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公开(公告)号：WO2014197494A1
公开(公告)日：2014-12-11
申请号：PCT/US2014/040735
申请日：2014-06-03
Applicant: KLA-TENCOR CORPORATION
Inventor： RAQUEL, Francis , MANZER, Matthew , LEE, Christopher W.
CPC classification number: G01N21/9501 , G01N2201/126
Abstract: The present disclosure is directed to a method of tool matching that employs an auto-learning feedback loop to update a library of key parameters. According to the method, measurements are performed on a control wafer to collect a set of parameters associated with the process/analysis tool that is being matched. When deviated parameters correlate to a correctable tool condition (i.e. a tool matching event), the parameters are added to the library of key parameters. These key or critical parameters may be monitored on a more frequent basis to identify deviations that have a strong likelihood of matching with a correctable tool condition. The tool matching methodology advantageously allows for monitoring of an automatically updated list of key parameters instead of needing to look at the full set of parameters collected from a control wafer each time. As such, tool matching can be performed on a more frequent basis.
Abstract translation: 本公开涉及一种使用自动学习反馈循环来更新关键参数库的工具匹配方法。 根据该方法，在控制晶片上进行测量以收集与正在匹配的过程/分析工具相关联的一组参数。 当偏差参数与可修正的刀具条件（即刀具匹配事件）相关时，将参数添加到关键参数库中。 可以在更频繁的基础上监视这些关键或关键参数，以识别具有与可修正工具条件匹配的强烈可能性的偏差。 工具匹配方法有利地允许监视自动更新的关键参数列表，而不是每次都需要查看从控制晶片收集的全部参数。 因此，可以更频繁地进行工具匹配。
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公开(公告)号：WO2014074910A1
公开(公告)日：2014-05-15
申请号：PCT/US2013/069285
申请日：2013-11-08
Applicant: KLA-TENCOR CORPORATION
Inventor： PLIHAL, Martin , ANANATHA, Vidyasagar , PARAMASIVAM, Saravanan , LEE, Christopher W.
CPC classification number: G06T7/0008 , F04C2270/0421 , G06T5/50 , G06T7/0004 , G06T2207/30148
Abstract: Methods and systems for generating unbiased wafer defect samples are provided. One method includes selecting the defects detected by each of multiple scans performed on a wafer that have the most diversity in one or more defect attributes such that a diverse set of defects are selected across each scan. In addition, the method may include selecting the defects such that any defect that is selected and is common to two or more of the scans is not selected twice and any defects that are selected are diverse with respect to the common, selected defect. Furthermore, no sampling, binning, or classifying of the defects may be performed prior to selection of the defects such that the sampled defects are unbiased by any sampling, binning, or classifying method.
Abstract translation: 提供了用于产生无偏置晶片缺陷样品的方法和系统。 一种方法包括选择通过在一个或多个缺陷属性中具有最多分集的晶片上执行的多次扫描中检测到的缺陷，以便跨越每个扫描来选择不同的缺陷组。 此外，该方法可以包括选择缺陷，使得两个或更多个扫描选择并且是共同的任何缺陷不被选择两次，并且所选择的任何缺陷相对于共同的所选缺陷是多种多样的。 此外，在选择缺陷之前，可以不进行采样，分类或缺陷分类，以便通过任何采样，合并或分类方法对采样缺陷进行不偏见。
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公开(公告)号：EP2917861A1
公开(公告)日：2015-09-16
申请号：EP13854032.3
申请日：2013-11-08
Applicant: Kla-Tencor Corporation
Inventor： PLIHAL, Martin , ANANATHA, Vidyasagar , PARAMASIVAM, Saravanan , LEE, Christopher W.
CPC classification number: G06T7/0008 , F04C2270/0421 , G06T5/50 , G06T7/0004 , G06T2207/30148
Abstract: Methods and systems for generating unbiased wafer defect samples are provided. One method includes selecting the defects detected by each of multiple scans performed on a wafer that have the most diversity in one or more defect attributes such that a diverse set of defects are selected across each scan. In addition, the method may include selecting the defects such that any defect that is selected and is common to two or more of the scans is not selected twice and any defects that are selected are diverse with respect to the common, selected defect. Furthermore, no sampling, binning, or classifying of the defects may be performed prior to selection of the defects such that the sampled defects are unbiased by any sampling, binning, or classifying method.
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