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公开(公告)号:US20200373042A1
公开(公告)日:2020-11-26
申请号:US16416541
申请日:2019-05-20
Applicant: Rosemount Aerospace Inc.
Inventor: David P. Potasek
IPC: H01C1/16
Abstract: Provided are embodiments for a resistor array. The resistor array includes a plurality of resistor elements, where the plurality of resistor elements includes a redundancy region for a most significant bit of an expected value. The resistor array also includes one or more switches coupled to the plurality of resistor elements, and a first terminal and a second terminal coupled to the plurality of resistor elements. Also provided are embodiments for trimming the resistor array where the resistor array includes a redundancy region for a most significant bit for an expected value.
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公开(公告)号:US10782315B2
公开(公告)日:2020-09-22
申请号:US15489166
申请日:2017-04-17
Applicant: Rosemount Aerospace Inc.
Inventor: Jim Golden , David P. Potasek , Marcus Allen Childress
Abstract: A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.
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公开(公告)号:US20180299482A1
公开(公告)日:2018-10-18
申请号:US15489166
申请日:2017-04-17
Applicant: Rosemount Aerospace Inc.
Inventor: Jim Golden , David P. Potasek , Marcus Allen Childress
Abstract: A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.
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公开(公告)号:US09963341B2
公开(公告)日:2018-05-08
申请号:US14716515
申请日:2015-05-19
Applicant: Rosemount Aerospace Inc.
Inventor: David P. Potasek , Robert Stuelke
IPC: B81B7/00
CPC classification number: B81B7/0058 , B81B7/0048 , B81B2207/015 , H01L2224/48247
Abstract: A sensor package includes a manifold and a MEMS die. The manifold includes a cylindrical body, a flange, and a mounting surface. The cylindrical body defines a first passage that extends longitudinally along a central axis from a first exterior end to an interior end of the cylindrical body. The flange extends from the cylindrical body and has an outer periphery that is configured to support a print circuit board. The mounting surface is disposed at the interior end of the first passage. The surface area of the mounting surface is less than the surface area of a MEMS die configured to mate with the mounting surface.
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公开(公告)号:US09878904B1
公开(公告)日:2018-01-30
申请号:US15333810
申请日:2016-10-25
Applicant: Rosemount Aerospace Inc.
Inventor: David P. Potasek
CPC classification number: B81C3/001 , B81B3/0021 , B81B2201/0264 , B81B2207/012 , B81B2207/07 , B81C2201/013 , B81C2201/019 , B81C2203/0172 , G01L9/0042 , G01L19/148
Abstract: A MEMS device with electronics integration places integrated circuit components on a topping wafer of a sensing die to conserve space, minimize errors and reduce cost of the device as a whole. The topping wafer is bonded to a sensing wafer and secured in a housing.
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公开(公告)号:US20160052784A1
公开(公告)日:2016-02-25
申请号:US14467234
申请日:2014-08-25
Applicant: Rosemount Aerospace Inc.
Inventor: David P. Potasek
CPC classification number: B81C1/00873 , B81B7/0048 , B81B7/0061 , B81C1/00492
Abstract: A MEMS sensor includes a sensor die configured to generate a sensor signal and a pedestal layer disposed on the sensor die. The pedestal layer includes a channel defined therein about a pedestal of the pedestal layer. The pedestal is configured to be mounted to a housing. A method for manufacturing MEMS sensors can include disposing a pedestal layer on a sensor layer, wherein the sensor layer defines a plurality of sensor dies to be cut therefrom. The method further includes defining a respective channel in the pedestal layer for each sensor die, thereby creating a pedestal for each sensor die.
Abstract translation: MEMS传感器包括被配置为产生传感器信号的传感器管芯和设置在传感器管芯上的基座层。 基座层包括围绕基座层的基座限定的通道。 基座被构造成安装到壳体。 用于制造MEMS传感器的方法可以包括在传感器层上设置基座层,其中传感器层限定要从其切割的多个传感器管芯。 该方法还包括为每个传感器模具定义基座层中的相应通道,从而为每个传感器模具创建基座。
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公开(公告)号:US11703399B2
公开(公告)日:2023-07-18
申请号:US17212692
申请日:2021-03-25
Applicant: Rosemount Aerospace Inc.
Inventor: David P. Potasek , Richard William Phillips
CPC classification number: G01K13/024 , G01K1/026 , G01K7/16 , G01K1/20 , G01K3/14 , G01K7/02 , G01K7/18 , G01K7/427
Abstract: A temperature sensor assembly for measuring a gas temperature in a gas flow stream includes a first substrate having a first surface configured to be connected to a thermally conductive structure in a gas path, a first temperature sensor mounted to the first substrate a first distance from the first surface, and a second temperature sensor mounted to the first substrate a second distance from the first surface. The second distance is less than the first distance. The first and second temperature sensors are arranged along a temperature gradient.
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公开(公告)号:US20220316971A1
公开(公告)日:2022-10-06
申请号:US17217254
申请日:2021-03-30
Applicant: Rosemount Aerospace Inc.
Inventor: David P. Potasek , Ulf J. Jonsson
Abstract: A pressure sensor includes a housing, an isolator positioned at a first end of the housing, and a first cavity formed between the first end of the housing and the isolator. The pressure sensor further includes a second cavity formed in the housing and a channel with a first end fluidly connected to the first cavity and a second end fluidly coupled to the second cavity. A pressure sensor chip is positioned in the second cavity and includes a first diaphragm positioned at a top side of the pressure sensor chip laterally outwards from the second end of the channel.
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公开(公告)号:US11099093B2
公开(公告)日:2021-08-24
申请号:US16536486
申请日:2019-08-09
Applicant: Rosemount Aerospace Inc.
Inventor: David P. Potasek , Roger Alan Backman
Abstract: A micromechanical pressure sensor for measuring a pressure differential includes a diaphragm having an inner region and two edge regions, one opposite the other with respect to the inner region. Two or more piezoresistive resistance devices are on the diaphragm, at least one in each of the inner and edge region, and are configured to be electrically connected in a bridge circuit. The micromechanical pressure sensor is configured so that an operating temperature of the one or more piezoresistive resistance devices in the inner region is substantially the same as an operating temperature of the one or more piezoresistive resistance devices in at least one of the edge regions throughout a full operating range such that an error of the micromechanical pressure sensor output resulting from self-heating is less than if the micromechanical pressure sensor were not configured to maintain the operating temperatures substantially the same.
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公开(公告)号:US11092504B2
公开(公告)日:2021-08-17
申请号:US16418719
申请日:2019-05-21
Applicant: Rosemount Aerospace Inc.
Inventor: Michael Robert Daup , David P. Potasek
Abstract: A micromechanical piezoresistive pressure sensor includes a diaphragm configured to mechanically deform in response to an applied load, a sensor substrate located on the diaphragm, and a number of piezoresistive resistance devices located on the sensor substrate. The piezoresistive resistance devices are arranged in a first planar array defining a grid pattern having two or more rows, each row being aligned in a first direction. The piezoresistive resistance devices are configured to be electrically connected in a number of bridge circuits, whereby the piezoresistive resistance devices in each row is electrically connected in an associated bridge circuit. A method of using the micromechanical piezoresistive pressure sensor is also disclosed.
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