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    Probe head and probe card having same
    21.
    发明授权
    Probe head and probe card having same 有权

    公开(公告)号：US11852656B2

    公开(公告)日：2023-12-26

    申请号：US17214785

    申请日：2021-03-26

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

    IPC: G01R1/073

    CPC classification number: G01R1/07342

    Abstract: Proposed is a probe head having a probe card for performing a circuit inspection of a wafer. More particularly, proposed are a probe head and a probe card having the probe head, the probe head having a guide plate. The guide plate has a guide hole and a shield portion composed of a metal material positioned at the periphery of the guide hole, thereby blocking signal interference that may be occurred between adjacent probes.

    Multilayer ceramic substrate and probe card including same
    22.
    发明授权
    Multilayer ceramic substrate and probe card including same 有权

    公开(公告)号：US11651904B2

    公开(公告)日：2023-05-16

    申请号：US17873020

    申请日：2022-07-25

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: H01G4/40 ,  H01G4/12

    CPC classification number: H01G4/40 ,  H01G4/12

    Abstract: A multilayer structure includes a first insulating layer including a first body of an anodized oxide material, a first via conductor penetrating through the first body, and a first internal wiring layer electrically connected to the first via conductor, a second insulating layer including a second body of the anodized oxide material, a second via conductor penetrating through the second body, and a second connection pad electrically connected to the second via conductor, and a solder hump provided on one of the first internal wiring layer and the second connection pad and between the first insulating layer and the second insulating layer. The first via conductor, the first internal wiring layer, the second connection pad, and the second via conductor are electrically connected to each other through the solder bump.

    Multilayer ceramic substrate and probe card including same
    24.
    发明授权
    Multilayer ceramic substrate and probe card including same 有权

    公开(公告)号：US11437196B2

    公开(公告)日：2022-09-06

    申请号：US16776134

    申请日：2020-01-29

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: H01G4/40 ,  H01G4/12

    Abstract: A multilayer ceramic substrate includes a first insulating portion including a body of a ceramic material, a first via conductor penetrating through the body, and a first internal wiring layer and a first connection pad connected to the first via conductor, and a second insulating portion including a body of an anodized oxide material, a second via conductor penetrating through the body, and a second internal wiring layer and a second connection pad connected to the second via conductor.

    System for transferring micro LED
    25.
    发明授权
    System for transferring micro LED 有权

    公开(公告)号：US11337347B2

    公开(公告)日：2022-05-17

    申请号：US16414521

    申请日：2019-05-16

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: H05K13/04 ,  H01L27/32 ,  H01L33/00 ,  H01L33/08 ,  H01L33/36

    Abstract: A system for transferring a micro LED includes a micro LED dropped into a solution. The system further includes a micro LED grip body immersed in the solution, the micro LED grip body including a porous member having pores, and gripping the micro LED with a grip surface where the pores are provided. An upper surface of the porous member is configured with a seating recess having a guide inclined portion on which the micro LED is mounted and a shielding portion provided around the seating recess.

    Micro sensor package
    27.
    发明授权
    Micro sensor package 有权

    公开(公告)号：US10705064B2

    公开(公告)日：2020-07-07

    申请号：US15702666

    申请日：2017-09-12

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

    IPC: H01G5/012 ,  G01N33/00 ,  G01N27/04

    Abstract: Disclosed is a microsensor package. Particularly, disclosed is a microsensor package configured such that a substrate with a sensor electrode is formed with a plurality of pores penetrating vertically therethrough, the lower surface of the substrate is formed with a bonding portion, and the pores under the sensor electrode pad are provided therein with respective connecting portions electrically connecting the sensor electrode pad and the bonding portion, whereby it is possible to provide a light, slim, and compact microsensor package, and it is possible to mount the microsensor package to a printed circuit board (PCB) without wire bonding.

    Multi-layered aluminum oxide capacitor
    30.
    发明授权
    Multi-layered aluminum oxide capacitor 有权

    公开(公告)号：US10163567B2

    公开(公告)日：2018-12-25

    申请号：US14816182

    申请日：2015-08-03

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park

    IPC: H01G4/008 ,  H01G4/26 ,  H01G4/12 ,  H01G4/30 ,  H01G4/232

    Abstract: The present invention relates to a multi-layered aluminum oxide capacitor comprising an aluminum substrate; a plurality of aluminum oxide layer formed in at least a portion of on both sides or one side of the substrate with respect to the aluminum substrate; and a plurality of electrode layers formed on the aluminum oxide layers. According to the present invention, manufacturing process is more simplified since Al2O3 insulation layer is formed by anodizing the aluminum layer without forming an extra insulation layer after forming the aluminum layer, so that the manufacturing cost can be reduced, and also a multi-layered capacitor having a high capacitance and a high reliability can be provided by stacking capacitors comprising a plurality of aluminum oxide layers using a more simplified process according to the present invention.

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