公开(公告)号：US06932679B2

公开(公告)日：2005-08-23

申请号：US10295197

申请日：2002-11-15

Applicant: Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

Inventor： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

IPC: B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/04 ,  B24B47/04 ,  B24B49/16 ,  B24B1/00

CPC classification number: B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/013 ,  B24B37/04 ,  B24B37/205 ,  B24B47/04 ,  B24B49/16

Abstract: The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

Abstract translation: 本发明包括固定到机构的抛光垫或皮带，该机构允许垫或带以往往的方式即即向前和向后两个方向高速移动。 抛光垫或带在其抛光晶片时恒定的双向运动在晶片表面上提供了优异的平面性和均匀性。 当需要衬垫的新鲜部分时，衬垫移动通过包含辊的驱动系统，使得辊仅接触衬垫的背面，从而最小化除了从抛光抛光的晶片之外的摩擦源 并且使抛光垫的寿命最大化。

公开(公告)号：US06716084B2

公开(公告)日：2004-04-06

申请号：US10043656

申请日：2002-01-08

Applicant: Bulent M. Basol ,  Cyprian E. Uzoh ,  Konstantin Volodarsky

Inventor： Bulent M. Basol ,  Cyprian E. Uzoh ,  Konstantin Volodarsky

IPC: B24B100

CPC classification number: B24B37/30 ,  H01L21/6838

Abstract: The present invention uses some type of inflatable membrane during processing to establish a vacuum and/or provide a resilient cushion on which the backside of the wafer can rest. In one aspect, the present invention provides an outer vacuum that allow for attachment of the wafer to the carrier head during processing, and also provides an inner inflatable membrane that provides a resilient cushion on which the backside of the wafer can rest during processing. In other aspects, the present invention provides a membrane that is displaceable with a vacuum within certain cavity regions to provide for attachment of the wafer to the wafer carrier.

Abstract translation: 本发明在处理过程中使用某种类型的可膨胀膜来建立真空和/或提供弹性垫，其中晶片的背面可以在其上放置。 在一个方面，本发明提供一种外部真空，其允许在处理期间将晶片附着到承载头，并且还提供内部可充气的膜，其提供弹性垫，在加工过程中，晶片的背面可以在其上保持。 在其他方面，本发明提供了一种膜，其可以在某些腔区域内以真空位移，以提供晶片与晶片载体的连接。

公开(公告)号：US06478936B1

公开(公告)日：2002-11-12

申请号：US09568584

申请日：2000-05-11

Applicant: Rimma Volodarsky ,  Konstantin Volodarsky ,  Cyprian Uzoh ,  Homayoun Talieh ,  Douglas W. Young

Inventor： Rimma Volodarsky ,  Konstantin Volodarsky ,  Cyprian Uzoh ,  Homayoun Talieh ,  Douglas W. Young

IPC: C25B1103

CPC classification number: C25D17/14 ,  C25F7/00

Abstract: A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.

Abstract translation: 可以使用特定的阳极组件来提供用于在半导体晶片上进行的电镀操作，平面化操作和电镀和平面化操作中的任何一种的解决方案。 阳极组件包括设置在其中执行操作的室内的可旋转轴，连接到轴的阳极壳体和附接到阳极壳体的多孔垫支撑板。 支撑板具有适于支撑面向晶片的焊盘的顶表面，并且与阳极壳体一起限定阳极腔。 可以在阳极腔中设置消耗性阳极以向溶液提供电镀材料。 还提供了可以将溶液输送到所述阳极腔的溶液输送结构。 溶液输送结构可以包含在进行操作的室内。 护罩还可以安装在轴和相关主轴之间，以防止溶液从腔室泄漏。

公开(公告)号：US06454332B1

公开(公告)日：2002-09-24

申请号：US09206087

申请日：1998-12-04

Applicant: Boris Govzman ,  Konstantin Volodarsky ,  Leon Volfovski

Inventor： Boris Govzman ,  Konstantin Volodarsky ,  Leon Volfovski

IPC: B25J1506

CPC classification number: H01L21/681 ,  Y10S294/907 ,  Y10S414/141

Abstract: Substrate handling apparatus and methods are described. In one aspect, the substrate handling apparatus includes a clamping member having an extended condition wherein substrate movement relative to the transfer arm is substantially restricted and a retracted condition wherein substrate movement relative to the transfer arm is substantially free. The substrate handling apparatus further includes a sense mechanism (e.g., a vacuum sensor) constructed to determine whether a substrate is properly positioned on the support arm and to trigger the mode of operation of the clamping member between extended and retracted conditions. The sense mechanism also provides information relating to the operating condition of the clamping member.

Abstract translation: 基板处理装置和方法进行说明。 在一个方面，基板处理装置包括具有延伸状态的夹紧构件，其中相对于传送臂的基板移动被基本上限制，并且其中相对于传送臂的基板移动基本上是空闲的缩回状态。 衬底处理装置还包括感测机构（例如，真空传感器），其被构造成确定衬底是否被适当地定位在支撑臂上并且在延伸和缩回状态之间触发夹紧构件的操作模式。 感测机构还提供与夹紧构件的操作状态有关的信息。

公开(公告)号：US5857899A

公开(公告)日：1999-01-12

申请号：US826552

申请日：1997-04-04

Applicant: Konstantin Volodarsky ,  Rahul Jairath

Inventor： Konstantin Volodarsky ,  Rahul Jairath

IPC: B24B37/04 ,  B24B41/047 ,  B24B53/007 ,  B24B21/18

CPC classification number: B24B37/30 ,  B24B37/04 ,  B24B41/047 ,  B24B53/017

Abstract: A polishing head for polishing a semiconductor wafer includes a housing, a wafer carrier movably mounted to the housing, and a pad dressing element movably mounted to the housing. The wafer carrier forms a wafer-supporting surface, and the dressing element surrounds the wafer-supporting surface. A first fluid actuator is coupled to the dressing element to bias the pad dressing element with respect to the housing, and a second fluid actuator is coupled to the wafer carrier to bias the wafer carrier with respect to the housing. First and second fluid conduits are coupled to the first and second actuators, respectively, such that fluid pressures in the first and second actuators are separately and independently adjustable with respect to one another. Biasing forces on the dressing element can thereby be dynamically adjusted with respect to biasing forces on the carrier during a polishing operation.

Abstract translation: 一种用于抛光半导体晶片的抛光头包括壳体，可移动地安装到壳体的晶片载体，以及可移动地安装到壳体上的衬垫修整元件。 晶片载体形成晶片支撑表面，并且修整元件围绕晶片支撑表面。 第一流体致动器联接到修整元件以相对于壳体偏置衬垫修整元件，并且第二流体致动器联接到晶片载体以相对于壳体偏置晶片载体。 第一和第二流体管道分别联接到第一和第二致动器，使得第一和第二致动器中的流体压力彼此独立且可独立地调节。 因此，可以在抛光操作期间相对于载体上的偏压力动态地调整修整元件上的偏压力。