公开(公告)号：JP2005302943A

公开(公告)日：2005-10-27

申请号：JP2004115497

申请日：2004-04-09

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： ITO TATSUYA

IPC: H05K3/46 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board that has no core substrate and can be reduced in warping. SOLUTION: The wiring board 1, which connects semiconductor chips to each other, has a laminate BU formed by alternatively laminating two or more dielectric layers and two or more conductor layers upon another so that the first and second main surfaces MP1 and MP2 of the laminate BU may be formed of dielectric layers, a plurality of metallic terminal pads PD1 and PD2 formed on the first and second main surfaces MP1 and MP2, and a reinforcing frame ST which secures flatness by reinforcing the laminate BU. The semiconductor chips and reinforcing frame ST are arranged on the first main surface and at least part of the metallic terminal pads PD1 and PD2 are electrically connected to internal conductor layers positioned in the laminate BU through via holes. At the same time, the metallic terminal pads PD1 and PD2 and semiconductor chips are flip-chip connected to each other through soldered connections and the Young's modulus of the dielectric layers is adjusted to 0.01GPa-0.3 GPa. Since the Young's modulus of the dielectric layers is low, the thermal stress caused by the difference between the coefficients of thermal expansion of the dielectric layers and conductor layers can be absorbed. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种不具有芯基板并且可以减少翘曲的布线板。 解决方案：将半导体芯片彼此连接的布线板1具有通过交替层叠两个或更多个电介质层和另外两个或更多个导体层而形成的层叠体BU，使得第一和第二主表面MP1和MP2 可以由电介质层，形成在第一和第二主表面MP1和MP2上的多个金属端子焊盘PD1和PD2以及通过加强层叠体BU来确保平坦度的加强框架ST形成。 半导体芯片和加强框架ST布置在第一主表面上，并且金属端子焊盘PD1和PD2的至少一部分通过通孔电连接到位于层叠体BU中的内部导体层。 同时，通过焊接连接将金属端子焊盘PD1和PD2以及半导体芯片倒装连接，将电介质层的杨氏模量调节至0.01GPa-0.3GPa。 由于介电层的杨氏模量低，所以可以吸收由介电层和导体层的热膨胀系数之差引起的热应力。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005302922A

公开(公告)日：2005-10-27

申请号：JP2004115133

申请日：2004-04-09

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： ITO TATSUYA

IPC: H05K1/02 ,  H01L23/12 ,  H05K1/14 ,  H05K3/36 ,  H05K3/46

CPC classification number: H01L2224/16225

Abstract: PROBLEM TO BE SOLVED: To provide a structure where curvature is difficult to occur in a wiring board using a coreless multilayer substrate, and to provide a manufacturing method of the board. SOLUTION: A stiffener 130 is bonded to the coreless multilayer substrate 120. A ceramic substrate 150 where a capacitor is formed inside is fitted to the rear face of the coreless multilayer substrate 120. Coefficients of thermal expansion of the stiffener 130 and the ceramic substrate 150 are comparatively nearer values and they are lower than the coefficient of thermal expansion of the coreless multilayer substrate 120. Even if a thermal load is added in a manufacture process, the coreless multilayer substrate 120 is sandwiched and fixed with the ceramic substrate 150 and the stiffener 130, and the occurrence of curvature can be suppressed. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种在使用无芯多层基板的布线板中难以发生曲率的结构，并提供板的制造方法。 解决方案：加强件130结合到无芯多层基板120上。其中在内部形成电容器的陶瓷基板150安装在无芯多层基板120的后表面上。加强件130的热膨胀系数和 陶瓷基板150是比较接近的值，并且它们低于无芯多层基板120的热膨胀系数。即使在制造过程中添加热负荷，也将无芯多层基板120与陶瓷基板150夹持固定 和加强件130，并且可以抑制弯曲的发生。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005244124A

公开(公告)日：2005-09-08

申请号：JP2004055323

申请日：2004-02-27

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： ITO TATSUYA

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method for easily obtaining a wiring board, in which a dielectric layer made of a polymer material and a conductive layer are alternately laminated, without having a core substrate, and to provide the reliable wiring board obtained by the manufacturing method. SOLUTION: A metal foil contact body 5, in which two separable metal foils 5a,5b adhere, is formed on the main surface of a foundation dielectric sheet 21 formed on a support substrate 20 for reinforcement in manufacture so that the metal foil contact body 5 is included on the main surface. A dielectric sheet 11F, having a protective metal, is formed so that the metal foil contact body 5 is sealed, while it adheres to the foundation dielectric sheet 21 at the peripheral region of the metal foil contact body 5. A laminated sheet body, including the metal foil contact body 5 and the dielectric sheet 11F having the protective metal foil, is formed on the dielectric sheet 11F having the protective metal by laminating the dielectric sheet via a conductive layer. The peripheral section of a wiring lamination section is removed, and the wiring lamination section is separated at the interface of two metal foils in the metal foil contact body 5 from the support substrate 20 while one metal foil adheres. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种容易获得其中由聚合物材料和导电层形成的电介质层交替层叠而不具有芯基板的布线板的制造方法，并且提供可靠的布线 通过制造方法获得的板。 解决方案：制造两个可分离金属箔5a，5b的金属箔接触体5形成在形成在用于加强的支撑基板20上的基底电介质片21的主表面上，使得金属箔 接触体5包括在主表面上。 形成具有保护金属的电介质片11F，使得金属箔接触体5在金属箔接触体5的周边区域附着于基底电介质片21的同时被密封。层压片体包括 金属箔接触体5和具有保护金属箔的电介质片11F通过经由导电层层叠电介质片而形成在具有保护金属的电介质片11F上。 除去布线层叠部的周边部，并且在金属箔接触体5中的两个金属箔与支撑基板20的界面处分离布线层叠部，同时附着一个金属箔。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005243990A

公开(公告)日：2005-09-08

申请号：JP2004052870

申请日：2004-02-27

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： ITO TATSUYA

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method for easily obtaining a wiring board, in which a dielectric layer made of a polymer material and a conductive layer are alternately laminated, without a core substrate.
SOLUTION: A metal pad arrangement process is performed; and also a first dielectric sheet formation process; a first conductor formation process for penetrating and forming a first via conductor connected to the metal pad on the first dielectric sheet, and forming the first conductive layer connected to the first via conductor onto the first dielectric sheet; and a remaining layer lamination process for laminating a remaining dielectric sheet that should serve as the laminated body sheet, the via conductor, and the conductive layer on the first dielectric sheet are performed, in this order. Then, a peripheral region removal process, a wiring laminated section releasing process, and a metal foil removal process for exposing the metal pad are performed, in this order.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 解决的问题：提供一种容易获得由聚合物材料制成的电介质层和导电层交替层叠的布线基板的制造方法，而没有芯基板。 解决方案：执行金属垫布置过程; 以及第一电介质片形成工艺; 第一导体形成工艺，用于穿透和形成连接到第一电介质片上的金属焊盘的第一通孔导体，以及将连接到第一通孔导体的第一导电层形成在第一电介质片上; 并且依次执行用于层叠作为层压体片，通孔导体和第一电介质片上的导电层的剩余电介质片的剩余层叠层工艺。 然后，依次进行周边区域去除处理，布线层叠部剥离处理和金属箔剥离处理。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005243986A

公开(公告)日：2005-09-08

申请号：JP2004052799

申请日：2004-02-27

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： ITO TATSUYA

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method for easily obtaining a wiring board, in which a dielectric layer made of a polymer material and a conductive layer are alternately laminated, without having a core substrate.
SOLUTION: A laminated sheet body 10 has a metal foil adhesive body 5, a first dielectric sheet 11, a first conductive layer 31, and a first via conductor 41. A region on metal foil 5b is set as a wiring laminate 100 that should serve as a wiring board in the laminated sheet body 10. The periphery is removed, an end face 103 of the wiring laminate 100 is exposed, the wiring laminate 100 is released from the interface between metal foil 5b and a foundation 5a in the metal foil adhesive body 5, while the metal foil 5b adheres from the support substrate 20, and then the metal foil 5b adhering to the wiring laminate 100 is removed by etching.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种容易获得由聚合物材料和导电层形成的电介质层交替层叠而不具有芯基板的布线板的制造方法。 解决方案：层压片体10具有金属箔粘合体5，第一电介质片11，第一导电层31和第一通孔导体41.金属箔5b上的区域被设置为布线层压体100 作为层压片体10的配线基板，除去周边部，使布线层叠体100的端面103露出，将布线层叠体100从金属箔5b与基体5a的界面剥离 金属箔粘合体5，同时金属箔5b从支撑基板20粘附，然后通过蚀刻去除附着在布线层压板100上的金属箔5b。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2002324967A

公开(公告)日：2002-11-08

申请号：JP2001126265

申请日：2001-04-24

Applicant: NGK SPARK PLUG CO

Inventor： ITO TATSUYA

IPC: C23F1/00 ,  C23F1/34 ,  H05K3/06 ,  H05K3/18

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate capable of forming reliably a conductive layer of a predetermined profile. SOLUTION: A method for manufacturing a substrate 1 comprises: a step of forming a plating resist layer 35 on a conductive layer on a resin insulation layer 5; a step of forming an electrolytic Cu plating layer 37; a step of forming a guard metal layer 39; a step of removing the plating resist layer; a step of patterning for removing the unrequired conductive layer by etching; and a step of removing the guard metal layer for removing the guard metal layer 39. An etching agent for use in the patterning step is one which dissolves the conductive layer and does not dissolve the guard metal layer 39, and an etching rate is about 1 to 5 μm/min.

公开(公告)号：JP2000174421A

公开(公告)日：2000-06-23

申请号：JP34465798

申请日：1998-12-03

Applicant: NGK SPARK PLUG CO

Inventor： ITO TATSUYA

IPC: H05K3/18

Abstract: PROBLEM TO BE SOLVED: To simplify a process by simultaneously conduting a surface roughing process of an interconnection layer and a soft-etching process of removing excessive electroless plated layer. SOLUTION: Epoxy resin is applied onto the surface of a BT substrate 3 and is heated to be cured to form a base layer 5. Next, the epoxy resin base layer is etched with an aqueous solution of potassium permanganate to conduct a surface roughing process to increase the adhesion with a copper interconnection layer 7 to be formed. Thus, a substrate S consisting of the BT substrate 3 and the base layer 5 is prepared. Then, a part of the substrate S attached with Pd nuclei is electroless-plated to form an electroless copper plated layer 9. On the electroless copper plated layer 9, a photosensitive epoxy resin layer 13 is formed. Thereafter, an electrolytic copper plated layer 11 is formed on the electroless copper plated layer 9. Using an etchant, the electroless copper plated layer 9 in a part where a plated resist layer 15 is removed is removed.

公开(公告)号：JP2014192177A

公开(公告)日：2014-10-06

申请号：JP2013063370

申请日：2013-03-26

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： NAGAI MAKOTO ,  ITO TATSUYA ,  WADA HIDETOSHI ,  MORI SEIJI

IPC: H05K3/34 ,  H01L21/60 ,  H01L23/12

CPC classification number: H01L2224/13017 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board capable of improving reliability by constructing the board to be suitable for connection with components.SOLUTION: This wiring board 10 comprises a pad 61 and a solder resist 81 having formed therein an opening 82 for causing the pad 61 to be exposed. A protruding conductor 71 is secured to part of a surface 62 of the pad 61. The protruding conductor 71 is connected to the surface 62 of the pad 61, and provided with a shank 72 whose outside diameter A3 is set to smaller than an outside diameter A1 of the pad 61 and a head 73 connected to the shank 72 and whose outside diameter A6 is set to larger than the outside diameter A3 of the shank 72. The head 73 is disposed in a state apart from a surface 83 of the solder resist 81.

Abstract translation: 要解决的问题：提供一种能够通过构造适于与部件连接的板来提高可靠性的布线板。解决方案：该布线板10包括焊盘61和阻焊剂81，其中形成有开口82，用于使 垫61暴露。 突出导体71固定在垫61的表面62的一部分上。突出导体71连接到垫61的表面62，并且设置有外径A3设定为小于外径 A1和连接到柄72的头73，其外径A6被设定为大于柄72的外径A3。头73设置在与阻焊层的表面83分开的状态 81。

公开(公告)号：JP2008244491A

公开(公告)日：2008-10-09

申请号：JP2008125999

申请日：2008-05-13

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： ITO TATSUYA

IPC: H05K3/46 ,  H01L23/12

CPC classification number: H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To provide a method by which a wiring board that has no core substrate and is formed by alternately laminating dielectric layers composed of a polymer material and conductor layers upon another can be manufactured easily, and to provide a wiring board obtained by the same.
SOLUTION: The method of manufacturing the wiring board includes: forming a laminated sheet body 10 on a main surface of a base dielectric layer 21 formed on a supporting substrate 20 for reinforcement at the time of manufacture; removing the peripheral section out of the laminated sheet body 10 while considering a region on the metal foil body 5 as a wiring laminating section 100 that must become a wiring board; and peeling the laminated sheet body 10 on the interface between the metal foil 5a and 5b with the other metal foil 5b adhered to the laminated sheet body 10, wherein the laminated sheet body 10 includes: a closely-adhered metal foil body 5 configured by closely adhering two pieces of metal foil 5a and 5b; a first dielectric sheet 11 sealing the metal foil body 5 while closely adhering to the base dielectric layer 21 in a circumferential region 21c of the metal leaf sticking body 5; a first conductor layer 31; and via conductors 41 formed by penetrating through the first dielectric sheet 11.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种方法，通过该方法可以容易地制造不具有芯基板并且通过交替层叠由高分子材料和导体层组成的电介质层而形成的布线基板的方法，并且提供布线 由同一板获得的板。 解决方案：制造布线板的方法包括：在制造时形成在用于加强的支撑基板20上的基底电介质层21的主表面上形成层压片体10; 同时考虑金属箔体5上的区域作为必须成为布线板的布线层叠部100，将周边部分从层压片体10中取出; 并且将层压片体10剥离在金属箔5a和5b之间的界面上，与附着在层叠片体10上的另一金属箔5b剥离，其中层压片体10包括：紧密配合的金属箔体5， 粘附两片金属箔5a和5b; 密封金属箔本体5的第一电介质片11，同时在金属片贴合体5的周向区域21c中紧密粘附到基底电介质层21; 第一导体层31; 以及通过穿过第一电介质片11形成的通孔导体41.版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2005302968A

公开(公告)日：2005-10-27

申请号：JP2004116077

申请日：2004-04-09

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： ITO TATSUYA

IPC: H05K3/46 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board that has no core substrate and can be reduced in warping. SOLUTION: The wiring board has a laminate BU formed by alternatively laminating two or more dielectric layers and two or more conductor layers upon another so that the first and second main surfaces MP1 and MP2 of the laminate BU may be formed of dielectric layers, a plurality of metallic terminal pads PD1 and PD2 formed on the first and second main surfaces MP1 and MP2, and a reinforcing frame ST which secures flatness by reinforcing the laminate BU. Semiconductor chips and the reinforcing frame ST are arranged on the first main surface MP1 and at least part of the metallic terminal pads PD1 and PD2 are electrically connected to internal conductor layers positioned in the laminate BU through via holes. At the same time, the metallic terminal pads PD1 and PD2 and semiconductor chips are flip-chip connected to each other through soldered connections and the coefficients of thermal expansion of all dielectric layers are adjusted to 15-40 ppm/°C and the coefficient of thermal expansion of the reinforcing frame ST is also adjusted to 15-40 ppm/°C. Since the difference between the coefficients of thermal expansion of the dielectric layers and reinforcing frame ST is small, the warping of the wiring board can be reduced. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种不具有芯基板并且可以减少翘曲的布线板。 解决方案：布线板具有通过交替地层叠两个或更多个电介质层和两个或更多个导体层而形成的层叠体BU，以使层叠体BU的第一和第二主表面MP1和MP2可以由电介质层形成 ，形成在第一和第二主表面MP1和MP2上的多个金属端子焊盘PD1和PD2，以及通过加强层叠体BU来确保平坦度的加强框架ST。 半导体芯片和加强框架ST布置在第一主表面MP1上，并且金属端子焊盘PD1和PD2的至少一部分通过通孔电连接到位于层叠体BU中的内部导体层。 同时，金属端子焊盘PD1和PD2和半导体芯片通过焊接连接倒装芯片连接，并且所有电介质层的热膨胀系数被调整为15-40ppm /℃，系数 加强框架ST的热膨胀也被调整到15-40ppm /℃。 由于电介质层和加强框架ST的热膨胀系数之差小，所以能够降低布线基板的翘曲。 版权所有（C）2006，JPO＆NCIPI