23.
    发明专利
    未知

    公开(公告)号:DE602004019908D1

    公开(公告)日:2009-04-23

    申请号:DE602004019908

    申请日:2004-05-12

    Applicant: MEDTRONIC INC

    Abstract: The invention is directed to a recharging system and associated techniques to recharge an implantable medical device (IMD). In particular, a recharging system according to the invention comprises a headset having an energy delivery module that delivers energy to a power source of an IMD implanted on or within the cranium of a patient. The energy delivery module may comprise a coil for inductive transfer of energy to the power source. The headset may be configured for placement over the head of the patient, and may further only partially cover the top of the head. The energy delivery module may be adjustably coupled to the headset. In some embodiments, the position of the energy delivery module may be adjusted along three or four axes, including a rotational axis, allowing the coil to be placed over an IMD located at any of a variety of locations on or within the cranium.

    MODULAR IMPLANTABLE MEDICAL DEVICE
    24.
    发明专利

    公开(公告)号:AU2003294595A1

    公开(公告)日:2004-06-30

    申请号:AU2003294595

    申请日:2003-12-09

    Applicant: MEDTRONIC INC

    Abstract: In an implantable medical device having individual modules, a coupling module couples the modules to one another. The coupling module supports electrical and/or mechanical coupling of the modules. The coupling module may assume a variety of shapes or configurations. The various embodiments of the coupling module may offer the modules varying degrees of freedom of movement relative to one another.

    LEAD CONNECTION MODULE OF A MODULAR IMPLANTABLE MEDICAL DEVICE
    25.
    发明申请
    LEAD CONNECTION MODULE OF A MODULAR IMPLANTABLE MEDICAL DEVICE 审中-公开
    一种模块化植入式医疗设备的引线连接模块

    公开(公告)号:WO2004052457B1

    公开(公告)日:2004-08-26

    申请号:PCT/US0338940

    申请日:2003-12-09

    Applicant: MEDTRONIC INC

    CPC classification number: A61N1/375 A61N1/3605 A61N1/3754 A61N1/3758

    Abstract: A modular implantable medical device (101, 201, 301, 401, 501, 601, 701, 801) includes two or more interconnected modules (103-105, 210-212, 410-412, 510-512, 610, 710-712, 810, 910) and an overmold (106, 214, 302, 413, 522, 622, 722, 822) that at least partially encapsulates each of the housings of the modules. The overmold also includes a lead connection module (213A-B, 303A-B, 415A-B, 613, 813) for accepting an external lead. The lead connection module electrically and mechanically couples the lead to the components of the implantable medical device.

    Abstract translation: 模块化植入式医疗设备(101,201,301,401,501,601,701,801)包括两个或更多个互连模块(103-105,210-212,410-412,510-512,610,710-712 ,810,910)以及至少部分地封装模块的每个壳体的包覆模制件(106,214,302,413,522,622,722,822)。 包胶模还包括用于接受外部引线的引线连接模块(213A-B,303A-B,415A-B,613,813)。 引线连接模块将引线与植入式医疗装置的部件电和机械连接。

    MODULAR IMPLANTABLE MEDICAL DEVICE
    28.
    发明申请
    MODULAR IMPLANTABLE MEDICAL DEVICE 审中-公开
    模块化可植入医疗器械

    公开(公告)号:WO2004052458B1

    公开(公告)日:2004-09-10

    申请号:PCT/US0338981

    申请日:2003-12-09

    Applicant: MEDTRONIC INC

    CPC classification number: A61N1/375 A61N1/3605 A61N1/3754 A61N1/3758

    Abstract: An implantable medical device (198, 199, 209, 219, 229, 239) for implantation in the head of a patient. The implantable medical device has a plurality of interconnected modules (200, 202, 206, 212, 214, 216, 222, 224, 226, 232, 234, 236, 242, 244, 246) one or more of which are covered by an overmold (204, 210, 220, 230, 240) and one or more of which are partially covered by the overmold. The module(s) covered by the overmold may be implanted between the cranium and scalp, while the module(s) partially covered by the overmold may be placed at least partially into a recess in the cranium.

    Abstract translation: 一种用于植入患者头部的可植入医疗装置(198,199,209,219,229,239)。 可植入医疗装置具有多个相互连接的模块(200,202,206,212,214,216,222,224,226,232,234,236,226,244,246,226,224,226,244,246,246,226,224,244,246),其中一个或多个被一个 包覆模制(204,210,220,230,240),并且其中一个或多个部分被包覆成型体覆盖。 包覆成型模具覆盖的模块可以植入颅骨和头皮之间,而部分被覆模制部分覆盖的模块可以至少部分地放置在颅骨中的凹部中。

    IMPLANTABLE BURR HOLE CAP WITH LEAD MANAGEMENT STRUCTURE
    30.
    发明申请
    IMPLANTABLE BURR HOLE CAP WITH LEAD MANAGEMENT STRUCTURE 审中-公开
    具有领导管理结构的可伸缩的横向孔

    公开(公告)号:WO2004103462B1

    公开(公告)日:2005-02-17

    申请号:PCT/US2004014862

    申请日:2004-05-12

    Applicant: MEDTRONIC INC

    CPC classification number: A61N1/375

    Abstract: In general, the invention is directed to apparatus and techniques that aid in the removal or explantation of an implantable medical device (IMD) under the scalp of a patient. The various embodiments of the invention address risks associated with the explantation, such as the risk of damage to leads, the risk of damage to the IMD, the risk that the incision may hinder the explantation, and the risk that the IMD may be difficult to remove. In some embodiments, the invention is directed to apparatus that help the surgeon identify the location of the implanted elements, and that protect the implanted elements from inadvertent damage. In other embodiments, the invention is directed to techniques that facilitate the removal of the IMD.

    Abstract translation: 通常,本发明涉及有助于在患者头皮下移除或移植可植入医疗装置(IMD)的装置和技术。 本发明的各种实施例解决与外植相关的风险,例如导线损害的风险,IMD损伤的风险,切口可能阻碍移植的风险,以及IMD可能难以 去掉。 在一些实施例中,本发明涉及帮助外科医生识别植入元件的位置并且保护植入元件免于无意的损伤的装置。 在其它实施例中,本发明涉及便于移除IMD的技术。

Patent Agency Ranking