使用所选择的缺陷来为晶片创建缺陷样品。 以这种方式，可以容易地选择具有多个属性的不同值的缺陷。

公开(公告)号：WO2015134650A1

公开(公告)日：2015-09-11

申请号：PCT/US2015/018798

申请日：2015-03-04

Applicant: KLA-TENCOR CORPORATION

Inventor： PLIHAL, Martin

IPC: H01L21/66

CPC classification number: G06N99/005 ,  G06N5/025 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/20081 ,  G06T2207/30148

Abstract: Methods and systems for classifying defects detected on a wafer are provided. One method includes inputting information for defects detected on a wafer into each of at least two defect classifiers included in a composite defect classifier. Such a method also includes, for at least one of the defects that is assigned to two or more bins in the composite defect classifier, determining a bin for the at least one of the defects based on a rank assigned to the two or more bins. The rank is assigned to the two or more bins based on one or more characteristics determined for the two or more bins, and the one or more characteristics are determined based on a comparison of predetermined defect classifications for defects in a training set and defect classifications determined for the defects in the training set by the at least two defect classifiers.

Abstract translation: 提供了用于分类在晶片上检测到的缺陷的方法和系统。 一种方法包括将在晶片上检测到的缺陷的信息输入到复合缺陷分类器中包括的至少两个缺陷分类器中的每一个中。 这种方法还包括对于分配给复合缺陷分类器中的两个或更多个箱的至少一个缺陷，基于分配给两个或多个箱的等级来确定所述至少一个缺陷的仓。 基于为两个或多个箱确定的一个或多个特性将等级分配给两个或更多个箱，并且基于针对训练集中的缺陷的预定缺陷分类和确定的缺陷分类的比较来确定一个或多个特性 对于由至少两个缺陷分类器设置的训练中的缺陷。

公开(公告)号：WO2014074910A1

公开(公告)日：2014-05-15

申请号：PCT/US2013/069285

申请日：2013-11-08

Applicant: KLA-TENCOR CORPORATION

Inventor： PLIHAL, Martin ,  ANANATHA, Vidyasagar ,  PARAMASIVAM, Saravanan ,  LEE, Christopher W.

IPC: G06F19/00 ,  H01L21/66

CPC classification number: G06T7/0008 ,  F04C2270/0421 ,  G06T5/50 ,  G06T7/0004 ,  G06T2207/30148

Abstract: Methods and systems for generating unbiased wafer defect samples are provided. One method includes selecting the defects detected by each of multiple scans performed on a wafer that have the most diversity in one or more defect attributes such that a diverse set of defects are selected across each scan. In addition, the method may include selecting the defects such that any defect that is selected and is common to two or more of the scans is not selected twice and any defects that are selected are diverse with respect to the common, selected defect. Furthermore, no sampling, binning, or classifying of the defects may be performed prior to selection of the defects such that the sampled defects are unbiased by any sampling, binning, or classifying method.

Abstract translation: 提供了用于产生无偏置晶片缺陷样品的方法和系统。 一种方法包括选择通过在一个或多个缺陷属性中具有最多分集的晶片上执行的多次扫描中检测到的缺陷，以便跨越每个扫描来选择不同的缺陷组。 此外，该方法可以包括选择缺陷，使得两个或更多个扫描选择并且是共同的任何缺陷不被选择两次，并且所选择的任何缺陷相对于共同的所选缺陷是多种多样的。 此外，在选择缺陷之前，可以不进行采样，分类或缺陷分类，以便通过任何采样，合并或分类方法对采样缺陷进行不偏见。

公开(公告)号：WO2011008688A2

公开(公告)日：2011-01-20

申请号：PCT/US2010/041697

申请日：2010-07-12

Applicant: KLA-TENCOR CORPORATION ,  PARK, Allen ,  CHANG, Ellis ,  AOKI, Masami ,  YOUNG, Chris, Chih-Chien ,  PLIHAL, Martin ,  VAN RIET, Michael, John

Inventor： PARK, Allen ,  CHANG, Ellis ,  AOKI, Masami ,  YOUNG, Chris, Chih-Chien ,  PLIHAL, Martin ,  VAN RIET, Michael, John

IPC: H01L21/66

CPC classification number: H01L22/12 ,  G03F7/70516 ,  G03F7/70625 ,  G03F7/70641 ,  G03F7/7065

Abstract: A system and method of matching multiple scanners using design and defect data are described. A golden wafer is processed using a golden tool. A second wafer is processed using a second tool. Both tools provide focus/exposure modulation. Wafer-level spatial signatures of critical structures for both wafers can be compared to evaluate the behavior of the scanners. Critical structures can be identified by binning defects on the golden wafer having similar patterns. In one embodiment, the signatures must match within a certain percentage or the second tool is characterized as a "no match". Reticles can be compared in a similar manner, wherein the golden and second wafers are processed using a golden reticle and a second reticle, respectively.

Abstract translation: 描述了使用设计和缺陷数据匹配多个扫描仪的系统和方法。 使用金色工具处理金色晶圆。 使用第二工具处理第二晶片。 这两种工具都提供焦点/曝光调制。 可以比较两个晶片的关键结构的晶圆级空间签名以评估扫描仪的行为。 关键结构可以通过在具有相似图案的金色晶圆上装箱缺陷来识别。 在一个实施例中，签名必须在特定百分比内匹配，或者第二工具被表征为“不匹配”。 可以以类似的方式比较光罩，其中分别使用金色光罩和第二光罩处理金色和第二晶片。

公开(公告)号：WO2011002651A1

公开(公告)日：2011-01-06

申请号：PCT/US2010/039656

申请日：2010-06-23

Applicant: KLA-TENCOR CORPORATION ,  HUET, Patrick ,  DUFFY, Brian ,  PLIHAL, Martin ,  TRAUTZSCH, Thomas ,  MAHER, Chris

Inventor： HUET, Patrick ,  DUFFY, Brian ,  PLIHAL, Martin ,  TRAUTZSCH, Thomas ,  MAHER, Chris

IPC: G01R31/26

CPC classification number: G01R31/2656 ,  G01R31/2894 ,  G05B19/41875 ,  G05B2219/37224 ,  H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  Y02P90/22 ,  H01L2924/00

Abstract: Systems and methods for monitoring time-varying classification performance are disclosed. A method may include, but is not limited to: receiving one or more signals indicative of one or more properties of one or more samples from one or more scanning inspection tools; determining populations of one or more defect types for the one or more samples according an application of one or more classification rules to the one or more signals received from the one or more scanning inspection tools; determining populations of the one or more defect types for the one or more samples using one or more high-resolution inspection tools; and computing one or more correlations between populations of one or more defect types for one or more samples determined from application of one or more classification rules applied to one or more signals received from the one or more scanning inspection tools and populations of the one or more defect types for the one or more samples determined using the one or more high-resolution inspection tools.

Abstract translation: 公开了用于监视时变分类性能的系统和方法。 方法可以包括但不限于：从一个或多个扫描检查工具接收指示一个或多个样品的一个或多个特性的一个或多个信号; 根据一个或多个分类规则对从一个或多个扫描检查工具接收的一个或多个信号的应用来确定一个或多个样本的一个或多个缺陷类型的种群; 使用一个或多个高分辨率检查工具确定所述一个或多个样品的一种或多种缺陷类型的种群; 以及计算一个或多个缺陷类型的群体之间的一个或多个相关性，所述一个或多个缺陷类型的群体从应用于从一个或多个扫描检查工具和所述一个或多个扫描检查工具的群体接收到的一个或多个信号的一个或多个分类规则 使用一个或多个高分辨率检查工具确定的一个或多个样品的缺陷类型。