公开(公告)号：US11201275B1

公开(公告)日：2021-12-14

申请号：US16897667

申请日：2020-06-10

Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

Inventor： Christopher L. Chua ,  Eugene M. Chow

IPC: H01L39/08 ,  H01R13/24 ,  H01R13/03 ,  H01L39/24

Abstract: A structure has a substrate, and a spring structure disposed on the substrate, the spring structure having an anchor portion disposed on the substrate, an elastic material having an intrinsic stress profile that biases a region of the elastic material to curl away from the substrate, and a superconductor film in electrical contact with a portion of the elastic material. A method of manufacturing superconductor structures includes depositing a release film on a substrate, forming a stack of films comprising an elastic material and a superconductor film, releasing a portion of the elastic material by selective removal of the release film so that portion lifts out of the substrate plane to form elastic springs. A method of manufacturing superconductor structures includes depositing a release film on a substrate, forming a stack of films comprising at least an elastic material, releasing a portion of the elastic material so that portion lifts out of a plane of the substrate to form elastic springs, and coating the elastic springs with a superconductor film.

公开(公告)号：US10921202B2

公开(公告)日：2021-02-16

申请号：US16205042

申请日：2018-11-29

Applicant: Palo Alto Research Center Incorporated

Inventor： Warren B. Jackson ,  Eugene M. Chow

IPC: G01R31/68 ,  H05K1/02 ,  G01L5/167 ,  G01B5/30 ,  G01B7/16 ,  G01B11/16 ,  G01R31/50

Abstract: A tamper detection system includes a detector that measures a value of a parameter for each connection of multiple breakable remakeable connections between first and second components. The system includes an analyzer that compares the measured parameter value for each connection or a representative value derived from measured parameter values of the connections to an expected value. Based on the comparisons, the analyzer determines whether the multiple breakable remakeable connections between the first and second components have been broken and remade.

公开(公告)号：US20200207617A1

公开(公告)日：2020-07-02

申请号：US16237419

申请日：2018-12-31

Applicant: Palo Alto Research Center Incorporated

Inventor： Anne Plochowietz ,  Bradley Rupp ,  Jengping Lu ,  Julie A. Bert ,  Lara S. Crawford ,  Sourobh Raychaudhuri ,  Eugene M. Chow ,  Matthew Shreve ,  Sergey Butylkov

IPC: B81C99/00 ,  H01L21/67 ,  H01L23/00

Abstract: Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.

公开(公告)号：US10558204B2

公开(公告)日：2020-02-11

申请号：US15469433

申请日：2017-03-24

Applicant: Palo Alto Research Center Incorporated

Inventor： Ion Matei ,  Jeng Ping Lu ,  Saigopal Nelaturi ,  Julie A. Bert ,  Lara S. Crawford ,  Armin R. Volkel ,  Eugene M. Chow

IPC: G05D3/14 ,  G05B19/418 ,  G05B17/02 ,  G06T7/194 ,  G06T7/73 ,  G06T7/155 ,  H04N7/18

Abstract: The system and method described below allow for real-time control over positioning of a micro-object. A movement of at least one micro-object suspended in a medium can be induced by a generation of one or more forces by electrodes proximate to the micro-object. Prior to inducing the movement, a simulation is used to develop a model describing a parameter of an interaction between each of the electrodes and the micro-object. A function describing the forces generated by an electrode and an extent of the movement induced due to the forces is generated using the model. The function is used to design closed loop policy control scheme for moving the micro-object towards a desired position. The position of the micro-object is tracked and taken into account when generating control signals in the scheme.

公开(公告)号：US20180327905A1

公开(公告)日：2018-11-15

申请号：US15591959

申请日：2017-05-10

Applicant: Xerox Corporation ,  Palo Alto Research Center Incorporated

Inventor： Yunda Wang ,  Sourobh Raychaudhuri ,  JengPing Lu ,  Eugene M. Chow ,  Julie A. Bert ,  David Biegelsen ,  George A. Gibson ,  Jamie Kalb

IPC: C23C16/50

CPC classification number: H01L21/67271 ,  H01L21/67282 ,  H01L21/67294 ,  H01L24/75 ,  H01L24/81 ,  H01L24/95

Abstract: Disclosed herein are implementations of a particles-transferring system, particle transferring unit, and method of transferring particles in a pattern. In one implementation, a particles-transferring system includes a first substrate including a first surface to support particles in a pattern, particle transferring unit including an outer surface to be offset from the first surface by a first gap, and second substrate including a second surface to be offset from the outer surface by a second gap. The particle transferring unit removes the particles from the first surface in response to the particles being within the first gap, secures the particles in the pattern to the outer surface, and transports the particles in the pattern. The second substrate removes the particles in the pattern from the particle transferring unit in response to the particles being within the second gap. The particles are to be secured in the pattern to the second surface.

公开(公告)号：US20180282150A1

公开(公告)日：2018-10-04

申请号：US15476830

申请日：2017-03-31

Applicant: Palo Alto Research Center Incorporated

Inventor： Jeng Ping Lu ,  Eugene M. Chow ,  David K. Biegelsen ,  Sourobh Raychaudhuri

IPC: B81C1/00 ,  B82Y30/00 ,  B82Y40/00 ,  H01L21/027 ,  H01L21/06 ,  H01L29/06 ,  H01L31/0236 ,  H01L31/0352

CPC classification number: H01L29/0665 ,  B01J2219/00648 ,  B01J2219/00653 ,  B01J2219/00659 ,  B81B2203/04 ,  B81B2207/056 ,  B81C3/005 ,  B81C2201/0149 ,  B82Y30/00 ,  B82Y40/00 ,  H01L21/06 ,  H01L24/06 ,  H01L31/0352 ,  Y02E10/50

Abstract: An electrode array including a substrate. The electrode array includes a first plurality of electrodes disposed above a first zone of the substrate, wherein the first plurality of electrodes has a first range of spacing. The electrode array further includes a second plurality of electrodes disposed above a second zone of the substrate, wherein the second plurality of electrodes has a second range of spacing that is less than the first range of spacing.

公开(公告)号：US09967982B2

公开(公告)日：2018-05-08

申请号：US13866835

申请日：2013-04-19

Applicant: Palo Alto Research Center Incorporated

Inventor： Eugene M. Chow

IPC: H05K3/32 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L23/00 ,  G01R1/067

CPC classification number: H05K3/32 ,  G01R1/06727 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/3157 ,  H01L23/48 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L24/73 ,  H01L2221/68331 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/1161 ,  H01L2224/1182 ,  H01L2224/1191 ,  H01L2224/13008 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2224/1355 ,  H01L2224/13564 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/819 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01093 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/281 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49147 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13099

Abstract: An interposer including stress-engineered nonplanar microsprings may provide interconnection of bonding pads of electronic structures disposed above and below the interposer. The lateral offset between an anchor portion of a microspring disposed for contact at a bottom surface of the interposer and the tip of the microspring located in a free portion of the microspring for contact and deflection over a top surface of the interposer permits the interconnection of devices having different bonding pad pitches. Microspring contacts at the free portion permit temporary interconnection of devices, while solder applied over the free portion permit permanent connection of devices to the interposer.

公开(公告)号：US20180081347A1

公开(公告)日：2018-03-22

申请号：US15469433

申请日：2017-03-24

Applicant: Palo Alto Research Center Incorporated

Inventor： Ion Matei ,  Jeng Ping Lu ,  Saigopal Nelaturi ,  Julie A. Bert ,  Lara S. Crawford ,  Armin R. Volkel ,  Eugene M. Chow

IPC: G05B19/418 ,  G06T7/73 ,  G06T7/194 ,  G06T7/155 ,  H04N7/18

CPC classification number: G05B19/41885 ,  G05B17/02 ,  G05B2219/32359 ,  G06T7/155 ,  G06T7/194 ,  G06T7/74 ,  G06T2207/20021 ,  G06T2207/30164 ,  H04N7/183

Abstract: The system and method described below allow for real-time control over positioning of a micro-object. A movement of at least one micro-object suspended in a medium can be induced by a generation of one or more forces by electrodes proximate to the micro-object. Prior to inducing the movement, a simulation is used to develop a model describing a parameter of an interaction between each of the electrodes and the micro-object. A function describing the forces generated by an electrode and an extent of the movement induced due to the forces is generated using the model. The function is used to design closed loop policy control scheme for moving the micro-object towards a desired position. The position of the micro-object is tracked and taken into account when generating control signals in the scheme.

公开(公告)号：US20170038282A1

公开(公告)日：2017-02-09

申请号：US14816849

申请日：2015-08-03

Applicant: Palo Alto Research Center Incorporated

Inventor： Mandana Veiseh ,  JengPing Lu ,  Eugene M. Chow ,  David K. Biegelsen ,  Ramkumar Abhishek ,  Felicia Linn

IPC: G01N1/10 ,  G01N29/02

CPC classification number: G01N1/10 ,  G01N21/253 ,  G01N29/02

Abstract: An electronic test plate includes a test plate comprising plurality of wells, each well configured to contain a substance to be analyzed. Sensors are arranged to sense characteristics of the substance and to generate sensor signals based on the sensed characteristics over time. The sensors are arranged so that multiple sensors are associated with each well. At least one sensor of the multiple sensors senses a characteristic of the substance that is different from a characteristic sensed by another sensor of the multiple sensors. Sensor select circuitry is arranged on a backplane disposed along the test plate. The sensor select circuitry is coupled to the sensors and enable the sensor signals of selected sensors to be accessed at a data output of the backplane.

Abstract translation: 电子测试板包括包含多个孔的测试板，每个井配置成容纳待分析的物质。 传感器被布置成感测物质的特性并基于随时间感测的特征产生传感器信号。 传感器布置成使得多个传感器与每个孔相关联。 多个传感器的至少一个传感器感测与多个传感器的另一个传感器感测到的特性不同的物质的特性。 传感器选择电路布置在沿着测试板设置的背板上。 传感器选择电路耦合到传感器，并使所选传感器的传感器信号能够在背板的数据输出端被访问。

公开(公告)号：US20160128206A9

公开(公告)日：2016-05-05

申请号：US13866835

申请日：2013-04-19

Applicant: Palo Alto Research Center Incorporated

Inventor： Eugene M. Chow

IPC: H05K3/32

CPC classification number: H05K3/32 ,  G01R1/06727 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/3157 ,  H01L23/48 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L24/73 ,  H01L2221/68331 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/1161 ,  H01L2224/1182 ,  H01L2224/1191 ,  H01L2224/13008 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2224/1355 ,  H01L2224/13564 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/819 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01093 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/281 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49147 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13099

Abstract: An interposer including stress-engineered nonplanar microsprings may provide interconnection of bonding pads of electronic structures disposed above and below the interposer. The lateral offset between an anchor portion of a microspring disposed for contact at a bottom surface of the interposer and the tip of the microspring located in a free portion of the microspring for contact and deflection over a top surface of the interposer permits the interconnection of devices having different bonding pad pitches. Microspring contacts at the free portion permit temporary interconnection of devices, while solder applied over the free portion permit permanent connection of devices to the interposer.